Photo-curable resist resin composition for electroless plating, process
for preparing a printed circuit board with the said resist resin
composition and a printed circuit board having resist prepared from the
said resist resin composition
    33.
    发明授权
    Photo-curable resist resin composition for electroless plating, process for preparing a printed circuit board with the said resist resin composition and a printed circuit board having resist prepared from the said resist resin composition 失效
    用于化学镀的光固化抗蚀剂树脂组合物,用所述抗蚀树脂组合物制备印刷电路板的方法和具有由所述抗蚀树脂组合物制备的抗蚀剂的印刷电路板

    公开(公告)号:US4820549A

    公开(公告)日:1989-04-11

    申请号:US51518

    申请日:1987-05-19

    摘要: A photo-curable resist resin composition for electroless plating comprising an epoxy resin having a viscosity of at least 150 poises at 25.degree. C., and at least two glycidyl ether groups in one molecule, the glycidyl ether groups being directly bonded to the aromatic ring as Component A, an oxirane ring-containing compound having a boiling point of at least 140.degree. C. and a molecular weight of not more than 500 as Component B, and a photo-sensitive aromatic onium salt as Component C, wherein the Component A is in an amount of 90 to 40 parts by weight per total 100 parts by weight of the Components A and B, and the Component C is in an amount of 0.1 to 5 parts by weight per total 100 parts by weight of the Components A and B, and, if any, other resin components, can produce a resist film capable of withstanding highly alkaline electroless copper plating solution at a high temperature for a long time without any decrease in the physical properties of plating films deposited even by repeated use of the electroless copper plating solution. The resist film prepared from the resist resin composition has distinguished soldering heat resistance, solvent resistance and electrical insulation.

    摘要翻译: 一种用于化学镀的光固化抗蚀剂树脂组合物,包括在25℃下具有至少150泊的粘度的环氧树脂和一个分子中的至少两个缩水甘油醚基团,缩水甘油醚基团直接键合到芳环上 作为组分A,作为组分B的沸点为至少140℃,分子量不超过500的含环氧乙烷环的化合物和作为组分C的感光芳族鎓盐,其中组分A 组分A和B的总量为每100重量份为90〜40重量份,组分C为0.1〜5重量份/ 100重量份的组分A和 B和任何其他树脂组分,可以在高温下长时间地产生能够耐受高碱性化学镀铜溶液的抗蚀剂膜,而不会通过重复沉积而沉积的电镀膜的物理性能降低 使用无电镀铜溶液。 由抗蚀剂树脂组合物制备的抗蚀剂膜具有显着的耐焊接耐热性,耐溶剂性和电绝缘性。

    Thermosetting resin composition and prepolymer obtained therefrom
    34.
    发明授权
    Thermosetting resin composition and prepolymer obtained therefrom 失效
    由此得到的热固性树脂组合物和预聚物

    公开(公告)号:US4752641A

    公开(公告)日:1988-06-21

    申请号:US42514

    申请日:1987-04-24

    CPC分类号: C08F222/40

    摘要: A thermosetting resin composition comprising (a) a polyfunctional maleimide, (b) at least one member selected from the group consisting of alkenylphenols and alkenylphenol ethers, and (c) an allyl ester of polyvalent carboxylic acid, or cyanuric or isocyanuric acid and a prepolymer obtained by preliminarily heating the thermosetting resin composition can be used as a solventless type varnish for impregnating, e.g. electric windings, or for preparing a prepreg, and can give a cured product with heating at 120.degree.-250.degree. C. having excellent heat resistance of class C (180.degree. C. or higher) and electrical insulating properties.

    摘要翻译: 一种热固性树脂组合物,其包含(a)多官能马来酰亚胺,(b)至少一种选自烯基酚和链烯基酚醚的成员,和(c)多元羧酸的烯丙酯或氰尿酸或异氰脲酸和预聚物 通过预热加热所得到的热固性树脂组合物可以用作无溶剂型浸渍剂,例如, 电热绕组或制备预浸料,并可在120〜250℃下加热固化产物,具有优异的C级耐热性(180℃或更高)和电绝缘性能。

    Thermosetting resin composition
    37.
    发明授权
    Thermosetting resin composition 失效
    热固性树脂组合物

    公开(公告)号:US3984373A

    公开(公告)日:1976-10-05

    申请号:US455408

    申请日:1974-03-27

    摘要: An epoxy resin composition containing an N,N'-unsaturated amic acid compound represented by the general formula, HOCO--R.sub.2 --CONH--R.sub.1 --Y, wherein R.sub.1 is a divalent group having 2 or more carbon atoms, R.sub.2 is a divalent group having a carbon-to-carbon double bond, and Y is ##EQU1## or --NHCO--R.sub.2 --COOH. The composition is characterized, by being favorable in curing characteristics, heat resistance, and flame retardance.

    摘要翻译: 含有由通式HOCO-R2-CONH-R1-Y表示的N,N'-不饱和酰胺酸化合物的环氧树脂组合物,其中R 1是具有2个或更多个碳原子的二价基团,R 2是具有 碳 - 碳双键,Y是CO-AN角-22 CO或-NHCO-R2-COOH。 该组合物的特征在于有利于固化特性,耐热性和阻燃性。