公开(公告)号：US20090321116A1

公开(公告)日：2009-12-31

申请号：US12557076

申请日：2009-09-10

申请人： Motohiro Arifuku ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kouji Kobayashi ,  Kazuyoshi Kojima

发明人： Motohiro Arifuku ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kouji Kobayashi ,  Kazuyoshi Kojima

IPC分类号： H05K1/09 ,  H05K1/11 ,  H05K1/03

CPC分类号： H01L24/83 ,  C09J9/02 ,  C09J163/00 ,  H01B1/22 ,  H01L24/29 ,  H01L2224/04026 ,  H01L2224/05571 ,  H01L2224/26145 ,  H01L2224/2929 ,  H01L2224/29399 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/3452 ,  H05K2203/0594 ,  Y10T156/10 ,  Y10T428/2495 ,  Y10T428/2852 ,  Y10T428/2857 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2224/2919 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05552

摘要： The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 μm or greater but less than 10 μm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.

摘要翻译： 本发明是一种电路连接材料，用于将电路和绝缘层彼此相邻形成的电路部件的相互连接在基板的表面上，以及电路部件，其中电极和绝缘层邻近形成 彼此在板的表面上，边缘部分和绝缘层基于主表面形成比电极更大的厚度，其中该电路连接材料包含粘合剂组合物和具有 平均粒径为1μm以上且小于10μm，硬度为1.961〜6.865GPa，该电路连接材料在40℃下的储能弹性模量为0.5〜3GPa，平均热膨胀系数 当进行固化处理时，在25℃至100℃下为30-200ppm /℃。

公开(公告)号：US20060100314A1

公开(公告)日：2006-05-11

申请号：US10541380

申请日：2004-06-24

申请人： Motohiro Arifuku ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kouji Kobayashi ,  Kazuyoshi Kojima

发明人： Motohiro Arifuku ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kouji Kobayashi ,  Kazuyoshi Kojima

IPC分类号： C08K9/12

CPC分类号： H01L24/83 ,  C09J9/02 ,  C09J163/00 ,  H01B1/22 ,  H01L24/29 ,  H01L2224/04026 ,  H01L2224/05571 ,  H01L2224/26145 ,  H01L2224/2929 ,  H01L2224/29399 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/3452 ,  H05K2203/0594 ,  Y10T156/10 ,  Y10T428/2495 ,  Y10T428/2852 ,  Y10T428/2857 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2224/2919 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05552

摘要： The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 μm or greater but less than 10 μm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.

摘要翻译： 本发明是一种电路连接材料，用于将电路和绝缘层彼此相邻形成的电路部件的相互连接在基板的表面上，以及电路部件，其中电极和绝缘层邻近形成 彼此在板的表面上，边缘部分和绝缘层基于主表面形成比电极更大的厚度，其中该电路连接材料包含粘合剂组合物和具有 平均粒径为1μm以上且小于10μm，硬度为1.961〜6.865GPa，该电路连接材料在40℃下的储能弹性模量为0.5〜3GPa，平均热膨胀系数 当进行固化处理时，在25℃至100℃下为30-200ppm /℃。

公开(公告)号：US06818086B2

公开(公告)日：2004-11-16

申请号：US10276179

申请日：2002-11-14

申请人： Motohiro Arifuku ,  Hiroshi Yasuda ,  Itsuo Watanabe ,  Kouji Kobayashi ,  Isao Tsukagoshi

发明人： Motohiro Arifuku ,  Hiroshi Yasuda ,  Itsuo Watanabe ,  Kouji Kobayashi ,  Isao Tsukagoshi

IPC分类号： B32B3500

CPC分类号： H05K3/225 ,  H05K3/323 ,  H05K3/361 ,  Y10T29/49117 ,  Y10T29/49718 ,  Y10T29/49721

摘要： The present invention is to provide a method for removing adhesive in a short time without requiring any solvent, a repair of which has conventionally been required for a long time, and there is provided a method for repairing a circuit connection part where circuit members having a large number of opposed circuits are connected electrically through an adhesive, wherein mutual joints at a circuit connection part requiring repair are separated, a basic material for transfer is bonded through a transfer adhesive for transfer to at least one circuit member where the adhesive remains and then the adhesive remaining on the circuit member and the transfer adhesive are removed from the circuit member along with the basic material for transfer.

摘要翻译： 本发明提供一种在短时间内除去粘合剂的方法，而不需要任何长期以往需要修复的任何溶剂，并且提供了一种修复电路连接部分的方法，其中电路部件具有 大量的相对电路通过粘合剂电连接，其中需要修复的电路连接部分处的相互接合被分开，用于转移的基本材料通过转移粘合剂结合以转移到至少一个留下粘合剂的电路构件，然后 残留在电路构件上的粘合剂和转移粘合剂与转移用基材一起从电路构件中除去。

公开(公告)号：US08501045B2

公开(公告)日：2013-08-06

申请号：US13163382

申请日：2011-06-17

申请人： Motohiro Arifuku ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kouji Kobayashi ,  Kazuyoshi Kojima

发明人： Motohiro Arifuku ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kouji Kobayashi ,  Kazuyoshi Kojima

IPC分类号： H01B1/22 ,  C09J9/02 ,  H01R11/01 ,  H01L21/60 ,  H05K1/14

CPC分类号： H01L24/83 ,  C09J9/02 ,  C09J163/00 ,  H01B1/22 ,  H01L24/29 ,  H01L2224/04026 ,  H01L2224/05571 ,  H01L2224/26145 ,  H01L2224/2929 ,  H01L2224/29399 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/3452 ,  H05K2203/0594 ,  Y10T156/10 ,  Y10T428/2495 ,  Y10T428/2852 ,  Y10T428/2857 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2224/2919 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05552

摘要： The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 μm or greater but less than 10 μm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.

摘要翻译： 本发明是一种电路连接材料，用于将电路和绝缘层彼此相邻形成的电路部件的相互连接在基板的表面上，以及电路部件，其中电极和绝缘层邻近形成 彼此在板的表面上，边缘部分和绝缘层基于主表面形成比电极更大的厚度，其中该电路连接材料包含粘合剂组合物和具有 平均粒径为1μm以上且小于10μm，硬度为1.961〜6.865GPa，该电路连接材料在40℃下的储能弹性模量为0.5〜3GPa，平均热膨胀系数 当进行固化处理时，在25℃至100℃下为30-200ppm /℃。

公开(公告)号：US20090101279A1

公开(公告)日：2009-04-23

申请号：US12139306

申请日：2008-06-13

申请人： Motohiro Arifuki ,  Itsuo Watanabe ,  Kouji Motomura ,  Kouji Kobayashi ,  Yasushi Gotoh ,  Tohru Fujinawa

发明人： Motohiro Arifuki ,  Itsuo Watanabe ,  Kouji Motomura ,  Kouji Kobayashi ,  Yasushi Gotoh ,  Tohru Fujinawa

IPC分类号： C09J7/00 ,  B32B7/12 ,  H01B1/06

CPC分类号： H01L24/83 ,  C09J4/06 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0162 ,  H05K2201/0212 ,  Y10T428/2826 ,  Y10T428/2852 ,  H01L2924/00

摘要： A wiring structure having a wiring-terminal-connection adhesive that includes a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles.

摘要翻译： 一种具有接线端子连接粘合剂的布线结构，其包括在加热时能够产生自由基的固化剂，可自由基聚合的物质和硅氧烷颗粒。

公开(公告)号：US20100012358A1

公开(公告)日：2010-01-21

申请号：US12438883

申请日：2007-08-06

申请人： Takashi Tatsuzawa ,  Kouji Kobayashi ,  Naoki Fukushima ,  Takanobu Kobayashi ,  Akihiro Ito

发明人： Takashi Tatsuzawa ,  Kouji Kobayashi ,  Naoki Fukushima ,  Takanobu Kobayashi ,  Akihiro Ito

IPC分类号： H05K1/09 ,  H05K3/34

CPC分类号： H05K3/323 ,  C08K7/16 ,  C09J9/02 ,  C09J11/00 ,  H01B1/22 ,  H01L2224/83101 ,  H01L2924/07811 ,  H01R4/04 ,  H01R12/52 ,  H05K3/361 ,  H05K2201/0154 ,  H05K2201/0212 ,  Y10T29/49144 ,  H01L2924/00

摘要： The circuit-connecting material of the present invention is a circuit-connecting material for connecting a first circuit component having a plurality of first circuit electrodes on a main surface of a first circuit board and a second circuit component having a plurality of second circuit electrodes on a main surface of a second circuit board, in such a manner that the first circuit electrodes and the second circuit electrodes are electrically connected while being opposed to one another; wherein the circuit-connecting material contains an adhesive composition, conductive particles, and a plurality of insulating particles containing one or both of polyamic acid particles and polyimide particles.

摘要翻译： 本发明的电路连接材料是一种电路连接材料，用于将具有多个第一电路电极的第一电路部件连接到第一电路板的主表面上，以及第二电路部件具有多个第二电路电极 第二电路板的主表面，使得第一电路电极和第二电路电极彼此相对电连接; 其中所述电路连接材料包含粘合剂组合物，导电颗粒和包含聚酰胺酸颗粒和聚酰亚胺颗粒中的一者或两者的多个绝缘颗粒。

公开(公告)号：US20100018755A1

公开(公告)日：2010-01-28

申请号：US12438892

申请日：2007-08-03

申请人： Takashi Tatsuzawa ,  Kouji Kobayashi ,  Katsuyuki Ueno

发明人： Takashi Tatsuzawa ,  Kouji Kobayashi ,  Katsuyuki Ueno

IPC分类号： H05K1/00 ,  H01B5/00 ,  H01R11/01 ,  H02G1/14

CPC分类号： H05K3/323 ,  C09J7/20 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/40 ,  H01L24/75 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/79 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15788 ,  H01R4/04 ,  H01R13/03 ,  H05K3/361 ,  H05K2201/10674 ,  H05K2203/0191 ,  H05K2203/066 ,  H05K2203/1189 ,  H01L2924/00

摘要： The anisotropic conductive tape (1) of the invention is used for electrical connection between opposing circuit electrodes and is provided with a tape-like base material (20) and with multiple adhesive layers (11b, 12b) formed in parallel on the main side of the base material (20) along the lengthwise direction of the base material (20), wherein at least two of the multiple adhesive layers have different structures.

摘要翻译： 本发明的各向异性导电带（1）用于相对电路电极之间的电连接，并且设置有带状基材（20），并且具有多个粘合剂层（11b，12b） 所述基材（20）沿着所述基材（20）的长度方向，其中所述多个粘合剂层中的至少两个具有不同的结构。

公开(公告)号：US20100221533A1

公开(公告)日：2010-09-02

申请号：US12682822

申请日：2008-10-08

申请人： Takashi Tatsuzawa ,  Kouji Kobayashi ,  Akihiro Ito ,  Tomomi Yokozumi

发明人： Takashi Tatsuzawa ,  Kouji Kobayashi ,  Akihiro Ito ,  Tomomi Yokozumi

IPC分类号： B32B7/12 ,  B32B5/08

CPC分类号： H05K3/323 ,  H05K2201/0133 ,  H05K2201/0212 ,  Y10T428/28

摘要： A circuit connecting adhesive film comprising an insulating adhesive, conductive particles and a particulate non-conductive phase containing a polyamide-based elastomer and/or a polyester-based elastomer, wherein the conductive particles and non-conductive phase are dispersed in the insulating adhesive.

摘要翻译： 连接粘合膜的电路，其包含绝缘粘合剂，导电颗粒和含有聚酰胺基弹性体和/或聚酯类弹性体的颗粒非导电相，其中导电颗粒和非导电相分散在绝缘粘合剂中。

公开(公告)号：US20100277885A1

公开(公告)日：2010-11-04

申请号：US12808967

申请日：2008-12-16

申请人： Takashi Tatsuzawa ,  Kouji Kobayashi ,  Akihiro Ito

发明人： Takashi Tatsuzawa ,  Kouji Kobayashi ,  Akihiro Ito

IPC分类号： H05K1/11 ,  H02G3/04

CPC分类号： H01R4/04 ,  C08K3/017 ,  C08K3/08 ,  C08K9/02 ,  C09J7/10 ,  C09J9/02 ,  C09J11/04 ,  C09J2201/36 ,  C09J2205/102 ,  H01R12/52 ,  H01R12/7076 ,  H05K3/323 ,  H05K3/361 ,  H05K2203/1189

摘要： A circuit connecting material which is situated between mutually opposing circuit electrodes and, upon pressing the mutually opposing circuit electrodes, electrically connects the electrodes in the pressing direction, the circuit connecting material having a laminated construction comprising an anisotropic conductive adhesive layer A with conductive particles 21 dispersed therein and an insulating adhesive layer B, wherein the adhesive force of the insulating adhesive layer B for glass substrates is greater than the adhesive force of the anisotropic conductive adhesive layer A for glass substrates.

摘要翻译： 位于相互相对的电路电极之间的电路连接材料，并且在按压相互相对的电路电极时沿着按压方向电连接电极，该电路连接材料具有包含各向异性导电粘合剂层A的导电粒子21 分散在其中以及绝缘粘合剂层B，其中用于玻璃基板的绝缘粘合剂层B的粘合力大于玻璃基板用各向异性导电粘合剂层A的粘合力。

公开(公告)号：US07773935B2

公开(公告)日：2010-08-10

申请号：US11658558

申请日：2006-02-28

申请人： Akio Koga ,  Norihiro Matsui ,  Kouji Kobayashi ,  Yuji Doi

发明人： Akio Koga ,  Norihiro Matsui ,  Kouji Kobayashi ,  Yuji Doi

IPC分类号： H04Q7/32

CPC分类号： H04H20/12 ,  H04H20/57 ,  H04H60/11 ,  H04N5/782 ,  H04N21/41422 ,  H04N21/44209 ,  H04N21/4882

摘要： A broadcast information receiving terminal which notifies a user, when a broadcast program is unreceivable, of such unreceivability, and also notifies the user, when a reception of the broadcast program has been recovered, of such recovery of the reception is provided. In the broadcast information receiving terminal which reproduces a TV number or the like, an at-reception-recovery-time processing preprogramming control section (3) determines, when a reception of a desired broadcast program which was determined as unreceivable has been recovered, whether or not to notify the user that the reception of the broadcast program has been recovered. An at-reception-recovery-time processing section (7) notifies the user that the reception of the desired broadcast information has been recovered.

摘要翻译： 一种广播信息接收终端，当广播节目不可接收时，通知用户这种不可接收性，并且还提供了当接收广播节目已被恢复时，用户接收到这种恢复的接收。 在再现TV号码等的广播信息接收终端中，在接收恢复时间处理预编程控制部（3），在确定为不可接收的所需广播节目的接收已被恢复时，判定是否 或者不通知用户广播节目的接收已被恢复。 在接收恢复时间处理部分（7）通知用户所希望的广播信息的接收已被恢复。