公开(公告)号：US10818703B2

公开(公告)日：2020-10-27

申请号：US15214989

申请日：2016-07-20

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Masafumi Morisue ,  Yasuhiro Jinbo ,  Gen Fujii ,  Hajime Kimura

IPC: H01L27/12 ,  G02F1/167 ,  H01L31/0392 ,  H01L29/786 ,  H01L51/00 ,  H01L51/56 ,  G02F1/1333 ,  G02F1/1337 ,  G02F1/1339 ,  H01L27/32 ,  H01L31/18

Abstract: A method for manufacturing a semiconductor device includes: forming a photocatalytic layer and an organic compound layer in contact with the photocatalytic layer over a substrate having a light transmitting property; forming an element forming layer over the substrate having the light transmitting property with the photocatalytic layer and the organic compound layer in contact with the photocatalytic layer interposed therebetween; and separating the element forming layer from the substrate having the light transmitting property after the photocatalytic layer is irradiated with light through the substrate having the light transmitting property.

公开(公告)号：US10429999B2

公开(公告)日：2019-10-01

申请号：US15378120

申请日：2016-12-14

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Yasuhiro Jinbo ,  Shingo Eguchi ,  Hisao Ikeda ,  Tetsuji Ishitani ,  Taisuke Kamada

IPC: G06F3/044 ,  G09G3/36

Abstract: To provide a novel display panel that is highly convenient or reliable. To provide a novel input and output device that is highly convenient or reliable. To provide a novel data processing device that is highly convenient or reliable. To provide a method for manufacturing a novel display panel that is highly convenient or reliable. The display panel includes a pixel, a third conductive film electrically connected to the pixel, an insulating film including an opening portion overlapping with the third conductive film, and an electrode including a first region in contact with the third conductive film and a second region functioning as a contact point.

公开(公告)号：US10331247B2

公开(公告)日：2019-06-25

申请号：US14877436

申请日：2015-10-07

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD

Inventor： Yasuhiro Jinbo ,  Akio Endo

IPC: G06F1/16 ,  G06F3/041 ,  G06F3/044

Abstract: A novel functional panel, a novel device, or a novel data processor is provided. A structure in which a first plane, a second plane that is opposite the first plane, and a neutral plane between the first plane and the second plane are provided and a portion of a functional layer having a thickness greater than or equal to half of the thickness of the functional layer is in a region between the first plane and the neutral plane was conceived.

公开(公告)号：US10147780B2

公开(公告)日：2018-12-04

申请号：US15290085

申请日：2016-10-11

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Daiki Nakamura ,  Kohei Yokoyama ,  Yasuhiro Jinbo ,  Toshiki Sasaki ,  Masataka Nakada ,  Naoto Goto ,  Takahiro Iguchi

IPC: H01L27/32 ,  H01L29/786 ,  G02F1/1343 ,  G02F1/1333 ,  G02F1/1335 ,  G02F1/1368 ,  H01L27/12

Abstract: A novel display device that is highly convenient with low power consumption is provided. The display device includes a display element including a liquid crystal layer, a display element including a light-emitting layer, and a pixel circuit. Electrodes of the display element including the liquid crystal layer and the display element including the light-emitting layer are electrically connected to the pixel circuit. The electrode of the display element including the liquid crystal layer includes a reflective film including an opening. The pixel circuit includes a transistor including a semiconductor film. The number of insulating films in a region overlapping with the opening is smaller than that of insulating films overlapping with the semiconductor film. In addition, the display element including the light-emitting layer includes two light-emitting elements. The number of optical elements overlapping with one light-emitting element is smaller than that of optical elements overlapping with the other light-emitting element.

公开(公告)号：US09952626B2

公开(公告)日：2018-04-24

申请号：US14982079

申请日：2015-12-29

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Yasuhiro Jinbo

IPC: H01J29/10 ,  G06F1/16 ,  G06F1/32 ,  G09F9/30 ,  H01L27/32 ,  H01L51/00 ,  H01L51/52 ,  H04M1/02

CPC classification number: G06F1/1652 ,  G06F1/1601 ,  G06F1/1677 ,  G06F1/3265 ,  G09F9/301 ,  H01L27/323 ,  H01L27/3244 ,  H01L51/0097 ,  H01L51/524 ,  H01L2251/5338 ,  H04M1/0268 ,  Y02D10/153 ,  Y02E10/549

Abstract: A highly portable semiconductor device and the like providing improved browsability of display. Provided is a semiconductor device including a flexible display panel, a first housing supporting a first region of the display panel, a second housing supporting a second region of the display panel, and a flexible base material firmly attached to the first housing. The display panel can be deformed into an open position where the first and second regions are substantially on the same plane or into a folded position where the first and second regions overlap with each other. The second housing includes a groove portion where the flexible base material can partly slide. Part of the flexible base material is inserted into the groove portion in the open position. The part of the flexible base material which is inserted into the groove portion is at least partly withdrawn in a deformation into the folded position.

公开(公告)号：US09812517B2

公开(公告)日：2017-11-07

申请号：US15163072

申请日：2016-05-24

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Minato Ito ,  Yasuhiro Jinbo

IPC: H01L27/12 ,  H01L27/32 ,  H01L51/00

CPC classification number: H01L27/1259 ,  H01L27/124 ,  H01L27/1266 ,  H01L27/3216 ,  H01L27/3272 ,  H01L27/3276 ,  H01L27/3297 ,  H01L51/5265 ,  H01L51/56 ,  H01L2227/323

Abstract: A method for manufacturing a display device, which does not easily damage an electrode, is provided. In the first step, a terminal electrode, a wiring, and a functional layer are provided over a first substrate; the terminal electrode, the wiring, and the functional layer are electrically connected to one another; an insulating layer is provided over the terminal electrode; a first layer is provided over the terminal electrode and the insulating layer; an adhesive layer is sandwiched between the first substrate and a second substrate; the second substrate and the adhesive layer include a first opening overlapping with part of the first layer; and the insulating layer includes a second opening inside the first opening in a top view. In the second step, part of the first layer is removed by emitting particles having a high sublimation property to the first layer, so that the terminal electrode is exposed.

公开(公告)号：US09793150B2

公开(公告)日：2017-10-17

申请号：US15254623

申请日：2016-09-01

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Yasuhiro Jinbo ,  Masafumi Morisue ,  Hajime Kimura ,  Shunpei Yamazaki

IPC: H01L21/683 ,  H01L27/12 ,  H01L27/15 ,  H01L33/62 ,  G02F1/1333 ,  G02F1/1335 ,  H01L33/00 ,  H01L51/00

CPC classification number: H01L27/1266 ,  G02F1/133305 ,  G02F1/133603 ,  H01L21/6835 ,  H01L27/1214 ,  H01L27/153 ,  H01L33/0079 ,  H01L33/62 ,  H01L51/003 ,  H01L2221/68318 ,  H01L2221/68386

Abstract: The present invention provides a manufacturing technique of a semiconductor device and a display device using a peeling process, in which a transfer process can be conducted with a good state in which a shape and property of an element before peeling are kept. Further, the present invention provides a manufacturing technique of more highly reliable semiconductor devices and display devices with high yield without complicating the apparatus and the process for manufacturing. According to the present invention, an organic compound layer including a photocatalyst substance is formed over a first substrate having a light-transmitting property, an element layer is formed over the organic compound layer including a photocatalyst substance, the organic compound layer including a photocatalyst substance is irradiated with light which has passed through the first substrate, and the element layer is peeled from the first substrate.

公开(公告)号：US09764488B2

公开(公告)日：2017-09-19

申请号：US14468801

申请日：2014-08-26

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Ryu Komatsu ,  Kohei Yokoyama ,  Masakatsu Ohno ,  Satoru Idojiri ,  Hisao Ikeda ,  Yasuhiro Jinbo ,  Hiroki Adachi ,  Yoshiharu Hirakata ,  Shingo Eguchi ,  Daiki Nakamura

IPC: C03B33/027 ,  C03B33/07 ,  B26D3/08 ,  G02F1/13 ,  B26D3/28 ,  B26F1/38 ,  C03B33/037

CPC classification number: B26D3/282 ,  B26D3/08 ,  B26F1/3826 ,  C03B33/027 ,  C03B33/037 ,  C03B33/07 ,  G02F1/1303 ,  Y02P40/57 ,  Y10T83/0281 ,  Y10T156/1051 ,  Y10T156/1082 ,  Y10T156/1126 ,  Y10T156/1137 ,  Y10T156/1168 ,  Y10T156/1195 ,  Y10T156/12 ,  Y10T156/1348 ,  Y10T156/1788 ,  Y10T156/1793 ,  Y10T156/1928 ,  Y10T156/1933 ,  Y10T156/1939 ,  Y10T156/1961 ,  Y10T156/1967 ,  Y10T156/1994

Abstract: A device for forming a separation starting point that allows separation of a surface layer of a processed member to form a remaining portion is provided. A manufacturing device of a stack including a support and a remaining portion of a processed member whose surface layer is separated is provided. The device for forming the separation starting point includes a stage that supports the processed member, a cutter that faces the stage, a head portion that supports the cutter, an arm portion that supports the head portion, and a moving mechanism that relatively moves the cutter to the stage.

公开(公告)号：US09269914B2

公开(公告)日：2016-02-23

申请号：US14339911

申请日：2014-07-24

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Yasuhiro Jinbo ,  Shingo Eguchi

IPC: H01L33/00 ,  H01L51/00 ,  H01L51/52 ,  H01L33/56 ,  H01L27/32

CPC classification number: H01L51/5246 ,  H01L27/323 ,  H01L27/3244 ,  H01L33/56 ,  H01L51/0097 ,  H01L51/5237 ,  H01L51/5253 ,  H01L51/5256 ,  H01L2251/5338 ,  H01L2251/5361 ,  Y02E10/549

Abstract: A lightweight flexible light-emitting device that is less likely to be broken is provided. The light-emitting device includes a first flexible substrate, a second flexible substrate, an element layer, a first bonding layer, and a second bonding layer. The element layer includes a light-emitting element. The element layer is provided between the first flexible substrate and the second flexible substrate. The first bonding layer is provided between the first flexible substrate and the element layer. The second bonding layer is provided between the second flexible substrate and the element layer. The first and second bonding layers are in contact with each other on the outer side of an end portion of the element layer. The first and second flexible substrates are in contact with each other on the outer side of the end portions of the element layer, the first bonding layer, and the second bonding layer.

Abstract translation: 提供了不太可能被破坏的轻量级柔性发光装置。 发光装置包括第一柔性基板，第二柔性基板，元件层，第一接合层和第二接合层。 元件层包括发光元件。 元件层设置在第一柔性基板和第二柔性基板之间。 第一粘合层设置在第一柔性基板和元件层之间。 第二结合层设置在第二柔性基板和元件层之间。 第一和第二接合层在元件层的端部的外侧彼此接触。 第一和第二柔性基板在元件层，第一接合层和第二接合层的端部的外侧彼此接触。

公开(公告)号：US08629031B2

公开(公告)日：2014-01-14

申请号：US13759264

申请日：2013-02-05

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Yasuhiro Jinbo ,  Hironobu Shoji ,  Hideto Ohnuma ,  Shunpei Yamazaki

IPC: H01L21/331 ,  H01L21/8222

CPC classification number: H01L21/84 ,  H01L21/26506 ,  H01L21/76254

Abstract: It is an object of the present invention to provide a method for manufacturing an SOI substrate having an SOI layer that can be used in practical applications with high yield even when a flexible substrate such as a glass substrate or a plastic substrate is used. Further, it is another object of the present invention to provide a method for manufacturing a thin semiconductor device using such an SOI substrate with high yield. When a single-crystal semiconductor substrate is bonded to a flexible substrate having an insulating surface and the single-crystal semiconductor substrate is separated to manufacture an SOI substrate, one or both of bonding surfaces are activated, and then the flexible substrate having an insulating surface and the single-crystal semiconductor substrate are attached to each other.

Abstract translation: 本发明的目的是提供一种制造具有SOI层的SOI衬底的方法，该SOI衬底即使在使用诸如玻璃衬底或塑料衬底的柔性衬底时，也可以在实际应用中以高产率使用。 此外，本发明的另一个目的是提供一种以高产率制造使用这种SOI衬底的薄半导体器件的方法。 当将单晶半导体衬底接合到具有绝缘表面的柔性衬底并且分离单晶半导体衬底以制造SOI衬底时，一个或两个键合表面被激活，然后柔性衬底具有绝缘表面 并且单晶半导体衬底彼此附接。