公开(公告)号：US08492902B2

公开(公告)日：2013-07-23

申请号：US13049661

申请日：2011-03-16

申请人： Ho-Jin Lee ,  SeYoung Jeong ,  Jae-hyun Phee ,  Jung-Hwan Kim ,  Tae Hong Min

发明人： Ho-Jin Lee ,  SeYoung Jeong ,  Jae-hyun Phee ,  Jung-Hwan Kim ,  Tae Hong Min

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L21/76898 ,  H01L21/76831 ,  H01L23/481 ,  H01L25/105 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/00014

摘要： Provided is a semiconductor device. The semiconductor device may include a substrate and a stacked insulation layer on a sidewall of an opening which penetrates the substrate. The stacked insulation layer can include at least one first insulation layer and at least one second insulation layer whose dielectric constant is different than that of the first insulation layer. One insulation layer may be a polymer and one insulation layer may be a silicon based insulation layer. The insulation layers may be uniform in thickness or may vary as a distance from the substrate changes.

摘要翻译： 提供一种半导体器件。 半导体器件可以包括衬底和在穿透衬底的开口的侧壁上的层叠绝缘层。 层叠绝缘层可以包括至少一个第一绝缘层和至少一个第二绝缘层，其介电常数不同于第一绝缘层的介电常数。 一个绝缘层可以是聚合物，一个绝缘层可以是硅基绝缘层。 绝缘层的厚度可以是均匀的，或者可以随着离开衬底的距离而改变。

公开(公告)号：US08433293B2

公开(公告)日：2013-04-30

申请号：US12447886

申请日：2007-11-08

申请人： Ho-Jin Lee

发明人： Ho-Jin Lee

IPC分类号： H04L12/58

CPC分类号： H04L67/26 ,  H04L67/04 ,  H04L69/16 ,  H04L69/162 ,  H04L69/164

摘要： The present invention relates to an apparatus and method of providing a content push service, a mobile terminal, and a method of operating a mobile terminal. According to an exemplary embodiment of the present invention, a user datagram protocol (UDP) port is set between the mobile terminal and a content push service providing server. In addition, the mobile terminal drives an application that receives the content push service through the set user datagram protocol (UDP) port, by the request of the content push service providing server. The mobile terminal receives the content push service from the content push service providing server through the driven application. Accordingly, it is not necessary to select a specific identifier for each of existing applications and recognize a specific identifier for each node of the mobile communication network.

摘要翻译： 本发明涉及提供内容推送服务，移动终端和操作移动终端的方法的装置和方法。 根据本发明的示例性实施例，在移动终端和内容推送服务提供服务器之间设置用户数据报协议（UDP）端口。 此外，通过内容推送服务提供服务器的请求，移动终端通过设置的用户数据报协议（UDP）端口来驱动接收内容推送服务的应用。 移动终端通过驱动应用从内容推送服务提供服务器接收内容推送服务。 因此，不需要为每个现有应用选择特定的标识符并且识别移动通信网络的每个节点的特定标识符。

公开(公告)号：US08346962B2

公开(公告)日：2013-01-01

申请号：US13025911

申请日：2011-02-11

申请人： Jang-Won Lee ,  Ho-Jin Lee ,  Sang-Man Bak

发明人： Jang-Won Lee ,  Ho-Jin Lee ,  Sang-Man Bak

IPC分类号： G06F15/173

CPC分类号： H04L65/1006 ,  H04L29/06027 ,  H04L29/12367 ,  H04L29/12528 ,  H04L29/12556 ,  H04L61/2514 ,  H04L61/2575 ,  H04L61/2585 ,  H04L65/103 ,  H04L65/104 ,  H04L65/1043

摘要： Disclosed are examples of an interworking system and related methods. The interworking system can be configured to implement a session initiation protocol (SIP) message routing method that may include checking a transmitting subject and a transmission method of a SIP message, applying a network address translation based on the checked message's transmitting subject and its transmission method, and specifying the address of the node selected based on the checked message's transmitting subject in routing path information.

摘要翻译： 公开了互通系统和相关方法的示例。 互通系统可以被配置为实现会话发起协议（SIP）消息路由方法，该方法可以包括检查发送对象和SIP消息的发送方法，基于所检查的消息的发送对象及其发送方法应用网络地址转换 并且基于所检查的消息的发送对象在路由路径信息中指定选择的节点的地址。

公开(公告)号：US08289208B2

公开(公告)日：2012-10-16

申请号：US12664053

申请日：2008-05-08

申请人： Bon-Jun Ku ,  Do-Seob Ahn ,  Ho-Jin Lee

发明人： Bon-Jun Ku ,  Do-Seob Ahn ,  Ho-Jin Lee

IPC分类号： H04B7/185 ,  H04B1/00

CPC分类号： H04B7/10

摘要： Provided is a device for tracking polarizations. A receiving polarization tracking device includes a feeder for finding vertical and horizontal vector components by receiving vertical and horizontal polarizations, a polarization estimator for estimating distortion of polarizations using the vertical and horizontal vector components outputted from the feeder, a polarization controller for controlling amplitudes and phases of vertical and horizontal polarizations based on information about the estimated distortion from the polarization estimator and an output signal from the receiving polarization tracking device, and a combiner for combining the vertical and horizontal polarizations controlled from the polarization controller.

摘要翻译： 提供了用于跟踪偏振的装置。 接收偏振跟踪装置包括：通过接收垂直和水平偏振来发现垂直和水平矢量分量的馈线，用于使用从馈线输出的垂直和水平矢量分量估计极化失真的偏振估计器，用于控制幅度和相位的偏振控制器 基于关于来自极化估计器的估计失真的信息和来自接收偏振跟踪装置的输出信号的垂直和水平偏振的组合器，以及用于组合从偏振控制器控制的垂直和水平极化的组合器。

公开(公告)号：US08232644B2

公开(公告)日：2012-07-31

申请号：US13346191

申请日：2012-01-09

申请人： Hyun-Soo Chung ,  Ho-Jin Lee ,  Dong-Hyun Jang ,  Dong-Ho Lee

发明人： Hyun-Soo Chung ,  Ho-Jin Lee ,  Dong-Hyun Jang ,  Dong-Ho Lee

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/13025 ,  H01L2224/274 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01079 ,  H01L2924/01087

摘要： In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

摘要翻译： 在具有应力消除间隔物的半导体器件封装及其制造方法中，从芯片本体延伸的金属互连指状物提供芯片互连。 金属手指通过应力消除间隔物与芯片的主体隔离。 在一个示例中，这种隔离采取气隙的形式。 在另一个实例中，这种隔离采用弹性体材料的形式。 在这两种情况下，都避免了金属互连指和芯体之间的热膨胀系数的不匹配，从而减轻了与开裂和分层相关的问题，从而提高了器件的产量和器件的可靠性。

公开(公告)号：US08155041B2

公开(公告)日：2012-04-10

申请号：US12186670

申请日：2008-08-06

申请人： Hyun-Ha Hong ,  Ki-Seop Han ,  Dae-Ig Chang ,  Ho-Jin Lee

发明人： Hyun-Ha Hong ,  Ki-Seop Han ,  Dae-Ig Chang ,  Ho-Jin Lee

IPC分类号： H04W36/32

CPC分类号： H04L12/66 ,  H04W36/0016 ,  H04W36/14 ,  H04W40/36 ,  H04W80/04 ,  H04W84/005

摘要： Provided is a method for handover between heterogeneous networks using a link trigger signal in a multi-interface mobile router. The method includes: maintaining a state of a second network access interface in a sleep state, activating a first network access interface, receiving and transmitting the first network service to a subordinate node in the mobile router located in a first network; when the mobile router senses a second network link-up trigger signal while moving to the second network, changing the state of the second network access interface into an active state and performing handover; and receiving a second network service through the activated second network access interface in the mobile router performing the handover and transmitting the second network service to the subordinate node.

摘要翻译： 提供了一种使用多接口移动路由器中的链路触发信号在异构网络之间切换的方法。 该方法包括：将第二网络接入接口的状态保持在睡眠状态，激活第一网络接入接口，将第一网络服务接收并发送到位于第一网络中的移动路由器中的下级节点; 当移动路由器在移动到第二网络时感测到第二网络链接触发信号，将第二网络接入接口的状态改变为活动状态并执行切换; 以及通过执行切换的移动路由器中的激活的第二网络接入接口接收第二网络服务，并将第二网络服务发送到下级节点。

公开(公告)号：US20120056330A1

公开(公告)日：2012-03-08

申请号：US13186049

申请日：2011-07-19

申请人： Ho-Jin Lee ,  Sung-Dong Cho ,  Se-Young Jeong ,  Yeong-Lyeol Park ,  Sin-Woo Kang

发明人： Ho-Jin Lee ,  Sung-Dong Cho ,  Se-Young Jeong ,  Yeong-Lyeol Park ,  Sin-Woo Kang

IPC分类号： H01L23/48

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2924/15311

摘要： A semiconductor device may include a substrate and a through electrode. The substrate may have a first surface and a second surface opposite to the first surface, the substrate including circuit patterns formed on the first surface. The through electrode penetrates the substrate and may be electrically connected to the circuit pattern, the through electrode including a first plug that extends from the first surface in a thickness direction of the substrate and a second plug that extends from the second surface in the thickness direction of the substrate so as to be connected to the first plug.

摘要翻译： 半导体器件可以包括衬底和通孔。 衬底可以具有与第一表面相对的第一表面和第二表面，所述衬底包括形成在第一表面上的电路图案。 贯通电极穿透基板并且可以电连接到电路图案，所述通孔包括在基板的厚度方向上从第一表面延伸的第一插塞和在厚度方向上从第二表面延伸的第二插塞 以便连接到第一插头。

公开(公告)号：US08119448B2

公开(公告)日：2012-02-21

申请号：US12817304

申请日：2010-06-17

申请人： Son-Kwan Hwang ,  In-Young Lee ,  Ho-Jin Lee ,  Dong-Hyeon Jang

发明人： Son-Kwan Hwang ,  In-Young Lee ,  Ho-Jin Lee ,  Dong-Hyeon Jang

IPC分类号： H01L21/00

CPC分类号： H01L24/11 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/11902 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/9201 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/10329 ,  H01L2224/05552

摘要： A semiconductor chip comprises a substrate including a front surface and a rear surface, the substrate having a first via hole formed in the front surface and a second via hole formed in the rear surface, a first conductive plug formed on the substrate, the first conductive plug including a first portion formed in the first via hole and a second portion protruding from the front surface of the substrate, and a second conductive plug formed on the first conductive plug, the second conductive plug having a smaller cross-sectional area than the first conductive plug.

摘要翻译： 一种半导体芯片，包括：具有前表面和后表面的基板，所述基板具有形成在所述前表面上的第一通孔和形成在所述后表面中的第二通孔，形成在所述基板上的第一导电塞，所述第一导电 所述插头包括形成在所述第一通孔中的第一部分和从所述基板的前表面突出的第二部分，以及形成在所述第一导电插塞上的第二导电插塞，所述第二导电插塞具有比所述第一通孔更小的横截面积 导电插头

公开(公告)号：US07830017B2

公开(公告)日：2010-11-09

申请号：US11950251

申请日：2007-12-04

申请人： In-Young Lee ,  Dong-Ho Lee ,  Nam-Seog Kim ,  Hyun-Soo Chung ,  Ho-Jin Lee ,  Myeong-Soo Park

发明人： In-Young Lee ,  Dong-Ho Lee ,  Nam-Seog Kim ,  Hyun-Soo Chung ,  Ho-Jin Lee ,  Myeong-Soo Park

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/525 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

摘要： Provided are a wafer level chip scale package in which a redistribution process is applied at a wafer level, a manufacturing method thereof, and a semiconductor chip module including the wafer level chip scale package. The wafer level chip scale package includes a semiconductor chip having a bonding pad, a first insulating layer disposed on the semiconductor chip so as to expose the bonding pad, a redistribution line disposed on the exposed bonding pad and the first insulating layer, a sacrificial layer disposed below a redistribution pad of the redistribution line, a second insulating layer disposed on the redistribution line so as to expose the redistribution pad and including a crack inducement hole disposed beside the sacrificial layer, and an external connection terminal attached to the redistribution pad.

摘要翻译： 提供了其中在晶片级应用再分配处理的晶片级芯片级封装，其制造方法以及包括晶片级芯片级封装的半导体芯片模块。 晶片级芯片级封装包括具有接合焊盘的半导体芯片，设置在半导体芯片上以暴露焊盘的第一绝缘层，设置在暴露的焊盘和第一绝缘层上的再分配线，牺牲层 设置在所述再分配线的再分配衬垫的下方，设置在所述再分配线上的第二绝缘层，以暴露所述再分配衬垫并且包括设置在所述牺牲层旁边的裂纹诱导孔，以及附接到所述再分布衬垫的外部连接端子。

公开(公告)号：US07801101B2

公开(公告)日：2010-09-21

申请号：US10892679

申请日：2004-07-15

申请人： Minsu Shin ,  Joon-Gyu Ryu ,  Hoon Jeong ,  Ho-Jin Lee

发明人： Minsu Shin ,  Joon-Gyu Ryu ,  Hoon Jeong ,  Ho-Jin Lee

IPC分类号： H04B7/216

CPC分类号： H04B7/18513 ,  H04L1/0003 ,  H04L1/0009 ,  H04W4/18 ,  H04W84/06

摘要： Provided are a forward link rain attenuation compensating apparatus using an adaptive transmission scheme in an interactive satellite communication system and a method thereof. The apparatus separates the mobile stations into clear-sky mobile stations and mobile stations in the state of rain attenuation and makes the clear-sky mobile stations receive data having a high data transmission efficiency at a high-speed while making the rain attenuation mobile stations receive the data continuously although the data transmit rate is low by making each of the two kinds of mobile stations receive data frames of a different transmission method, and provides a method therefor. The apparatus includes: a resource manager, a transmitting data format converter, a forward modulator, a backward demodulator, a receiving data format converter.

摘要翻译： 提供一种在交互式卫星通信系统中使用自适应传输方案的前向链路雨衰补偿装置及其方法。 该装置将移动台分为处于雨衰状态的空中移动台和移动台，使得天空清空的移动台高速接收高数据传输效率的数据，同时使雨衰移移动站接收 通过使两种移动站中的每一个接收到不同的传输方式的数据帧，数据传输速率是低的，并且提供了一种方法。 该装置包括：资源管理器，发送数据格式转换器，前向调制器，反向解调器，接收数据格式转换器。