公开(公告)号：US20170179141A1

公开(公告)日：2017-06-22

申请号：US15453829

申请日：2017-03-08

Applicant: Silicon Storage Technology, Inc.

Inventor： Chien-Sheng Su ,  Jeng-Wei Yang ,  Man-Tang Wu ,  Chun-Ming Chen ,  Hieu Van Tran ,  Nhan Do

IPC: H01L27/11521 ,  H01L29/788 ,  H01L29/08 ,  H01L29/78 ,  H01L21/28 ,  H01L29/66

CPC classification number: H01L27/11521 ,  H01L21/28273 ,  H01L27/1052 ,  H01L27/11551 ,  H01L29/0847 ,  H01L29/42328 ,  H01L29/66795 ,  H01L29/66818 ,  H01L29/66825 ,  H01L29/785 ,  H01L29/7856 ,  H01L29/7881

Abstract: A non-volatile memory cell, and method of making, that includes a semiconductor substrate having a fin shaped upper surface with a top surface and two side surfaces. Source and drain regions are formed in the fin shaped upper surface portion with a channel region there between. A conductive floating gate includes a first portion extending along a first portion of the top surface, and second and third portions extending along first portions of the two side surfaces, respectively. A conductive control gate includes a first portion extending along a second portion of the top surface, second and third portions extending along second portions of the two side surfaces respectively, a fourth portion extending up and over at least some of the floating gate first portion, and fifth and sixth portions extending out and over at least some of the floating gate second and third portions respectively.

公开(公告)号：US20170025427A1

公开(公告)日：2017-01-26

申请号：US15180376

申请日：2016-06-13

Applicant: Silicon Storage Technology, Inc.

Inventor： Chien-Sheng Su ,  Jeng-Wei Yang ,  Feng Zhou

IPC: H01L27/115 ,  H01L29/66 ,  H01L29/423

CPC classification number: H01L27/11531 ,  H01L27/11521 ,  H01L27/11524 ,  H01L29/42328 ,  H01L29/66484 ,  H01L29/66825 ,  H01L29/7881

Abstract: A method of forming split gate non-volatile memory cells on the same chip as logic and high voltage devices having HKMG logic gates. The method includes forming the source and drain regions, floating gates, control gates, and the poly layer for the erase gates and word line gates in the memory area of the chip. A protective insulation layer is formed over the memory area, and an HKMG layer and poly layer are formed on the chip, removed from the memory area, and patterned in the logic areas of the chip to form the logic gates having varying amounts of underlying insulation.

Abstract translation: 在具有HKMG逻辑门的逻辑和高电压器件的同一芯片上形成分离栅非易失性存储单元的方法。 该方法包括在芯片的存储器区域中形成用于擦除栅极和字线栅极的源极和漏极区域，浮动栅极，控制栅极和多晶硅层。 在存储区域上形成保护绝缘层，并且在芯片上形成HKMG层和多晶硅层，从存储区域移除，并在芯片的逻辑区域中图案化以形成具有不同量的底层绝缘体的逻辑门 。

公开(公告)号：US20170025424A1

公开(公告)日：2017-01-26

申请号：US15287672

申请日：2016-10-06

Applicant: Silicon Storage Technology, Inc.

Inventor： Chien-Sheng Su ,  Jeng-Wei Yang ,  Yueh-Hsin Chen

IPC: H01L27/115 ,  H01L29/66 ,  H01L29/16 ,  H01L29/423

CPC classification number: H01L27/11521 ,  H01L21/28273 ,  H01L21/823425 ,  H01L29/1608 ,  H01L29/42328 ,  H01L29/66825

Abstract: A memory device having a pair of conductive floating gates with inner sidewalls facing each other, and disposed over and insulated from a substrate of first conductivity type. A pair of spaced apart conductive control gates each disposed over and insulated from one of the floating gates, and each including inner sidewalls facing each other. A pair of first spacers of insulation material extending along control gate inner sidewalls and over the floating gates. The floating gate inner sidewalls are aligned with side surfaces of the first spacers. A pair of second spacers of insulation material each extend along one of the first spacers and along one of the floating gate inner sidewalls. A trench formed into the substrate having sidewalls aligned with side surfaces of the second spacers. Silicon carbon disposed in the trench. Material implanted into the silicon carbon forming a first region having a second conductivity type.

Abstract translation: 一种具有一对导电浮动栅极的存储器件，所述导电浮动栅极具有彼此相对的内侧壁，并且设置在第一导电类型的衬底上并与其绝缘。 一对间隔开的导电控制栅极，每个导电控制栅极设置在浮动栅极中的一个上并与其绝缘，并且每个包括面向彼此的内侧壁。 一对绝缘材料的第一间隔物，沿着控制栅极内侧壁和浮动栅极延伸。 浮动门内侧壁与第一间隔件的侧表面对准。 绝缘材料的一对第二间隔物各自沿着第一间隔件中的一个并且沿着浮动栅极内侧壁中的一个延伸。 形成在衬底中的沟槽，其具有与第二间隔物的侧表面对齐的侧壁。 设置在沟槽中的硅碳。 材料注入到硅碳中，形成具有第二导电类型的第一区域。

公开(公告)号：US09379121B1

公开(公告)日：2016-06-28

申请号：US14589650

申请日：2015-01-05

Applicant: Silicon Storage Technology, Inc.

Inventor： Chun-Ming Chen ,  Man-Tang Wu ,  Jeng-Wei Yang ,  Chien-Sheng Su

IPC: H01L27/115 ,  H01L29/423 ,  H01L29/51 ,  H01L29/49 ,  H01L29/45 ,  H01L21/28 ,  H01L21/02 ,  H01L29/788 ,  H01L29/66

CPC classification number: H01L27/11521 ,  H01L21/02181 ,  H01L21/02186 ,  H01L21/02189 ,  H01L21/28273 ,  H01L27/11524 ,  H01L29/42328 ,  H01L29/45 ,  H01L29/4916 ,  H01L29/495 ,  H01L29/511 ,  H01L29/517 ,  H01L29/66825 ,  H01L29/788 ,  H01L29/7881

Abstract: A non-volatile memory cell includes a substrate of a first conductivity type, having a first region of a second conductivity type, a second region of the second conductivity type spaced apart from the first region, forming a channel region therebetween. A floating gate is disposed over and insulated from a first portion of the channel region which is adjacent the first region. A select gate is disposed over a second portion of the channel region adjacent to the second region, the select gate being formed of a metal material and being insulated from the second portion of the channel region by a layer of silicon dioxide and a layer of high K insulating material. A control gate is disposed over and insulated from the floating gate. An erase gate is disposed over and insulated from the first region, and disposed laterally adjacent to and insulated from the floating gate.

Abstract translation: 非易失性存储单元包括第一导电类型的衬底，具有第二导电类型的第一区域，与第一区域间隔开的第二导电类型的第二区域，在它们之间形成沟道区域。 浮置栅极设置在与第一区域相邻的沟道区域的第一部分之上并与其绝缘。 选择栅极设置在与第二区域相邻的沟道区域的第二部分上，选择栅极由金属材料形成并且通​​过二氧化硅层和高层与沟道区域的第二部分绝缘 K绝缘材料。 控制栅极设置在浮动栅极上并与浮动栅极绝缘。 擦除栅极设置在第一区域的上方并与第一区域绝缘，并且横向地邻近浮动栅极并与其隔离。

公开(公告)号：US09276006B1

公开(公告)日：2016-03-01

申请号：US14589656

申请日：2015-01-05

Applicant: Silicon Storage Technology, Inc.

Inventor： Chun-Ming Chen ,  Man-Tang Wu ,  Jeng-Wei Yang ,  Chien-Sheng Su

IPC: H01L27/115 ,  H01L21/28 ,  H01L21/02 ,  H01L29/45 ,  H01L29/51 ,  H01L29/49 ,  H01L29/423 ,  H01L29/788 ,  H01L29/66

CPC classification number: H01L27/11521 ,  H01L21/28273 ,  H01L29/42328 ,  H01L29/4916 ,  H01L29/66825 ,  H01L29/7885

Abstract: A non-volatile memory cell including a substrate having first and second regions with a channel region therebetween. A floating gate is disposed over and insulated from a first portion of the channel region which is adjacent the first region. A select gate is disposed over and insulated from a second portion of the channel region which is adjacent to the second region. The select gate includes a block of polysilicon material and a work function metal material layer extending along bottom and side surfaces of the polysilicon material block. The select gate is insulated from the second portion of the channel region by a silicon dioxide layer and a high K insulating material layer. A control gate is disposed over and insulated from the floating gate, and an erase gate is disposed over and insulated from the first region, and disposed laterally adjacent to and insulated from the floating gate.

Abstract translation: 一种非易失性存储单元，包括具有其间具有沟道区的第一和第二区的衬底。 浮置栅极设置在与第一区域相邻的沟道区域的第一部分之上并与其绝缘。 选择栅极设置在与第二区域相邻的沟道区域的第二部分之上并与其绝缘。 选择栅极包括多晶硅材料块和沿着多晶硅材料块的底部和侧表面延伸的功函数金属材料层。 选择栅极通过二氧化硅层和高K绝缘材料层与沟道区的第二部分绝缘。 控制栅极设置在浮动栅极上并与浮动栅极绝缘，并且擦除栅极设置在第一区域的上方并与第一区域绝缘，并且横向地设置在与浮动栅极相邻并与其隔离的位置。

公开(公告)号：US10312246B2

公开(公告)日：2019-06-04

申请号：US14790540

申请日：2015-07-02

Applicant: Silicon Storage Technology, Inc.

Inventor： Jeng-Wei Yang ,  Man-Tang Wu ,  Chun-Ming Chen ,  Chien-Sheng Su ,  Nhan Do

IPC: H01L27/115 ,  H01L27/11521 ,  H01L29/66 ,  H01L29/40 ,  H01L21/8234 ,  H01L29/423 ,  H01L29/788

Abstract: A non-volatile memory cell includes a semiconductor substrate of first conductivity type, first and second spaced-apart regions in the substrate of second conductivity type, with a channel region in the substrate therebetween. A floating gate has a first portion disposed vertically over a first portion of the channel region, and a second portion disposed vertically over the first region. The floating gate includes a sloping upper surface that terminates with one or more sharp edges. An erase gate is disposed vertically over the floating gate with the one or more sharp edges facing the erase gate. A control gate has a first portion disposed laterally adjacent to the floating gate, and vertically over the first region. A select gate has a first portion disposed vertically over a second portion of the channel region, and laterally adjacent to the floating gate.

公开(公告)号：US09985042B2

公开(公告)日：2018-05-29

申请号：US15489548

申请日：2017-04-17

Applicant: Silicon Storage Technology, Inc.

Inventor： Chien-Sheng Su ,  Jeng-Wei Yang ,  Man-Tang Wu ,  Chun-Ming Chen ,  Hieu Van Tran ,  Nhan Do

IPC: H01L21/306 ,  H01L21/8238 ,  H01L27/11568 ,  H01L21/3065

CPC classification number: H01L27/11568 ,  H01L21/30604 ,  H01L21/30625 ,  H01L21/3065 ,  H01L21/823821 ,  H01L28/00

Abstract: A method of forming a memory device with memory cells over a planar substrate surface and FinFET logic devices over fin shaped substrate surface portions, including forming a protective layer over previously formed floating gates, erase gates, word line poly and source regions in a memory cell portion of the substrate, then forming fins into the surface of the substrate and forming logic gates along the fins in a logic portion of the substrate, then removing the protective layer and completing formation of word line gates from the word line poly and drain regions in the memory cell portion of the substrate.

公开(公告)号：US09972630B2

公开(公告)日：2018-05-15

申请号：US15295022

申请日：2016-10-17

Applicant: Silicon Storage Technology, Inc.

Inventor： Chien-Sheng Su ,  Feng Zhou ,  Jeng-Wei Yang ,  Hieu Van Tran ,  Nhan Do

IPC: H01L21/336 ,  H01L27/11521 ,  H01L21/28 ,  H01L29/423 ,  H01L29/66 ,  H01L29/788 ,  H01L27/11524

CPC classification number: H01L27/11521 ,  H01L21/28273 ,  H01L27/11524 ,  H01L29/42328 ,  H01L29/66825 ,  H01L29/788 ,  H01L29/7881

Abstract: A memory device including a silicon substrate having a planar upper surface in a memory cell area and an upwardly extending silicon fin in a logic device area. The silicon fin includes side surfaces extending up and terminating at a top surface. The logic device includes spaced apart source and drain regions with a channel region extending there between (along the top surface and the side surfaces), and a conductive logic gate disposed over the top surface and laterally adjacent to the side surfaces. The memory cell includes spaced apart source and drain regions with a second channel region extending there between, a conductive floating gate disposed over one portion of the second channel region, a conductive word line gate disposed over another portion of the second channel region, a conductive control gate disposed over the floating gate, and a conductive erase gate disposed over the source region.

公开(公告)号：US09972493B2

公开(公告)日：2018-05-15

申请号：US15594883

申请日：2017-05-15

Applicant: Silicon Storage Technology, Inc.

Inventor： Chien-Sheng Su ,  Jeng-Wei Yang ,  Man-Tang Wu ,  Chun-Ming Chen ,  Hieu Van Tran ,  Nhan Do

IPC: H01L21/336 ,  H01L21/28 ,  H01L21/306 ,  G11C16/04 ,  H01L29/772 ,  H01L29/423

CPC classification number: H01L21/28 ,  G11C16/0425 ,  H01L21/28273 ,  H01L21/30604 ,  H01L27/11539 ,  H01L29/42328 ,  H01L29/772

Abstract: A method of forming a memory device that includes forming a first insulation layer on a semiconductor substrate, forming a conductive material layer on the first insulation layer, forming an insulation block on the conductive material layer, forming an insulation spacer along a side surface of the insulation block and on the conductive material layer, etching the conductive material layer to form a block of the conductive material disposed directly under the insulation block and the insulation spacer, removing the insulation spacer, forming a second insulation layer having a first portion wrapping around an exposed upper edge of the block of the conductive material and a second portion disposed on a first portion of the first insulation layer over the substrate, and forming a conductive block insulated from the block of the conductive material by the second insulation layer and from the substrate by the first and second insulation layers.

公开(公告)号：US20180069104A1

公开(公告)日：2018-03-08

申请号：US15474879

申请日：2017-03-30

Applicant: Silicon Storage Technology Inc.

Inventor： Feng Zhou ,  Xian Liu ,  Chien-Sheng Su ,  Nhan Do ,  Chunming Wang

IPC: H01L29/66 ,  H01L29/423

CPC classification number: H01L29/66825 ,  G11C2216/10 ,  H01L21/28273 ,  H01L27/0705 ,  H01L29/0847 ,  H01L29/42328 ,  H01L29/6653 ,  H01L29/66545 ,  H01L29/788

Abstract: A simplified method for forming pairs of non-volatile memory cells using two polysilicon depositions. A first polysilicon layer is formed on and insulated from the semiconductor substrate in a first polysilicon deposition process. A pair of spaced apart insulation blocks are formed on the first polysilicon layer. Exposed portions of the first poly silicon layer are removed while maintaining a pair of polysilicon blocks of the first polysilicon layer each disposed under one of the pair of insulation blocks. A second polysilicon layer is formed over the substrate and the pair of insulation blocks in a second polysilicon deposition process. Portions of the second polysilicon layer are removed while maintaining a first polysilicon block (disposed between the pair of insulation blocks), a second polysilicon block (disposed adjacent an outer side of one insulation block), and a third polysilicon block (disposed adjacent an outer side of the other insulation block).