SOI SUBSTRATE AND METHOD FOR MANUFACTURING SOI SUBSTRATE
    31.
    发明申请
    SOI SUBSTRATE AND METHOD FOR MANUFACTURING SOI SUBSTRATE 审中-公开
    SOI衬底和制造SOI衬底的方法

    公开(公告)号:US20120098086A1

    公开(公告)日:2012-04-26

    申请号:US13339427

    申请日:2011-12-29

    IPC分类号: H01L21/762 H01L29/12

    摘要: An SOI substrate and a manufacturing method of the SOI substrate, by which enlargement of the substrate is possible and its productivity can be increased, are provided. A step (A) of cutting a first single crystal silicon substrate to form a second single crystal silicon substrate which has a chip size; a step (B) of forming an insulating layer on one surface of the second single crystal silicon substrate, and forming an embrittlement layer in the second single crystal substrate; and a step (C) of bonding a substrate having an insulating surface and the second single crystal silicon substrate with the insulating layer therebetween, and conducting heat treatment to separate the second single crystal silicon substrate along the embrittlement layer, and forming a single crystal silicon thin film on the substrate having an insulating surface, are conducted.

    摘要翻译: 提供SOI衬底和SOI衬底的制造方法,通过其可以扩大衬底并提高其生产率。 一种切割第一单晶硅衬底以形成具有芯片尺寸的第二单晶硅衬底的步骤(A); 在所述第二单晶硅衬底的一个表面上形成绝缘层并在所述第二单晶衬底中形成脆化层的步骤(B); 以及将具有绝缘表面的衬底和所述第二单晶硅衬底之间的绝缘层接合在其间的步骤(C),并且进行热处理以沿着所述脆化层分离所述第二单晶硅衬底,并且形成单晶硅 进行具有绝缘面的基板上的薄膜。

    PHOTOELECTRIC CONVERSION DEVICE AND METHOD FOR MANUFACTURING THE SAME
    33.
    发明申请
    PHOTOELECTRIC CONVERSION DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    光电转换装置及其制造方法

    公开(公告)号:US20100307559A1

    公开(公告)日:2010-12-09

    申请号:US12793329

    申请日:2010-06-03

    IPC分类号: H01L31/042 H01L31/18

    摘要: An object is to provide a photoelectric conversion device whose mechanical strength is increased without complicating a manufacturing process. The photoelectric conversion device includes a first cell having a photoelectric conversion function, a second cell having a photoelectric conversion function, and a structure body including a fibrous body which firmly attaches the first cell and the second cell. As a result, p-i-n junctions are bonded with the structure body in which the fibrous body is impregnated with an organic resin, which is a so-called prepreg. Thus, a photoelectric conversion device whose mechanical strength is increased can be realized while the manufacturing cost is reduced.

    摘要翻译: 本发明的目的是提供一种其机械强度增加而不会使制造过程复杂化的光电转换装置。 光电转换装置包括具有光电转换功能的第一单元,具有光电转换功能的第二单元,以及包括牢固地附接第一单元和第二单元的纤维体的结构体。 结果,p-i-n结与其中纤维体被浸渍有机树脂的结构体结合,所述有机树脂是所谓的预浸料。 因此,可以实现机械强度提高的光电转换装置,同时降低制造成本。

    DISPLAY MODULE, AND CELLULAR PHONE AND ELECTRONIC DEVICE PROVIDED WITH DISPLAY MODULE
    35.
    发明申请
    DISPLAY MODULE, AND CELLULAR PHONE AND ELECTRONIC DEVICE PROVIDED WITH DISPLAY MODULE 有权
    显示模块,和显示模块提供的蜂窝电话和电子设备

    公开(公告)号:US20070035473A1

    公开(公告)日:2007-02-15

    申请号:US11464015

    申请日:2006-08-11

    IPC分类号: G09G5/00

    摘要: It is an object to achieve downsizing and a thin shape of a display module and an electronic device provided with the display module. The display module includes a first display panel in which a first display screen is formed on one main side; and a second display panel that is smaller than and overlapped with the first display panel, in which a second display screen is formed on an opposite side of the one main side. The display module includes, over a sealing substrate of the first display panel and/or the second display panel, at least one integrated circuit, which is connected to input terminals of the first display panel and the second display panel and controls operation of the both panels, arranged in a peripheral portion of the second display panel, which is a surface on an opposite side of a display surface of the first display panel.

    摘要翻译: 本发明的目的是实现显示模块的小型化和薄型化,以及具备显示模块的电子装置。 显示模块包括第一显示面板,第一显示屏幕形成在一个主侧面上; 以及与所述第一显示面板小并重叠的第二显示面板,其中在所述一个主侧的相对侧形成有第二显示屏。 显示模块包括在第一显示面板和/或第二显示面板的密封基板上方的至少一个集成电路,其连接到第一显示面板和第二显示面板的输入端子并且控制两者的操作 布置在第二显示面板的周边部分中的面板,其是第一显示面板的显示表面的相对侧上的表面。

    THIN SEMICONDUCTOR DEVICE AND OPERATION METHOD OF THIN SEMICONDUCTOR DEVICE
    36.
    发明申请
    THIN SEMICONDUCTOR DEVICE AND OPERATION METHOD OF THIN SEMICONDUCTOR DEVICE 审中-公开
    薄半导体器件的薄膜半导体器件和操作方法

    公开(公告)号:US20120175753A1

    公开(公告)日:2012-07-12

    申请号:US13424737

    申请日:2012-03-20

    IPC分类号: H01L27/02

    摘要: The present invention provides a thin semiconductor device in which its security such as prevention of counterfeit or information leakage is to be enhanced. One feature of the present invention is a thin semiconductor device in which a plurality of thin film integrated circuits are mounted and in which at least one integrated circuit is different from the other integrated circuits in any one of a specification, layout, frequency for transmission or reception, a memory, a communication means, a communication rule and the like. According to the present invention, a thin semiconductor device tag having the plurality of thin film integrated circuits communicates with a reader/writer and at least one of the thin film integrated circuits receives a signal to write information in a memory, and the information written in the memory determines which of the thin film integrated circuits communicates.

    摘要翻译: 本发明提供一种薄型半导体器件,其中要防止伪造或信息泄漏的安全性得到提高。 本发明的一个特征是薄型半导体器件,其中安装了多个薄膜集成电路,并且其中至少一个集成电路与其他集成电路不同,其中任何一个规格,布局,传输频率或 接收,存储器,通信装置,通信规则等。 根据本发明,具有多个薄膜集成电路的薄的半导体器件标签与读取器/写入器通信,并且至少一个薄膜集成电路接收将信息写入存储器的信号,并且写入的信息 存储器确定薄膜集成电路中的哪一个通信。

    PHOTOVOLTAIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
    38.
    发明申请
    PHOTOVOLTAIC DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    光伏器件及其制造方法

    公开(公告)号:US20110306162A1

    公开(公告)日:2011-12-15

    申请号:US13213636

    申请日:2011-08-19

    IPC分类号: H01L31/02

    摘要: A photovoltaic device uses a single crystal or polycrystalline semiconductor layer which is separated from a single crystal or polycrystalline semiconductor substrate as a photoelectric conversion layer and has a SOI structure in which the semiconductor layer is bonded to a substrate having an insulating surface or an insulating substrate. A single crystal semiconductor layer which is a separated surface layer part of a single crystal semiconductor substrate and is transferred is used as a photoelectric conversion layer and includes an impurity semiconductor layer to which hydrogen or halogen is added on a light incidence surface or on an opposite surface. The semiconductor layer is fixed to a substrate having an insulating surface or an insulating substrate.

    摘要翻译: 光电器件使用与单晶或多晶半导体衬底分离的单晶或多晶半导体层作为光电转换层,并具有其中半导体层与具有绝缘表面的衬底或绝缘衬底接合的SOI结构 。 作为单晶半导体基板的分离表面层部分并被转印的单晶半导体层被用作光电转换层,并且包括在光入射表面上或在相对的位置上添加氢或卤素的杂质半导体层 表面。 半导体层被固定到具有绝缘表面的基板或绝缘基板。

    PAPER MONEY, COIN, VALUABLE INSTRUMENT, CERTIFICATES, TAG, LABEL, CARD, PACKING CONTAINERS, DOCUMENTS, RESPECTIVELY INSTALLED WITH INTEGRATED CIRCUIT
    39.
    发明申请
    PAPER MONEY, COIN, VALUABLE INSTRUMENT, CERTIFICATES, TAG, LABEL, CARD, PACKING CONTAINERS, DOCUMENTS, RESPECTIVELY INSTALLED WITH INTEGRATED CIRCUIT 有权
    纸币,硬币,有价值的仪器,证书,标签,标签,卡,包装容器,文件,具体地安装在一体化电路

    公开(公告)号:US20110248089A1

    公开(公告)日:2011-10-13

    申请号:US13164797

    申请日:2011-06-21

    IPC分类号: G06K19/077

    摘要: Although a product having such the IC chip has been diffused, information on the product may be capable of being perceived, abstracted, falsified, or the like by a third person with his external device during distribution of the product or after purchase of the product. Further, privacy may be seriously infringed. Paper money, various products, and the like are disclosed according to the present invention with an integrated circuit device having a switching memory for controlling reading and writing of information (lock/unlock of information) in order to protect the information recorded and stored in the integrated circuit such as an IC chip installed to the product or the like.

    摘要翻译: 虽然具有这样的IC芯片的产品已经被散布,但是在产品分发期间或购买产品之后,产品的信息可能被外部设备的第三人在被感知,抽象,伪造等方面被感知,抽象化,伪造等。 此外,隐私可能会严重侵犯。 根据本发明公开了纸币,各种产品等,其具有集成电路装置,具有用于控制信息的读取和写入(信息的锁定/解锁)的切换存储器,以便保护记录和存储在信息中的信息 集成电路,例如安装在产品上的IC芯片等。

    LIGHT-EMITTING DEVICE AND DISPLAY DEVICE
    40.
    发明申请
    LIGHT-EMITTING DEVICE AND DISPLAY DEVICE 有权
    发光装置和显示装置

    公开(公告)号:US20110165918A1

    公开(公告)日:2011-07-07

    申请号:US13047009

    申请日:2011-03-14

    IPC分类号: H04W88/02

    摘要: Although an organic resin substrate is highly effective at reducing the weight and improving the shock resistance of a display device, it is required to improve the moisture resistance of the organic resin substrate for the sake of maintaining the reliability of an EL element. Hard carbon films are formed to cover a surface of the organic resin substrate and outer surfaces of a sealing member. Typically, DLC (Diamond like Carbon) films are used as the carbon films. The DLC films have a construction where carbon atoms are bonded into an SP3 bond in terms of a short-distance order, although the films have an amorphous construction from a macroscopic viewpoint. The DLC films contain 95 to 70 atomic % carbon and 5 to 30 atomic % hydrogen, so that the DLC films are very hard and minute and have a superior gas barrier property and insulation performance.

    摘要翻译: 尽管有机树脂基材在降低重量和提高显示装置的抗冲击性方面是高度有效的,但是为了保持EL元件的可靠性,需要提高有机树脂基板的耐湿性。 形成硬碳膜以覆盖有机树脂基板的表面和密封部件的外表面。 通常,使用DLC(类金刚石碳)作为碳膜。 DLC膜具有以短距离顺序将碳原子键合成SP3键的结构,尽管从宏观的观点来看,该膜具有非晶结构。 DLC膜含有95至70原子%的碳和5至30原子%的氢,使得DLC膜非常硬且分钟,并且具有优异的阻气性和绝缘性能。