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公开(公告)号：US06748131B2
公开(公告)日：2004-06-08
申请号：US09860825
申请日：2001-05-21
IPC分类号： G02B626
CPC分类号： G02B6/3506 , G02B6/266 , G02B6/32 , G02B6/3508 , G02B6/3546 , G02B6/3548 , G02B6/3564 , G02B6/3594 , G02B6/3598 , G02B6/3636 , G02B6/3692 , G02B6/423
摘要： A first waveguide holding member has a first transverse surface region and a first optical waveguide having an end terminating at the first transverse surface region. A second waveguide holding member has a second transverse surface region which confronts the first transverse surface region of the first waveguide holding member and a second optical waveguide having an end terminating at the second transverse surface region. A guide member is operatively coupled to the first and second waveguide holding members and guides the first waveguide holding member in a transverse direction relative to the second waveguide holding member so as to selectively optically couple and decouple the ends of the first and second optical waveguides.
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公开(公告)号：US5550088A
公开(公告)日：1996-08-27
申请号：US71427
申请日：1993-06-02
IPC分类号： G02B6/13 , G02B6/30 , G02B6/32 , G02B6/36 , G02B6/42 , H01L21/306 , H01L21/308 , H01S5/026 , H01L21/302
CPC分类号： G02B6/32 , G02B6/3692 , G02B6/4292 , H01L21/306 , H01L21/308 , H01L21/3085 , G02B6/3652
摘要： A method is disclosed for forming a self-aligned optical subassembly for supporting an optical fiber and associated optical component(s). In particular, sequential masking layer/silicon substrate etch operations are performed so as to etch, in series, the largest opening first and the narrowest opening last. By following this procedure, axial alignment between tandem grooves is maintained.
摘要翻译： 公开了用于形成用于支撑光纤和相关联的光学部件的自对准光学子组件的方法。 特别地，执行顺序掩模层/硅衬底蚀刻操作，以便串联蚀刻最大的开口第一和最窄的开口。 通过遵循该过程，保持串联槽之间的轴向对准。
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公开(公告)号：US5472886A
公开(公告)日：1995-12-05
申请号：US364368
申请日：1994-12-27
CPC分类号： H01L33/38 , H01L33/0062 , H01L2224/48091 , H01L2224/73265 , H01L2933/0016 , H01L33/40
摘要： An LED has both its p and n bonding pads on the p side of the wafer for simultaneous solder bump alignment and electrical connection of the LED with a device carrier. A groove is formed dividing the p material of the device into an active region and an inactive region. The groove also provides a path for the device's n-contact, which extends from the n-material at the base of the groove, up the side of the groove, to the n bonding pad on the surface of the inactive p material.
摘要翻译： LED在晶片的p侧具有p和n个键合焊盘，用于同时焊接凸块对准以及LED与器件载体的电连接。 形成将器件的p材料分成有源区和非活性区的沟槽。 凹槽还为器件的n接触提供了一条路径，该路径从凹槽底部的n-材料向上延伸到凹槽的表面上的n焊盘。
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公开(公告)号：US5380551A
公开(公告)日：1995-01-10
申请号：US065518
申请日：1993-05-21
IPC分类号： C03C4/00 , C03C17/245 , C04B41/81 , C04B41/82 , C23C16/44 , C23C16/458 , G02B1/10 , G02B1/11 , B05D5/06 , B05C13/00 , C23C16/40
CPC分类号： G02B1/11 , C23C16/458 , G02B5/0808
摘要： A method for providing an essentially uniform coating over the outer surface of an article of manufacture. In particular, a vapor deposition process is disclosed for coating relatively small articles, such as spheres which may be used as lenses in optical systems. The coating may comprise an anti-reflective or alternatively, reflective, material.
摘要翻译： 一种用于在制品的外表面上提供基本上均匀的涂层的方法。 特别地，公开了一种用于涂覆较小物品的气相沉积工艺，例如可用作光学系统中的透镜的球体。 涂层可以包括抗反射或可选择的反射材料。
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公开(公告)号：US4861126A
公开(公告)日：1989-08-29
申请号：US190721
申请日：1988-05-05
IPC分类号： G02B6/13 , G02F1/035 , G02F1/313 , H01L21/322
CPC分类号： G02F1/035 , G02B6/13 , H01L21/3221 , G02F1/3132 , G02F2201/066 , G02F2203/21
摘要： Ionic drift in integrated optical devices is reduced by the utilization of a gettering layer interposed between the surface dielectric and the electrodes. The material used to form this layer is capable of gettering the mobile ions at a relatively low temperature (for example
摘要翻译： 集成光学器件中的离子漂移通过利用介于表面电介质和电极之间的吸杂层来减少。 用于形成该层的材料能够在相对低的温度（例如<600℃）下吸收移动离子。
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公开(公告)号：US08399897B2
公开(公告)日：2013-03-19
申请号：US11503023
申请日：2006-08-11
IPC分类号： H01L33/00
CPC分类号： G02B6/423 , G02B6/30 , G02B6/3636 , G02B6/3652 , G02B6/3692 , G02B6/4201 , G02B6/4204 , G02B6/421 , G02B6/4232 , G02B6/4243 , G02B6/4251
摘要： An optical device package includes a substrate having an upper surface, a distal end, a proximal end, and distal and proximal longitudinally extending notches co-linearly aligned with each other. A structure is mounted to the substrate and has at least one recessed portion. The structure can be a lid or a frame to which a lid is bonded. An optical fiber is positioned within at least one of the proximal longitudinally extending notch and the distal longitudinally extending notch and within the recessed portion of the structure mounted to the substrate. The optical device package can also include conductive legs extending upwardly from bonding pads on the upper surface of the substrate to facilitate flip mounting of the optical device package onto a circuit board or other such platform.
摘要翻译： 光学器件封装包括具有上表面，远端，近端以及彼此共线直线对准的远侧和近端纵向延伸的凹口的衬底。 一种结构被安装到基底上并具有至少一个凹进部分。 该结构可以是盖子或盖子被结合到其上的框架。 光纤被定位在近端纵向延伸凹口和远侧纵向延伸凹口中的至少一个中，并且位于安装到基底的结构的凹陷部分内。 光学器件封装还可以包括从衬底的上表面上的焊盘向上延伸的导电腿，以便将光学器件封装翻转安装到电路板或其它这样的平台上。
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公开(公告)号：US07267781B2
公开(公告)日：2007-09-11
申请号：US10871689
申请日：2004-06-02
CPC分类号： G02B5/284
摘要： A method of fabricating optical filter is disclosed. The method includes providing the substrate and selectively etching the substrate to form a plurality of freestanding layers. A plurality of dielectric layers is disposed over an outer surface of each of the freestanding layers. The resultant optical filters may be used in a variety of applications including etalon applications.
摘要翻译： 公开了一种制造滤光器的方法。 该方法包括提供衬底并选择性地蚀刻衬底以形成多个独立层。 多个电介质层设置在每个独立层的外表面上。 所得到的光学滤波器可以用于各种应用，包括标准具应用。
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公开(公告)号：US07068870B2
公开(公告)日：2006-06-27
申请号：US09983984
申请日：2001-10-26
申请人： Dan A. Steinberg , Neal Ricks , Mindaugas F. Dautartas , Hui Luo
发明人： Dan A. Steinberg , Neal Ricks , Mindaugas F. Dautartas , Hui Luo
CPC分类号： G02B6/132 , G02B6/10 , G02B6/122 , G02B6/1228 , G02B6/305 , G02B2006/1215 , G02B2006/12173 , G02B2006/12176 , G02B2006/12195
摘要： A variable width waveguide useful for mode matching between dissimilar optical waveguides and optical fibers and a method for making the same is described. In one embodiment, a tapered waveguide is etched in a substrate, a cladding material is laid over the upper surface of the substrate and within the waveguide, and the waveguide is then filled with a core material. The core material may be deposited in a single step, or in successive deposition steps.
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公开(公告)号：US06927492B2
公开(公告)日：2005-08-09
申请号：US10925410
申请日：2004-08-25
CPC分类号： H01L24/13 , B23K35/007 , B23K35/28 , B23K35/30 , B23K35/3013 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01032 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H05K3/3463 , H01L2924/00
摘要： A device including a first solder pad and a second solder pad comprised of a post-soldering alloy composition on a substrate is provided. The alloy composition comprises two or more elements, and the post soldering alloy composition of the first solder pad has different amounts of the two or more elements than the alloy composition of the second solder pad. A method of making a solder pad comprises masking a substrate comprising at least a first solder pad and a second solder pad, wherein the mask exposes a greater area of the first solder pad so that the deposited element becomes part of an alloy composition of the first solder pad upon soldering thereby changing the melting point of the first solder pad.
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公开(公告)号：US06917056B2
公开(公告)日：2005-07-12
申请号：US10066299
申请日：2002-01-31
CPC分类号： G02B6/3636 , G02B6/3652 , G02B6/3692 , G02B6/4228 , H01L31/02325 , H01S5/02252 , H01S5/02284
摘要： An optoelectronic submount for providing optical connection and electrical connection to a vertically communicating optical device, such as a vertical cavity surface-emitting laser. The submount has a trench for holding the optoelectronic device on-edge, and electrical connection pits adjoining the trench. A metallization layer is disposed in the electrical connection pits. The electrical connection pits are aligned with the trench and optoelectronic device so that compact pads on the optoelectronic device can be soldered to the metallization layer. A groove can be provided in the submount for holding an optical fiber in alignment with an active area of the optoelectronic device.
摘要翻译： 一种光电子基座，用于提供与竖直连通的光学装置（例如垂直腔表面发射激光器）的光学连接和电连接。 底座具有用于将光电子器件保持在边缘上的沟槽，并且与沟槽相邻的电连接凹坑。 金属化层设置在电连接凹坑中。 电连接凹坑与沟槽和光电子器件对准，使得光电子器件上的紧凑焊盘可以焊接到金属化层。 可以在底座中设置一个槽，用于保持与光电子器件的有效区域对准的光纤。
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