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31.发明公开公开(公告)号：US20230238769A1
公开(公告)日：2023-07-27
申请号：US17999508
申请日：2021-05-27
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Tobias Gebuhr , Jan Seidenfaden
IPC: H01S5/02255 , H01S5/02234 , H01S5/02208 , H01S5/0232 , H01S5/068
CPC classification number: H01S5/02255 , H01S5/02234 , H01S5/02208 , H01S5/0232 , H01S5/06825
Abstract: In an embodiment an optoelectronic semiconductor component includes a lead frame having a first mounting surface, a semiconductor chip arranged on the first mounting surface and having an emission surface, an optical element and a molded body, wherein the optical element has an input-coupling surface oriented transverse to the first mounting surface, wherein the semiconductor chip is configured to emit electromagnetic radiation through the emission surface, a radiation axis of which is parallel to the first mounting surface, wherein the optical element is configured to deflect the electromagnetic radiation of the semiconductor chip coupled in via the input-coupling surface, wherein the molded body is attached to the lead frame and has an alignment surface transverse to the first mounting surface, and wherein the optical element and the alignment surface are in direct contact with each other.
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公开(公告)号：US20190181310A1
公开(公告)日：2019-06-13
申请号：US16326731
申请日：2017-08-23
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Markus Boss , Tobias Gebuhr
IPC: H01L33/56 , H01L25/075 , H01L33/54
CPC classification number: H01L33/56 , H01L21/561 , H01L21/565 , H01L21/568 , H01L25/0753 , H01L33/0095 , H01L33/54 , H01L2933/005
Abstract: A method of producing an optoelectronic component includes providing a carrier having an upper side; providing a mat configured as a fiber-matrix semifinished product and having a through-opening; arranging an optoelectronic semiconductor chip over the upper side of the carrier; arranging the mat over the upper side of the carrier such that the optoelectronic semiconductor chip is arranged in the opening of the mat; and compacting the mat to form a composite body including the mat and the optoelectronic semiconductor chip.
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33.发明申请公开(公告)号：US20190036299A1
公开(公告)日：2019-01-31
申请号：US16074925
申请日：2017-02-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Andreas Wojcik , Tobias Gebuhr , Markus Pindl
Abstract: A method of producing an optoelectronic lighting device includes providing a laser chip carrier on which two edge emitting laser chips, arranging a carrier including two optical elements onto the laser chip carrier, forming a respective optical connection by an optical material between a respective laser facet and a respective optical element, singulating the two laser chips by dividing the laser chip carrier between the two laser chips to form two mutually divided laser chip carrier parts, wherein the dividing includes dividing the carrier between the two optical elements to form two mutually divided carrier parts each including one of the two optical elements, such that two singulated laser chips arranged on the respective divided laser chip carrier part are formed, the respective laser facets of which are optically connected to the respective optical element of the respective carrier part by the optical material.
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公开(公告)号：US10177293B2
公开(公告)日：2019-01-08
申请号：US15524644
申请日：2015-11-05
Applicant: OSRAM Opto Semiconductors Gmbh
Inventor： Michael Wittmann , Tobias Gebuhr , David Racz
Abstract: An optoelectronic component includes a first lead frame section and a second lead frame section spaced apart from one another, and having an optoelectronic semiconductor chip arranged on the first lead frame section and the second lead frame section, wherein the first lead frame section and the second lead frame section respectively have an upper side, a lower side and a first side flank extending between the upper side and the lower side, a first lateral solder contact surface of the optoelectronic component is formed on the first side flank of the first lead frame section, and the first lateral solder contact surface is formed by a recess arranged on the first side flank of the first lead frame section and extends from the upper side to the lower side of the first lead frame section.
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公开(公告)号：US09853198B2
公开(公告)日：2017-12-26
申请号：US15022573
申请日：2014-09-18
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Michael Zitzlsperger , Christian Ziereis , Tobias Gebuhr
CPC classification number: H01L33/62 , H01L22/14 , H01L33/483 , H01L33/486 , H01L33/54 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48479 , H01L2924/00014 , H01L2924/19107 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2224/48471 , H01L2924/00 , H01L2224/4554
Abstract: An optoelectronic component includes a housing including a plastic material and a first lead frame section at least partly embedded in the plastic material, a first recess and a second recess, wherein a first upper section of an upper side of the first lead frame section is not covered by the plastic material in the first recess, a second upper section of the upper side of the first lead frame section is not covered by the plastic material in the second recess, the first recess and the second recess are separated from one another by a section of the plastic material, an optoelectronic semiconductor chip is arranged in the first recess, and no optoelectronic semiconductor chips is arranged in the second recess.
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Patent Agency Ranking
公开(公告)号：US09847316B2
公开(公告)日：2017-12-19
申请号：US15119806
申请日：2015-02-18
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Martin Brandl , Tobias Gebuhr
CPC classification number: H01L24/97 , H01L33/0095 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2924/181 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014
Abstract: A method of producing optoelectronic components includes providing an auxiliary carrier, forming separate connection elements on the auxiliary carrier, forming a molded body on the auxiliary carrier with recesses, arranging optoelectronic semiconductor chips on connection elements in the recesses of the molded body, removing the auxiliary carrier, and severing the molded body to form singulated optoelectronic components.
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37.发明授权公开(公告)号：US09673136B2
公开(公告)日：2017-06-06
申请号：US14424539
申请日：2013-08-28
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Tobias Gebuhr , Thomas Schwarz
IPC: H01L21/56 , H01L23/495 , H01L33/48 , H01L21/48 , H01L23/31 , H01L25/075
CPC classification number: H01L23/49541 , H01L21/4842 , H01L21/565 , H01L23/3157 , H01L23/49503 , H01L25/0753 , H01L33/486 , H01L2924/0002 , H01L2933/0033 , Y10T29/49158 , H01L2924/00
Abstract: A housing arrangement includes a plurality of interconnected housings for electronic components, each housing including a leadframe section of a leadframe, wherein the leadframe section is formed from an electrically conductive material and has a receiving region that receives the electronic component and/or a contact region that contacts the electronic component, a molding material into which the leadframe section is embedded and which has at least one receiving opening in which the receiving region and/or the contact region are exposed, and at least one stress reduction opening formed in the molding material and free of the receiving region and/or the contact region, wherein the housings connect to one another via the leadframe and the molding material, the stress reduction openings are formed at transitions from in each case one of the housings to another of the housings.
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公开(公告)号：US20170084805A1
公开(公告)日：2017-03-23
申请号：US15116846
申请日：2015-02-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Christian Gatzhammer , Martin Brandl , Tobias Gebuhr
IPC: H01L33/62 , H01L25/075 , H01L33/48
CPC classification number: H01L33/62 , H01L25/0756 , H01L33/483 , H01L33/486 , H01L2933/0066
Abstract: An optoelectronic component includes an optoelectronic semiconductor chip including a first and second electrical contacts; a first leadframe section comprising a first chip contact pad and a first soldering contact pad situated opposite the first chip contact pad; and a second leadframe section including a second chip contact pad and a second soldering contact pad situated opposite the second chip contact pad, wherein the first electrical contact electrically conductively connects to the first chip contact pad and the second electrical contact electrically conductively connects to the second chip contact pad, a dielectric element is arranged between the first and second leadframe sections, the first and second leadframe sections and the dielectric element are embedded into a housing such that at least parts of the first and second soldering contact pads are accessible, and a surface of the dielectric element is exposed at the underside of the housing.
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公开(公告)号：US20170062382A1
公开(公告)日：2017-03-02
申请号：US15119806
申请日：2015-02-18
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Martin Brandl , Tobias Gebuhr
CPC classification number: H01L24/97 , H01L33/0095 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2924/181 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014
Abstract: A method of producing optoelectronic components includes providing an auxiliary carrier, forming separate connection elements on the auxiliary carrier, forming a molded body on the auxiliary carrier with recesses, arranging optoelectronic semiconductor chips on connection elements in the recesses of the molded body, removing the auxiliary carrier, and severing the molded body to form singulated optoelectronic components.
Abstract translation: 一种制造光电子部件的方法包括提供辅助载体，在辅助载体上形成分离的连接元件，在辅助载体上形成具有凹陷的成型体，将光电半导体芯片布置在模制体的凹部中的连接元件上， 载体和切割成型体以形成单独的光电子部件。
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公开(公告)号：US20160284943A1
公开(公告)日：2016-09-29
申请号：US15034017
申请日：2014-11-04
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Andreas Gruendl , Tobias Gebuhr , Markus Pindl
CPC classification number: H01L33/483 , H01L33/486 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: An optoelectronic component includes a housing having a top side, wherein an anchoring structure which is a positive relief is arranged at the top side, a covering element is arranged above the top side and anchored at the anchoring structure, and the covering element completely covers the top side.
Abstract translation: 光电部件包括具有顶侧的壳体，其中在顶侧布置有正浮雕的锚定结构，覆盖元件布置在顶侧上方并锚定在锚定结构处，并且覆盖元件完全覆盖 顶端。
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