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公开(公告)号:US08599571B2
公开(公告)日:2013-12-03
申请号:US12279915
申请日:2007-04-18
申请人: Hidenobu Nishikawa , Daido Komyoji , Atsunobu Iwamoto , Hiroyuki Yamada , Shuichi Takeda , Shigeru Kondou
发明人: Hidenobu Nishikawa , Daido Komyoji , Atsunobu Iwamoto , Hiroyuki Yamada , Shuichi Takeda , Shigeru Kondou
CPC分类号: H05K1/0271 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/19105 , H05K3/284 , H05K2201/09036 , H05K2201/09063 , H05K2201/10674 , H01L2924/00014 , H01L2924/00
摘要: Memory card (1) includes at least semiconductor chip (3), circuit board (2) with semiconductor chip (3) mounted on main surface (21), having at least rigidity reducing portion (23) formed in main surface (21) or in a linear region of surface (22) opposite to the main surface, and cover portion (71) for covering semiconductor chip (3) on main surface (21) of circuit board (2), wherein circuit board (2) has a plurality of convex regions (201) which flex in a convex shape toward main surface (21) due to rigidity reducing portion (23).
摘要翻译: 存储卡(1)至少包括半导体芯片(3),具有安装在主表面(21)上的半导体芯片(3)的电路板(2),至少具有形成在主表面(21)中的刚性减小部分(23)或 在与所述主表面相对的表面(22)的直线区域中,以及用于覆盖电路板(2)的主表面(21)上的半导体芯片(3)的盖部分(71),其中电路板(2)具有多个 由刚性减小部分(23)向主表面(21)弯曲成凸形的凸区域(201)。
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公开(公告)号:US08035225B2
公开(公告)日:2011-10-11
申请号:US11722925
申请日:2005-12-28
IPC分类号: H01L23/52
CPC分类号: H01L24/13 , H01L24/17 , H01L24/73 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/0554 , H01L2224/05568 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/10135 , H01L2224/1134 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/17517 , H01L2224/32225 , H01L2224/73204 , H01L2224/81136 , H01L2224/81139 , H01L2224/81191 , H01L2224/81801 , H01L2224/83192 , H01L2225/06517 , H01L2225/06527 , H01L2225/06593 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要: A semiconductor chip dual-sided assembly which has a higher degree of reliability of connections between semiconductor chips and a circuit substrate is realized. This is achieved by the assembly including a plurality of upper side pads (2a) provided on a substrate upper surface (1a); a plurality of lower side pads (2b) provided on a substrate lower surface (1b) corresponding to the upper side pads (2a) across the substrate (1), respectively; a first semiconductor chip (4) having first bumps (8a) joined to the upper side pads (2a), respectively; and a second semiconductor chip (5) having second bumps (8b) joined to the lower side pads (2b), respectively.
摘要翻译: 实现了半导体芯片与电路基板之间的连接可靠性更高的半导体芯片双面组件。 这通过包括设置在基板上表面(1a)上的多个上侧焊盘(2a)的组件实现; 多个下侧焊盘(2b)分别设置在跨越衬底(1)的与上侧衬垫(2a)相对应的衬底下表面(1b)上; 第一半导体芯片(4),其具有分别与上侧焊盘(2a)接合的第一凸起(8a) 以及第二半导体芯片(5),其具有分别与下侧焊盘(2b)接合的第二凸起(8b)。
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公开(公告)号:US20100193927A1
公开(公告)日:2010-08-05
申请号:US12160954
申请日:2007-01-31
IPC分类号: H01L23/538 , H01L21/77
CPC分类号: G06K19/077 , H01L21/563 , H01L23/3135 , H01L23/5388 , H01L24/16 , H01L24/29 , H01L24/81 , H01L24/83 , H01L24/90 , H01L24/95 , H01L25/0655 , H01L2224/05001 , H01L2224/05023 , H01L2224/05568 , H01L2224/16225 , H01L2224/26175 , H01L2224/27013 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75252 , H01L2224/81191 , H01L2224/8121 , H01L2224/81815 , H01L2224/83192 , H01L2224/83385 , H01L2224/83851 , H01L2224/90 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/16152 , H01L2924/181 , H01L2924/19043 , H01L2924/19105 , H01L2924/30105 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要: A memory card includes a circuit board, a first semiconductor chip mounted on the circuit board with a bump sandwiched between the first semiconductor chip and the circuit board, a second semiconductor chip mounted on the circuit board with a bump sandwiched between the second semiconductor chip and the circuit board with a clearance not greater than 1 mm between the first semiconductor chip and the second semiconductor chip, a first sealing resin layer surrounding the bump and existing between the first semiconductor chip and the circuit board, and a second sealing resin layer surrounding the bump and existing between the second semiconductor chip and the circuit board, and a cover covering the first semiconductor chip, the second semiconductor chip on a principal face of the circuit board.
摘要翻译: 存储卡包括电路板,安装在电路板上的第一半导体芯片,其中夹在第一半导体芯片和电路板之间的凸块;第二半导体芯片,安装在电路板上,凸块夹在第二半导体芯片和 在第一半导体芯片和第二半导体芯片之间具有不大于1mm的间隙的电路板,围绕凸块并存在于第一半导体芯片和电路板之间的第一密封树脂层和围绕第一半导体芯片的电路板的第二密封树脂层 并且存在于第二半导体芯片和电路板之间的凸起,以及覆盖第一半导体芯片的盖,电路板的主面上的第二半导体芯片。
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公开(公告)号:US07355126B2
公开(公告)日:2008-04-08
申请号:US10311476
申请日:2001-06-14
IPC分类号: H05K1/16
CPC分类号: H01L24/32 , H01L21/563 , H01L23/3142 , H01L24/06 , H01L24/14 , H01L24/29 , H01L24/81 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/06136 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/16227 , H01L2224/26145 , H01L2224/26175 , H01L2224/27013 , H01L2224/32225 , H01L2224/45144 , H01L2224/73203 , H01L2224/73204 , H01L2224/81136 , H01L2224/81191 , H01L2224/81801 , H01L2224/83051 , H01L2224/83192 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2924/00012
摘要: An electronic component and a circuit formation article are bonded together with a bonding material containing resin interposed therebetween. In a state that bumps of an electronic-component bonding region and electrodes of the circuit formation article are in mutual electrical contact, the electronic component and the circuit formation article are thermocompression-bonded to each other upon curing of the bonding material. A bonding-material flow regulating member of the electronic-component bonding region regulates flow of the bonding material toward a peripheral portion of the electronic-component bonding region during bonding of the circuit formation article to the electronic component.
摘要翻译: 电子部件和电路形成用物品通过含有树脂的接合材料接合在一起。 在电子部件接合区域和电路形成用品的电极的凸点相互电接触的状态下,电子部件和电路形成用品在接合材料固化时彼此热压接合。 电子部件接合区域的接合材料流动调节部件在电路形成物品与电子部件接合期间调节接合材料向电子部件接合区域的周边部分的流动。
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公开(公告)号:US07076867B2
公开(公告)日:2006-07-18
申请号:US10327176
申请日:2002-12-24
申请人: Akihiro Yamamoto , Sakae Kobayashi , Yoshikazu Yoshimura , Naoto Hosotani , Kenji Takahashi , Hiroshi Nasu , Naomi Kaino , Hidenobu Nishikawa
发明人: Akihiro Yamamoto , Sakae Kobayashi , Yoshikazu Yoshimura , Naoto Hosotani , Kenji Takahashi , Hiroshi Nasu , Naomi Kaino , Hidenobu Nishikawa
IPC分类号: H05K3/30
CPC分类号: H01L21/67092 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49169 , Y10T29/5313 , Y10T29/5317 , Y10T156/1084
摘要: A pressurizing method for pressurizing a second component arranged on a first component, against the first component by using a pressurizing apparatus having a stage on which the first component is mounted, a tool, and a protection sheet supplying section. The tool is disposed so as to face the stage and moved between a first position at which the tool faces the first and second components while spaced therefrom, and a second position at which the tool is biased toward the stage to pressurize the second component against the first component. When the tool is at the second position, the protection sheet supplying section supplies a protection sheet so that the protection sheet is placed between the second component and the tool.
摘要翻译: 一种加压方法,用于通过使用具有安装有所述第一部件的台阶的加压装置,工具和保护片材供给部来将布置在第一部件上的第二部件加压抵靠所述第一部件。 该工具被设置为面对台架并且在第一位置和第二位置之间移动,在该第一位置,工具面向第一和第二部件同时与第一位置隔开;第二位置,工具被偏压到台阶以对第二部件施加压力, 第一部分。 当工具处于第二位置时,保护片供给部提供保护片,使得保护片放置在第二部件和工具之间。
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公开(公告)号:US20050224974A1
公开(公告)日:2005-10-13
申请号:US11150383
申请日:2005-06-13
CPC分类号: H01L24/31 , H01L21/563 , H01L23/295 , H01L24/11 , H01L24/13 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/05624 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/16225 , H01L2224/29082 , H01L2224/29083 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29344 , H01L2224/2949 , H01L2224/29499 , H01L2224/32225 , H01L2224/45144 , H01L2224/48624 , H01L2224/73104 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/78301 , H01L2224/81048 , H01L2224/81191 , H01L2224/81801 , H01L2224/81903 , H01L2224/83048 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83194 , H01L2224/83851 , H01L2224/83856 , H01L2224/9211 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/14 , H01L2924/181 , H01L2924/3011 , H01L2924/3511 , H05K3/323 , Y10T29/4913 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is connected, the bumps are compressed, and the insulating resin is hardened.
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