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公开(公告)号：US09516744B2
公开(公告)日：2016-12-06
申请号：US14253939
申请日：2014-04-16
CPC分类号： H05K1/028 , G06F3/044 , G06F2203/04103 , H05K1/0274 , H05K1/189 , H05K3/107 , H05K3/1258 , H05K3/22 , H05K3/4635 , H05K2201/0108 , H05K2201/055 , H05K2201/056 , H05K2201/10121 , H05K2201/10128 , Y10T29/4913 , Y10T29/49156 , Y10T29/49158 , Y10T156/1015
摘要： A method of making a micro-wire circuit structure adapted for wrapping includes providing a display and a flexible substrate. The flexible substrate includes a plurality of electrically conductive micro-wires on, in, or adjacent to a common side of the flexible substrate and forming micro-wire electrodes in a touch portion of the flexible substrate. One or more electrical circuits is located on or in a circuit portion of the flexible substrate and one or more micro-wires electrically connects the one or more electrical circuits to corresponding micro-wire electrodes. The flexible substrate is located in relation to the display with the touch portion located adjacent to a display viewing side, the circuit portion located adjacent to a display back side, and an edge portion of the flexible substrate wrapping around a display edge from the display viewing side to the display back side.
摘要翻译： 制造适于包装的微线电路结构的方法包括提供显示器和柔性基板。 柔性基板包括在柔性基板的共同侧上或附近的多个导电微线，并且在柔性基板的接触部分中形成微线电极。 一个或多个电路位于柔性基板的电路部分上或电路部分中，并且一个或多个微线将一个或多个电路电连接到相应的微线电极。 柔性基板相对于显示器定位，触摸部分位于显示观察侧附近，电路部分位于显示器背面附近，并且柔性基板的边缘部分从显示器观看围绕显示边缘缠绕 侧面显示背面。
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公开(公告)号：US09510591B2
公开(公告)日：2016-12-06
申请号：US14607100
申请日：2015-01-28
摘要： A multi-layer biocidal structure includes a support. A structured bi-layer is located on or over the support. The bi-layer includes a first cured layer on or over the support and a second layer on or over the first cured layer on a side of the first cured layer opposite the support. The structured bi-layer has at least one depth greater than the thickness of the second layer. Multiple biocidal particles are located only in the first cured layer.
摘要翻译： 多层杀生物结构包括载体。 结构化双层位于支撑上或上方。 所述双层包括位于所述载体上或上方的第一固化层，以及在所述第一固化层的与所述载体相对的一侧上的第一固化层上或上的第二层。 结构化双层具有比第二层的厚度大至少一个深度。 多个杀生物颗粒仅位于第一固化层中。
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公开(公告)号：US09426885B2
公开(公告)日：2016-08-23
申请号：US14261465
申请日：2014-04-25
CPC分类号： H05K1/097 , G06F3/047 , G06F2203/04103 , G06F2203/04112 , H05K1/189 , H05K3/1258 , H05K3/247 , H05K2201/0108 , H05K2201/0329 , H05K2201/0338 , H05K2201/035 , H05K2201/0376 , H05K2201/09036 , H05K2203/0108 , H05K2203/1545
摘要： A multi-layer micro-wire structure resistant to cracking including a substrate having a surface, one or more micro-channels formed in the substrate, an electrically conductive first material composition forming a first layer located in each micro-channel, and an electrically conductive second material composition having a greater tensile ductility than the first material composition forming a second layer located in each micro-channel, the first material composition and the second material composition in electrical contact to form an electrically conductive multi-layer micro-wire in each micro-channel, whereby the multi-layer micro-wire is resistant to cracking.
摘要翻译： 一种耐裂纹的多层微线结构，包括具有表面的基底，在基底中形成的一个或多个微通道，形成位于每个微通道中的第一层的导电第一材料组合物，以及导电 第二材料组合物具有比形成位于每个微通道中的第二层的第一材料组合物更大的拉伸延展性，第一材料组合物和第二材料组合物电接触以在每个微通道中形成导电多层微线 通道，由此多层微线耐开裂。
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34.发明授权公开(公告)号：US09405419B2
公开(公告)日：2016-08-02
申请号：US14538114
申请日：2014-11-11
CPC分类号： G06F3/044 , G06F1/16 , G06F2203/04103 , G06F2203/04112
摘要： Electrically-conductive articles are prepared to have electrically-conductive metallic grids and electrically-conductive metallic connectors (BUS lines) on one or both supporting sides of a transparent substrate. The electrically-conductive metallic connectors are designed with one metallic main wire that comprises two or more adjacent metallic micro-wires in bundled patterns. These bundled patterns and metallic micro-wires are designed with specific dimensions and configurations to provide optimal fidelity (or correspondence) to the mask image used to provide such patterns. The electrically-conductive articles can be prepared using various manufacturing technologies and can be used as parts of various electronic devices including touch screen devices. The electrically-conductive metallic grids and connectors can be prepared and designed using various technologies that are amenable to obtaining very fine lines in predetermined patterns.
摘要翻译： 制备导电制品以在透明基底的一个或两个支撑侧上具有导电金属网格和导电金属连接器（BUS线）。 导电金属连接器设计有一个金属主导线，其包括两个或更多个相邻的金属微线束的捆绑图案。 这些捆绑图案和金属微线设计具有特定的尺寸和配置，以提供用于提供这种图案的掩模图像的最佳保真度（或对应关系）。 导电制品可以使用各种制造技术制备，并且可以用作包括触摸屏装置的各种电子装置的部件。 导电金属网格和连接器可以使用各种可以以预定图案获得非常细的线条的技术来制备和设计。
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公开(公告)号：US20160212987A1
公开(公告)日：2016-07-28
申请号：US14607109
申请日：2015-01-28
CPC分类号： A01N25/08 , A01N25/34 , B32B3/00 , B32B3/30 , B32B7/00 , B32B7/12 , B32B9/00 , B32B9/04 , B32B27/00 , B32B27/18 , B32B27/28 , B32B33/00 , B32B37/06 , B32B38/06 , B32B38/10 , B32B38/162 , B32B2255/00 , B32B2307/00 , B32B2307/40 , B32B2307/7145 , C09D5/14 , C09D5/1693 , C11D3/00 , H01J37/32009 , A01N59/16 , A01N59/20
摘要： A method of using a multi-layer biocidal structure includes providing a multi-layer biocidal structure that includes a support and a structured bi-layer on or over the support. The structured bi-layer includes a first cured layer including dispersed multiple biocidal particles on or over the support and a second cured layer on or over the first cured layer on a side of the first cured layer opposite the support. The multiple biocidal particles are dispersed within only the first curable layer. The structured bi-layer has at least one depth greater than the thickness of the second layer. The multi-layer biocidal structure is located on a surface.
摘要翻译： 使用多层杀生物结构的方法包括提供多层杀生物结构，其包含支撑体上的支撑体和结构的双层载体上或其上。 结构化双层包括第一固化层，其包含位于载体上或其上的分散的多个杀生物颗粒，第一固化层上的第一固化层上，与第一固化层相反的一侧上的第二固化层。 多个杀生物颗粒仅分散在第一可固化层中。 结构化双层具有比第二层的厚度大至少一个深度。 多层杀生物结构位于表面上。
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公开(公告)号：US20160062176A1
公开(公告)日：2016-03-03
申请号：US14475878
申请日：2014-09-03
申请人： Ronald Steven Cok
发明人： Ronald Steven Cok
IPC分类号： G02F1/1335
CPC分类号： H05K1/092 , B29C35/0805 , B29C59/002 , B29C59/022 , B29C59/026 , B29C2035/0827 , B29C2059/023 , B29K2105/24 , B29K2995/0021 , B29L2031/3475 , G02B5/003 , G02B5/201 , G02F1/133514 , G02F1/133516 , G02F2001/133519 , G02F2201/52 , G03F7/0002 , G03F7/0007 , H05K1/111 , H05K2201/0108
摘要： A filled large-format imprinted structure includes a cured layer including a cured layer surface and one or more micro-cavities imprinted in the cured layer, each micro-cavity having a micro-cavity width and a micro-cavity depth. One or more ribs are imprinted in each micro-cavity and extend from the bottom of the micro-cavity toward the top of the micro-cavity, each rib having a rib width that is less than one half of the micro-cavity width, and a rib height that is less than the micro-cavity depth. Each rib separates the micro-cavity into portions, each portion having a portion width less than or equal to 20 microns. A cured material is located in each portion of the micro-cavity and extends over the top of the rib, thereby defining a filled large-format imprinted structure.
摘要翻译： 填充的大幅面印刷结构包括固化层，其包括固化层表面和一个或多个印刷在固化层中的微孔，每个微腔具有微腔宽度和微腔深度。 一个或多个肋被压印在每个微腔中并且从微腔的底部朝向微腔的顶部延伸，每个肋具有小于微腔宽度的一半的肋宽度，以及 肋高度小于微腔深度。 每个肋将微腔分成部分，每个部分具有小于或等于20微米的部分宽度。 固化材料位于微腔的每个部分中并且在肋的顶部上延伸，从而限定了填充的大格式压印结构。
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公开(公告)号：US20160062004A1
公开(公告)日：2016-03-03
申请号：US14475869
申请日：2014-09-03
申请人： Ronald Steven Cok
发明人： Ronald Steven Cok
CPC分类号： H05K1/092 , B29C35/0805 , B29C59/002 , B29C59/022 , B29C59/026 , B29C2035/0827 , B29C2059/023 , B29K2105/24 , B29K2995/0021 , B29L2031/3475 , G02B5/003 , G02B5/201 , G02F1/133514 , G02F1/133516 , G02F2001/133519 , G02F2201/52 , G03F7/0002 , G03F7/0007 , H05K1/111 , H05K2201/0108
摘要： A method of making a filled large-format imprinted structure includes providing a substrate, locating a curable layer over the substrate, imprinting the curable layer, and curing the curable layer to form a cured layer including a layer surface having one or more areas. Each area has a plurality of imprinted micro-cavities, wherein each micro-cavity has a micro-cavity width less than or equal to 20 microns. A rib separates each micro-cavity from an adjacent micro-cavity by a rib width that is less than the micro-cavity width, the rib extending from a bottom of the micro-cavity to the layer surface. A common curable material is located in each micro-cavity and cured to form common cured material in each micro-cavity, thereby defining a filled large-format imprinted structure.
摘要翻译： 制造填充的大幅面印刷结构的方法包括提供基板，将可固化层定位在基板上，压印可固化层，以及固化可固化层，以形成包括具有一个或多个区域的层表面的固化层。 每个区域具有多个压印的微腔，其中每个微腔具有小于或等于20微米的微腔宽度。 肋通过比微孔宽度窄的肋宽度将每个微腔与相邻的微腔分隔开，肋从微腔的底部延伸到层表面。 常见的可固化材料位于每个微腔中并固化以在每个微腔中形成常见的固化材料，从而限定填充的大格式压印结构。
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公开(公告)号：US20160047766A1
公开(公告)日：2016-02-18
申请号：US14460578
申请日：2014-08-15
CPC分类号： G01N27/126 , G01N27/07 , G02F1/13439 , G06F3/044 , G06F2203/04103 , H05K3/0014 , H05K3/1258 , H05K2201/0108 , H05K2201/0112 , H05K2201/0257 , H05K2201/0269 , H05K2201/0272 , H05K2201/0338 , H05K2201/0376 , H05K2201/2054 , H05K2203/0108 , H05K2203/1131 , H05K2203/1476
摘要： An imprinted electronic sensor structure on a substrate for sensing an environmental factor includes a cured layer having a layer surface located on the substrate. Spatially separated micro-channels extend from the layer surface into the cured layer. A multi-layer micro-wire is formed in each micro-channel. Each multi-layer micro-wire includes at least a conductive layer and a reactive layer. The reactive layer is exposed to the environmental factor. The conductive layer is a cured electrical conductor located only within the micro-channel and at least a portion of the reactive layer responds to the environmental factor.
摘要翻译： 用于感测环境因素的基板上的印刷电子传感器结构包括具有位于基板上的层表面的固化层。 空间分离的微通道从层表面延伸到固化层。 在每个微通道中形成多层微线。 每个多层微线包括至少一个导电层和一个反应层。 反应层暴露于环境因素。 导电层是仅位于微通道内的固化电导体，并且反应层的至少一部分响应于环境因素。
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公开(公告)号：US09235130B2
公开(公告)日：2016-01-12
申请号：US14281925
申请日：2014-05-20
CPC分类号： G03F7/32 , G03F7/30 , G06F3/041 , G06F2203/04103
摘要： Electrically-conductive articles are prepared to have electrically-conductive silver metal electrode grids and electrically-conductive silver connector wire patterns (BUS lines) on one or both supporting sides of a transparent substrate. The electrically-conductive silver connector wire patterns are designed with one silver main wire that comprises two or more adjacent silver micro-wires in bundled patterns. These bundled patterns and silver micro-wires are designed with specific dimensions and configurations to provide optimal fidelity (or correspondence) to the mask image used to provide such images in a silver halide emulsion layer. The electrically-conductive articles are provided by imagewise exposure, development, and fixing of corresponding silver halide-containing conductive film element precursors containing photosensitive silver halide emulsion layers. The electrically-conductive articles can be used as parts of various electronic devices including touch screen devices.
摘要翻译： 制备导电制品以在透明基板的一个或两个支撑侧上具有导电银金属电极网格和导电银连接器线图案（BUS线）。 导电银连接器线图案被设计成具有一个银主线，其包括两个或更多个相邻的银微丝线的捆绑图案。 这些捆绑图案和银微线被设计成具有特定的尺寸和构造，以提供与用于在卤化银乳剂层中提供这样的图像的掩模图像的最佳保真度（或对应关系）。 通过成像曝光，显影和固定含有感光卤化银乳剂层的含卤化银的导电膜元件前体来提供导电制品。 导电性物品可以用作包括触摸屏设备在内的各种电子设备的部件。
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公开(公告)号：US09195358B1
公开(公告)日：2015-11-24
申请号：US14289920
申请日：2014-05-29
CPC分类号： G06F3/044 , G06F1/1643 , G06F1/1652 , G06F2203/04102 , G06F2203/04103 , G06F2203/04112 , H05K1/148 , H05K1/189 , H05K3/1275 , H05K2201/055 , H05K2201/10128 , H05K2203/1545
摘要： A folded micro-wire substrate structure includes a transparent folded flexible substrate having a first side and a second side opposed to the first side. The flexible substrate has a first portion and a second portion adjacent to the first portion of the flexible substrate. The flexible substrate has at least a first fold between the first and second portions so that the first portion is aligned with the second portion in a perpendicular direction. One or more electrical conductors is located in or on the flexible substrate, at least one electrical component is located on or in the flexible substrate in the first portion. At least one optical element is located on or in the flexible substrate in the second portion located so that the optical element directs light to or from the electrical component.
摘要翻译： 折叠的微线基板结构包括具有第一侧和与第一侧相对的第二侧的透明折叠柔性基板。 柔性基板具有与柔性基板的第一部分相邻的第一部分和第二部分。 柔性基板在第一和第二部分之间具有至少第一折叠，使得第一部分在垂直方向上与第二部分对齐。 一个或多个电导体位于柔性基底中或柔性基底上，至少一个电部件位于第一部分中的柔性基底上或柔性基底上。 至少一个光学元件位于第二部分中的柔性基板上或柔性基板中，所述第二部分被定位成使得光学元件将光引导到电子部件或从电子部件引导光。
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