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52 条记录 (耗时 0.021 秒)

    Optoelectronic Component
    34.
    发明申请
    Optoelectronic Component 审中-公开
    光电元件

    公开(公告)号：US20080265268A1

    公开(公告)日：2008-10-30

    申请号：US12064939

    申请日：2006-08-24

    申请人： Bert Braune ,  Herbert Brunner ,  Kirstin Petersen ,  Jorg Strauss

    发明人： Bert Braune ,  Herbert Brunner ,  Kirstin Petersen ,  Jorg Strauss

    IPC分类号： H01L33/00

    CPC分类号： H01L33/507 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An optoelectronic component is described, comprising a semiconductor body that emits electromagnetic radiation of a first wavelength when the optoelectronic component is in operation, and a separate optical element disposed spacedly downstream of the semiconductor body in its radiation direction. The optical element comprises at least one first wavelength conversion material that converts radiation of the first wavelength to radiation of a second wavelength different from the first.

    摘要翻译： 描述了一种光电子部件，包括当光电子部件运行时发射第一波长的电磁辐射的半导体本体，以及沿着其辐射方向间隔地设置在半导体本体的下游的单独的光学元件。 光学元件包括将第一波长的辐射转换成不同于第一波长的第二波长的辐射的至少一个第一波长转换材料。

    Method and device for producing a parylene coating
    35.
    发明授权
    Method and device for producing a parylene coating 有权
    用于生产聚对二甲苯涂层的方法和装置

    公开(公告)号：US08883268B2

    公开(公告)日：2014-11-11

    申请号：US13583755

    申请日：2011-03-08

    申请人： Bert Braune ,  Christina Keith ,  Ivan Galesic

    发明人： Bert Braune ,  Christina Keith ,  Ivan Galesic

    IPC分类号： B05D1/00 ,  B05D3/14 ,  H01L51/52

    CPC分类号： B05D1/60 ,  B05D1/62 ,  B05D3/142 ,  H01L51/5253

    摘要： A method of producing a parylene coating on at least one surface of at least one component includes providing a first gas containing parylene monomers and depositing the parylene monomers on the at least one surface of the component by supplying the first gas containing the parylene monomers by a first nozzle to the at least one surface, wherein the component is disposed in an environment at atmospheric pressure.

    摘要翻译： 在至少一种组分的至少一个表面上生产聚对二甲苯涂层的方法包括提供含有聚对二甲苯单体的第一气体，并通过将含有聚对二甲苯单体的第一气体通过 第一喷嘴到所述至少一个表面，其中所述部件设置在大气压的环境中。

    Optoelectronic Module having a Carrier Substrate and a Plurality of Radiation-Emitting Semiconductor Components and Method for the Production Thereof
    37.
    发明申请
    Optoelectronic Module having a Carrier Substrate and a Plurality of Radiation-Emitting Semiconductor Components and Method for the Production Thereof 有权
    具有载体基板和多个辐射发射半导体元件的光电模块及其制造方法

    公开(公告)号：US20110309377A1

    公开(公告)日：2011-12-22

    申请号：US13121128

    申请日：2009-08-25

    申请人： Bert Braune ,  Jörg Erich Sorg ,  Walter Wegleiter ,  Karl Weidner ,  Oliver Wutz

    发明人： Bert Braune ,  Jörg Erich Sorg ,  Walter Wegleiter ,  Karl Weidner ,  Oliver Wutz

    IPC分类号： H01L33/62

    CPC分类号： H01L33/62 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0753 ,  H01L2224/24105 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00

    摘要： An optoelectronic module is specified, comprising a carrier substrate (1) and a plurality of radiation-emitting semiconductor components (2). The carrier substrate (1) comprises structured conductor tracks. The radiation-emitting semiconductor components (2) each comprise an active layer (2a) suitable for generating electromagnetic radiation, a first contact area (21) and a second contact area (22), wherein the first contact area (21) is in each case arranged on that side of the radiation-emitting semiconductor components (2) which is remote from the carrier substrate (1). The radiation-emitting semiconductor components (2) are provided with an electrically insulating layer (4), which in each case has a cutout in a region of the first contact area (21). Conductive structures (8) are arranged in regions on the electrically insulating layer (4). One of the conductive structures (8) electrically conductively connects at least the first contact area (21) of a radiation-emitting semiconductor component (2) to a further first contact area (21) of a further radiation-emitting semiconductor component (2) or to a conductor track of the carrier substrate (1). Furthermore, a method for producing such a module is specified.

    摘要翻译： 规定了光电子模块，其包括载体衬底（1）和多个辐射发射半导体部件（2）。 载体基板（1）包括结构化的导体轨道。 辐射发射半导体部件（2）各自包括适于产生电磁辐射的有源层（2a），第一接触区域（21）和第二接触区域（22），其中第一接触区域（21）在每个 辐射发射半导体部件（2）的远离载体基板（1）的那一侧的情况。 辐射发射半导体部件（2）设置有电绝缘层（4），其在每种情况下在第一接触区域（21）的区域中具有切口。 导电结构（8）布置在电绝缘层（4）上的区域中。 导电结构（8）中的一个导电地将辐射发射半导体部件（2）的至少第一接触区域（21）导电连接到另外的辐射发射半导体部件（2）的另外的第一接触区域（21） 或载体衬底（1）的导体轨道。 此外，规定了这种模块的制造方法。

    Arrangement for Generating Mixed Light and Method for Producing Such an Arrangement
    38.
    发明申请
    Arrangement for Generating Mixed Light and Method for Producing Such an Arrangement 有权
    产生混合光的布置及其制作方法

    公开(公告)号：US20100019266A1

    公开(公告)日：2010-01-28

    申请号：US12523487

    申请日：2008-01-23

    申请人： Bert Braune ,  Gertrud Kraeuter

    发明人： Bert Braune ,  Gertrud Kraeuter

    IPC分类号： H01L33/00 ,  H01L21/50

    CPC分类号： H01L33/507 ,  H01L33/483 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An arrangement and a method for producing such an arrangement serve for generating mixed light. In this case, a semiconductor chip that emits an electromagnetic primary radiation has a luminescence conversion element in the beam path of the primary radiation. Furthermore, the arrangement includes a connecting element and a carrier element, wherein the carrier element carries and shapes the luminescence conversion element and the connecting element.

    摘要翻译： 用于制造这种布置的布置和方法用于产生混合光。 在这种情况下，发射电磁一次辐射的半导体芯片在一次辐射的光束路径中具有发光转换元件。 此外，该装置包括连接元件和载体元件，其中载体元件承载和成形发光转换元件和连接元件。

    Method for Producing an LED Light Source Comprising a Luminescence Conversion Element
    39.
    发明申请
    Method for Producing an LED Light Source Comprising a Luminescence Conversion Element 有权
    用于产生包含发光转换元件的LED光源的方法

    公开(公告)号：US20090197361A1

    公开(公告)日：2009-08-06

    申请号：US12421814

    申请日：2009-04-10

    申请人： Bert Braune ,  Herbert Brunner

    发明人： Bert Braune ,  Herbert Brunner

    IPC分类号： H01L21/56

    CPC分类号： H01L33/505 ,  H01L33/38 ,  H01L2224/11 ,  H01L2933/0016 ,  H01L2933/0041

    摘要： The invention describes a method for producing a light-emitting-diode (LED) light source, particularly comprising mixed-color LEDs, wherein at least a portion of primary radiation emitted by a chip is transformed by luminescence conversion. Said chip comprises a front-side (i.e., the side facing in the direction of radiation) electrical contact to whose surface a luminescence conversion material is applied in the form of a thin layer. Prior to coating, the front-side electrical contact is raised by the application of an electrically conductive material to the electrical contact surface. The method enables specific color coordinates to be adjusted selectively by monitoring the color coordinates (IEC chromaticity diagram) and thinning the layer of luminescence conversion material. In addition, the method is suited in particular for simultaneously producing a plurality of LED light sources from a multiplicity of similar chips in a wafer composite.

    摘要翻译： 本发明描述了一种用于制造发光二极管（LED）光源的方法，特别地包括混合彩色LED，其中由芯片发射的初级辐射的至少一部分通过发光转换而变换。 所述芯片包括前表面（即面向辐射方向的一侧）电接触，其表面以薄层的形式施加发光转换材料。 在涂覆之前，通过将导电材料施加到电接触表面来提高前侧电接触。 该方法通过监视颜色坐标（IEC色度图）和稀释发光转换材料层来选择性地调整特定的颜色坐标。 此外，该方法特别适用于从晶片复合材料中的多个类似的芯片同时制造多个LED光源。