公开(公告)号：US20150340248A1

公开(公告)日：2015-11-26

申请号：US14817624

申请日：2015-08-04

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Tsung-Hsien Tsai ,  Chih-Hsien Chiu ,  Hsin-Lung Chung ,  Chien-Cheng Lin

IPC: H01L21/48 ,  H01L21/78 ,  H01L21/56

CPC classification number: H01L21/4853 ,  H01L21/561 ,  H01L21/563 ,  H01L21/78 ,  H01L23/552 ,  H01L24/19 ,  H01L24/20 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/19 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A package having ESD (electrostatic discharge) and EMI (electromagnetic interference) preventing functions includes: a substrate unit having a ground structure and an I/O structure disposed therein; at least a semiconductor component disposed on a surface of the substrate unit and electrically connected to the ground structure and the I/O structure; an encapsulant covering the surface of the substrate unit and the semiconductor component; and a metal layer disposed on exposed surfaces of the encapsulant and side surfaces of the substrate unit and electrically insulated from the ground structure, thereby protecting the semiconductor component against ESD and EMI so as to improve the product yield and reduce the risk of short circuits.

Abstract translation: 具有ESD（静电放电）和EMI（电磁干扰）防止功能的封装包括：具有接地结构和设置在其中的I / O结构的衬底单元; 至少一个半导体部件，设置在所述基板单元的表面上并电连接到所述接地结构和所述I / O结构; 覆盖所述基板单元和所述半导体部件的表面的密封剂; 以及金属层，其设置在基板单元的密封剂和侧表面的暴露表面上并与基底结构电绝缘，从而保护半导体部件免受ESD和EMI，从而提高产品产量并降低短路的风险。

公开(公告)号：US20140312473A1

公开(公告)日：2014-10-23

申请号：US13919176

申请日：2013-06-17

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Kuang-Neng Chung ,  Hsin-Lung Chung ,  Tien-Chung Huang ,  Tsung-Hsien Hsu

IPC: H01L23/552 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2224/85

Abstract: A fabrication method of a semiconductor package is disclosed, which includes the steps of: providing a substrate having at least a carrying region and a cutting region defined on a surface thereof, wherein the cutting region surrounds the carrying region; disposing at least an electronic element on the carrying region of the substrate; disposing a shield having a recess portion and at least a positioning member extending outwards, on the carrying region of the substrate with the electronic element received in the recess portion and the positioning member extending outwards to the cutting region; and performing a cutting process along the cutting region to remove portions of the positioning member and the substrate. Therefore, the shield is precisely positioned on the substrate.

Abstract translation: 公开了一种半导体封装的制造方法，其包括以下步骤：提供至少具有承载区域和限定在其表面上的切割区域的基板，其中所述切割区域围绕所述承载区域; 在所述基板的承载区域上设置至少一个电子元件; 在所述基板的承载区域设置具有凹部的至少一个定位构件的屏蔽件，并且所述电子元件容纳在所述凹部中，并且所述定位构件向外延伸到所述切割区域; 以及沿切割区域执行切割处理以去除定位构件和基底的部分。 因此，屏蔽件精确地定位在基板上。

公开(公告)号：US20140203771A1

公开(公告)日：2014-07-24

申请号：US13960033

申请日：2013-08-06

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Tsung-Hsien Hsu ,  Hsin-Lung Chung ,  Te-Fang Chu ,  Chia-Yang Chen ,  Kwok-Yan Lam

IPC: H02J7/02 ,  H05K3/30 ,  C09J11/04

CPC classification number: H02J50/10 ,  C09J11/04 ,  H02J7/025 ,  H02J50/40 ,  H02J50/70 ,  Y10T29/4902

Abstract: An electronic package is provided, which includes: a substrate, a charging module and a coil module disposed on the substrate, and an encapsulant formed on the substrate for encapsulating the charging module and the coil module. The coil module has a plurality of coils having an opening, an adhesive compound formed on the coils in a manner that the opening of the coils is exposed from the adhesive compound, and a magnet inserted in the opening of the coils. Further, the adhesive compound comprises a metal oxide. Compared with the conventional ferrite, the adhesive compound is flexible and not easy to crack or break during transportation or assembly, thereby greatly improving the charging efficiency of the electronic package.

Abstract translation: 提供了一种电子封装，其包括：基板，充电模块和设置在基板上的线圈模块，以及形成在基板上的密封剂，用于封装充电模块和线圈模块。 线圈模块具有多个具有开口的线圈，形成在线圈上的粘合剂化合物以使得线圈的开口从粘合剂化合物暴露出来，以及插入在线圈的开口中的磁体。 此外，粘合剂化合物包含金属氧化物。 与常规铁氧体相比，粘合剂具有柔韧性，在运输或装配过程中不容易破裂或破裂，极大地提高了电子包装的充电效率。

公开(公告)号：US20140203395A1

公开(公告)日：2014-07-24

申请号：US14087554

申请日：2013-11-22

Applicant: Siliconware Precision industries Co., Ltd

Inventor： Tsung-Hsien Tsai ,  Heng-Cheng Chu ,  Chien-Cheng Lin ,  Chih-Hsien Chiu ,  Hsin-Lung Chung ,  Yude Chu

IPC: H01L27/06 ,  H01L49/02

CPC classification number: H01L23/66 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/64 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L25/16 ,  H01L25/50 ,  H01L28/00 ,  H01L2223/6661 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes: a substrate having a plurality of conductive lands and a plurality of bonding pads surrounding the conductive lands formed on a surface thereof; a plurality of passive devices mounted on the conductive lands; an insulation layer formed on the surface and having a portion of the passive devices embedded therein; a semiconductor chip mounted on a top surface of the insulation layer; a plurality of bonding wires electrically connecting the semiconductor chip and the bonding pads; an encapsulant formed on the surface of the substrate to encapsulate the insulation layer, the bonding wires and the semiconductor chip, wherein a region of the semiconductor chip projected onto the substrate covers a portion of an outermost one of the passive devices. Therefore, the mounting density of the passive devices is improved.

Abstract translation: 提供半导体封装及其制造方法。 半导体封装包括：具有多个导电焊盘的衬底和围绕形成在其表面上的导电焊盘的多个焊盘; 安装在导电焊盘上的多个无源器件; 绝缘层，其形成在所述表面上并且具有嵌入其中的无源器件的一部分; 安装在所述绝缘层的顶表面上的半导体芯片; 电连接半导体芯片和接合焊盘的多个接合线; 形成在基板的表面上以封装绝缘层，接合线和半导体芯片的密封剂，其中投射到基板上的半导体芯片的区域覆盖无源器件中最外面的一个的一部分。 因此，无源器件的安装密度提高。

公开(公告)号：US20140080265A1

公开(公告)日：2014-03-20

申请号：US14086135

申请日：2013-11-21

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD

Inventor： Ching-Hua Chen ,  Heng-Cheng Chu ,  Hsin-Lung Chung ,  Chih-Hsien Chiu ,  Chia-Yang Chen

IPC: H01L21/56

CPC classification number: H01L21/56 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2221/68345 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49174 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A carrier-free semiconductor package includes a circuit structure having an insulating layer and a circuit layer embedded in the insulating layer and having a plurality of conductive traces and RF (radio frequency) traces, a chip disposed on a first surface of the insulating layer and electrically connected to the conductive traces, an encapsulant covering the chip and the circuit layer, a ground layer formed on a second surface of the insulating layer opposite to the first surface, and a plurality of solder balls disposed on the conductive traces or terminals on the conductive traces, wherein portions of the solder balls electrically connect the ground layer so as to allow the RF traces and the ground layer to form a microstrip line having an RF function, thus obtaining a single-layer carrier-free semiconductor package having low cost and simplified RF design.

Abstract translation: 一种无载体半导体封装，包括具有绝缘层和嵌入绝缘层中的电路层并具有多个导电迹线和RF（射频）迹线的电路结构，设置在该绝缘层的第一表面上的芯片，以及 电连接到导电迹线，覆盖芯片和电路层的密封剂，形成在与第一表面相对的绝缘层的第二表面上的接地层和设置在导电迹线上的多个焊球 导电迹线，其中焊球的部分电连接接地层，以便允许RF迹线和接地层形成具有RF功能的微带线，从而获得具有低成本的单层无载流子半导体封装， 简化射频设计。