公开(公告)号：US11968829B2

公开(公告)日：2024-04-23

申请号：US17834746

申请日：2022-06-07

Applicant: Silicon Storage Technology, Inc.

Inventor： Zhuoqiang Jia ,  Leo Xing ,  Xian Liu ,  Serguei Jourba ,  Nhan Do

IPC: H10B41/42 ,  H01L21/28 ,  H01L29/423 ,  H01L29/66 ,  H01L29/788

CPC classification number: H10B41/42 ,  H01L29/40114 ,  H01L29/42328 ,  H01L29/66825 ,  H01L29/7883

Abstract: A method includes recessing an upper surface of a substrate in first and second areas relative to a third area, forming a first conductive layer in the first area, forming a second conductive layer in the three areas, selectively removing the first and second conductive layers in the first area, while maintaining the second conductive layer in the second and third areas, leaving pairs of stack structures in the first area respectively having a control gate of the second conductive layer and a floating gate of the first conductive layer, forming a third conductive layer in the three areas, recessing the upper surface of the third conductive layer below tops of the stack structures and removing the third conductive layer from the second and third areas, removing the second conductive layer from the second and third areas, and forming blocks of metal material in the second and third areas.

公开(公告)号：US11652162B2

公开(公告)日：2023-05-16

申请号：US17021678

申请日：2020-09-15

Applicant: Silicon Storage Technology, Inc.

Inventor： Feng Zhou ,  Xian Liu ,  Chien-Sheng Su ,  Nhan Do ,  Chunming Wang

IPC: H01L29/66 ,  H01L29/788 ,  H01L27/07 ,  H01L29/08 ,  H01L21/28 ,  H01L49/02 ,  H01L29/423

CPC classification number: H01L29/66825 ,  H01L27/0705 ,  H01L28/00 ,  H01L29/0847 ,  H01L29/40114 ,  H01L29/42328 ,  H01L29/66545 ,  H01L29/788 ,  G11C2216/10 ,  H01L29/6653

Abstract: A simplified method for forming a non-volatile memory cell using two polysilicon depositions. A first polysilicon layer is formed on and insulated from the semiconductor substrate in a first polysilicon deposition process. An insulation block is formed on the first polysilicon layer. Spacers are formed adjacent first and second sides of the insulation block, and with the spacer adjacent the first side is reduced. Exposed portions of the first poly silicon layer are removed while maintaining a polysilicon block of the first polysilicon layer disposed under the insulation block. A second polysilicon layer is formed over the substrate and the insulation block in a second polysilicon deposition process. Portions of the second polysilicon layer are removed while maintaining a first polysilicon block (disposed adjacent the first side of the insulation block), and a second polysilicon block (disposed adjacent the second side of the insulation block).

公开(公告)号：US11444091B2

公开(公告)日：2022-09-13

申请号：US17129865

申请日：2020-12-21

Applicant: Silicon Storage Technology, Inc.

Inventor： Jack Sun ,  Chunming Wang ,  Xian Liu ,  Andy Yang ,  Guo Xiang Song ,  Leo Xing ,  Nhan Do

IPC: H01L21/00 ,  H01L27/11531 ,  H01L27/11524 ,  H01L29/66 ,  H01L29/423 ,  H01L27/11529

Abstract: A method of forming a semiconductor device by recessing the upper surface of a semiconductor substrate in first and second areas but not a third area, forming a first conductive layer in the first and second areas, forming a second conductive layer in all three areas, removing the first and second conductive layers from the second area and portions thereof from the first area resulting in pairs of stack structures each with a control gate over a floating gate, forming a third conductive layer in the first and second areas, forming a protective layer in the first and second areas and then removing the second conductive layer from the third area, then forming blocks of conductive material in the third area, then etching in the first and second areas to form select and HV gates, and replacing the blocks of conductive material with blocks of metal material.

公开(公告)号：US11315635B2

公开(公告)日：2022-04-26

申请号：US17152696

申请日：2021-01-19

Applicant: Silicon Storage Technology, Inc.

Inventor： Chunming Wang ,  Xian Liu ,  Guo Xiang Song ,  Leo Xing ,  Nhan Do

IPC: G11C16/04 ,  G11C16/16 ,  H01L27/11556 ,  H01L27/11521 ,  H01L29/423

Abstract: A memory device includes a semiconductor substrate, first and second regions in the substrate having a conductivity type different than that of the substrate, with a channel region in the substrate extending between the first and second regions. The channel region is continuous between the first and second regions. A first floating gate is disposed over and insulated from a first portion of the channel region. A second floating gate is disposed over and insulated from a second portion of the channel region. A first coupling gate is disposed over and insulated from the first floating gate. A second coupling gate is disposed over and insulated from the second floating gate. A word line gate is disposed over and insulated from a third portion of the channel region between the first and second channel region portions. An erase gate is disposed over and insulated from the word line gate.

公开(公告)号：US10833179B2

公开(公告)日：2020-11-10

申请号：US16576389

申请日：2019-09-19

Applicant: Silicon Storage Technology, Inc.

Inventor： Chunming Wang ,  Leo Xing ,  Andy Liu ,  Melvin Diao ,  Xian Liu ,  Nhan Do

IPC: H01L27/11521 ,  H01L27/11531 ,  H01L29/66 ,  H01L21/3213 ,  H01L27/11536 ,  H01L29/423 ,  H01L49/02

Abstract: A method of forming a non-volatile memory cell on a substrate having memory cell and logic circuit regions by forming a pair of conductive floating gates in the memory cell region, forming a first source region in the substrate between the pair of floating gates, forming a polysilicon layer in both regions, forming an oxide layer over the polysilicon layer in the logic circuit region, performing a chemical-mechanical polish of the polysilicon layer in the memory cell area leaving a first block of the polysilicon layer between the floating gates that is separated from remaining portions of the polysilicon layer, and selectively etching portions of the polysilicon layer to result in: second and third blocks of the polysilicon layer disposed in outer regions of the memory cell area, and a fourth block of the polysilicon layer in the logic circuit region.

公开(公告)号：US10692548B2

公开(公告)日：2020-06-23

申请号：US16551593

申请日：2019-08-26

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Xian Liu ,  Nhan Do

IPC: G11C16/06 ,  G11C7/10 ,  G11C8/12 ,  H01L27/11521 ,  H01L21/28 ,  G11C16/08 ,  G11C29/02 ,  H01L29/423 ,  H01L29/66 ,  H01L29/788 ,  G11C8/08 ,  G11C8/10 ,  G11C16/04 ,  G11C29/12 ,  H01L27/11524

Abstract: A system and method are disclosed for performing address fault detection in a flash memory system. In one embodiment, a flash memory system comprises a memory array comprising flash memory cells arranged in rows and columns, a row decoder for receiving a row address as an input, the row decoder coupled to a plurality of word lines, wherein each word line is coupled to a row of flash memory cells in the memory array, an address fault detection array comprising a column of memory cells, wherein each of the plurality of word lines is coupled to a memory cell in the column, and an analog comparator for comparing a current drawn by the column with a reference current and for indicating a fault if the current drawn by the column exceeds the reference current.

公开(公告)号：US10658027B2

公开(公告)日：2020-05-19

申请号：US15002302

申请日：2016-01-20

Applicant: Silicon Storage Technology, Inc.

Inventor： Nhan Do ,  Xian Liu ,  Vipin Tiwari ,  Hieu Van Tran

IPC: H01L29/76 ,  G11C11/419 ,  G11C16/04 ,  G11C16/14 ,  H01L21/28 ,  H01L29/423 ,  H01L29/66 ,  H01L29/788 ,  H01L27/11521

Abstract: A method of forming a memory device that includes forming on a substrate, a first insulation layer, a first conductive layer, a second insulation layer, a second conductive layer, a third insulation layer. First trenches are formed through third insulation layer, the second conductive layer, the second insulation layer and the first conductive layer, leaving side portions of the first conductive layer exposed. A fourth insulation layer is formed at the bottom of the first trenches that extends along the exposed portions of the first conductive layer. The first trenches are filled with conductive material. Second trenches are formed through the third insulation layer, the second conductive layer, the second insulation layer and the first conductive layer. Drain regions are formed in the substrate under the second trenches. A pair of memory cells results, with a single continuous channel region extending between drain regions for the pair of memory cells.

公开(公告)号：US20200013882A1

公开(公告)日：2020-01-09

申请号：US16576348

申请日：2019-09-19

Applicant: Silicon Storage Technology, Inc.

Inventor： Chunming Wang ,  Leo Xing ,  Andy Liu ,  Melvin Diao ,  Xian Liu ,  Nhan Do

IPC: H01L29/66 ,  H01L21/3213 ,  H01L27/11521 ,  H01L27/11536 ,  H01L27/11531 ,  H01L29/423 ,  H01L49/02

Abstract: A method of forming a non-volatile memory cell on a substrate having memory cell and logic circuit regions by forming a pair of conductive floating gates in the memory cell region, forming a first source region in the substrate between the pair of floating gates, forming a polysilicon layer in both regions, forming an oxide layer over the polysilicon layer in the logic circuit region, performing a chemical-mechanical polish of the polysilicon layer in the memory cell area leaving a first block of the polysilicon layer between the floating gates that is separated from remaining portions of the polysilicon layer, and selectively etching portions of the polysilicon layer to result in: second and third blocks of the polysilicon layer disposed in outer regions of the memory cell area, and a fourth block of the polysilicon layer in the logic circuit region.

公开(公告)号：US20200013788A1

公开(公告)日：2020-01-09

申请号：US16422740

申请日：2019-05-24

Applicant: Silicon Storage Technology, Inc.

Inventor： Serguei Jourba ,  Catherine Decobert ,  Feng Zhou ,  Jinho Kim ,  Xian Liu ,  Nhan Do

IPC: H01L27/11524 ,  H01L29/66 ,  H01L21/8238 ,  H01L21/8234 ,  H01L21/768 ,  H01L27/088 ,  H01L21/266 ,  H01L29/788 ,  H01L29/78 ,  H01L29/423

Abstract: A method of forming a memory device including a plurality of upwardly extending fins in a semiconductor substrate upper surface. A memory cell is formed on a first fin, and includes spaced apart source and drain regions in the first fin, with a channel region extending along top and opposing side surfaces of the first fin between the source and drain regions. A floating gate extends along a first portion of the channel region. A select gate extends along a second portion of the channel region. A control gate extends along the floating gate. An erase gate extends along the source region. A second fin has a length that extends in a first direction which is perpendicular to a second direction in which a length of the first fin extends. The source region is formed in the first fin at an intersection of the first and second fins.

公开(公告)号：US20190214396A1

公开(公告)日：2019-07-11

申请号：US16160812

申请日：2018-10-15

Applicant: Silicon Storage Technology, Inc.

Inventor： Chunming Wang ,  Andy Liu ,  Xian Liu ,  Leo Xing ,  Melvin Diao ,  Nhan Do

IPC: H01L27/11521

Abstract: A twin bit memory cell includes first and second spaced apart floating gates formed in first and second trenches in the upper surface of a semiconductor substrate. An erase gate, or a pair of erase gates, are disposed over and insulated from the floating gates, respectively. A word line gate is disposed over and insulated from a portion of the upper surface that is between the first and second trenches. A first source region is formed in the substrate under the first trench, and a second source region formed in the substrate under the second trench. A continuous channel region of the substrate extends from the first source region, along a side wall of the first trench, along the portion of the upper surface that is between the first and second trenches, along a side wall of the second trench, and to the second source region.