公开(公告)号：US07531876B2

公开(公告)日：2009-05-12

申请号：US11230624

申请日：2005-09-21

申请人： Ichiro Omura ,  Kenji Takahashi ,  Chiaki Takubo ,  Hideo Aoki ,  Hideo Numata ,  Mie Matsuo ,  Hirokazu Ezawa ,  Susumu Harada ,  Hisashi Kaneko ,  Hiroshi Ikenoue ,  Kenichi Matsushita

发明人： Ichiro Omura ,  Kenji Takahashi ,  Chiaki Takubo ,  Hideo Aoki ,  Hideo Numata ,  Mie Matsuo ,  Hirokazu Ezawa ,  Susumu Harada ,  Hisashi Kaneko ,  Hiroshi Ikenoue ,  Kenichi Matsushita

IPC分类号： H01L23/62

CPC分类号： H01L29/41766 ,  H01L23/481 ,  H01L24/14 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L29/7809 ,  H01L29/7811 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05568 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05005 ,  H01L2224/05541 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device which is compact and thin in size, low in resistance of a current path and parasitic inductance and excellent in reliability is provided. This semiconductor device comprises a semiconductor substrate, a first main electrode which is formed on a front surface of the semiconductor substrate, a second main electrode which is formed on a rear surface of the semiconductor substrate, and a conducting portion which is formed in a direction to pierce through the semiconductor substrate, wherein the second main electrode is extracted to the front surface of the semiconductor substrate via the conducting portion. And, the conducting portion is a through via which has a through hole formed through the semiconductor substrate in its thickness direction and a conductive portion which is formed in the through hole and connected to the second main electrode.

摘要翻译： 提供了一种尺寸小型化，电流通路电阻低，寄生电感小，可靠性优异的半导体装置。 该半导体器件包括半导体衬底，形成在半导体衬底的前表面上的第一主电极，形成在半导体衬底的后表面上的第二主电极和形成在半导体衬底的背面上的导电部分 穿过半导体衬底，其中第二主电极经由导电部分被提取到半导体衬底的前表面。 并且，导电部是贯通通孔，该通孔在其厚度方向上形成有通过半导体基板的通孔，以及形成在通孔中并连接到第二主电极的导电部。

公开(公告)号：US07359935B1

公开(公告)日：2008-04-15

申请号：US10324764

申请日：2002-12-20

申请人： Daniel Paul Karipides ,  Susumu Harada

发明人： Daniel Paul Karipides ,  Susumu Harada

IPC分类号： G96F15/16

CPC分类号： G06F17/30893 ,  H04L67/02 ,  H04L67/14 ,  H04L67/22 ,  Y10S707/99936

摘要： A network session recording and parsing system (“SRP System”) captures direct user interactions passed between the web server and a browser, the SRP System and information from the web site's server-side application layers. In one embodiment, the SRP System includes two main components, data recording hooks and a parser. The SRP System includes a data recording hooks library that provides the ability to implement a dynamic, web-based application and gather a wide-range of user session history information. The SRP System parser analyzes the logged information from the data recording hooks and re-creates a history, with a desired level of contextual detail, of every individual user's session. In one embodiment, the SRP System embodies a flexible design system that allows a designer to customize the type of information recorded. An embodiment of the data recording hooks provides a virtually unnoticeable impact to browser-Web server request and response times.

摘要翻译： 网络会话记录和解析系统（“SRP系统”）捕获在Web服务器和浏览器之间传递的直接用户交互，SRP系统和来自网站的服务器端应用层的信息。 在一个实施例中，SRP系统包括两个主要组件，数据记录钩和解析器。 SRP系统包括一个数据记录挂钩库，提供实现一个动态的基于Web的应用程序的能力，并收集广泛的用户会话历史信息。 SRP系统解析器从数据记录挂钩分析记录的信息，并重新创建每个用户会话的历史记录以及所需的上下文细节级别。 在一个实施例中，SRP系统体现了灵活的设计系统，其允许设计者定制记录的信息的类型。 数据记录挂钩的实施例为浏览器 - Web服务器请求和响应时间提供了几乎不明显的影响。

公开(公告)号：US06458916B1

公开(公告)日：2002-10-01

申请号：US09940430

申请日：2001-08-29

申请人： Shuji Yamaguchi ,  Hidekazu Nakamoto ,  Susumu Harada ,  Norifumi Maeda

发明人： Shuji Yamaguchi ,  Hidekazu Nakamoto ,  Susumu Harada ,  Norifumi Maeda

IPC分类号： C08G6300

CPC分类号： B01J8/1836 ,  B01J8/009 ,  B01J8/0285 ,  B01J8/067 ,  B01J2208/00132 ,  B01J2208/0015 ,  B01J2208/00522 ,  C08G63/183 ,  C08G63/785

摘要： An apparatus for continuously producing polybutylene terephthalate, which comprises a first reactor for reacting an aromatic dicarboxylic acid with a glycol, thereby producing an oligomer, a second reactor for polycondensating the oligomer, thereby preparing a low polymerization product, and a third reactor for further polycondensating the low polymerization product, thereby producing a high molecular weight polyester, where the second reactor is a vertical, cylindrical polymerization vessel having a plurality of concentrical partitioned reaction compartments therein, each of the reaction compartments being provided with stirring blades and a heater, and an outlet for volatile matters being provided at the upper part of the vessel. The second reactor contributes to efficient and continuous production of polybutylene terephthalate having a good quality.

摘要翻译： 一种用于连续生产聚对苯二甲酸丁二酯的设备，其包括用于使芳族二羧酸与二醇反应的第一反应器，从而制备低聚物，将低聚物缩聚的第二反应器，从而制备低聚合产物，以及用于进一步缩聚的第三反应器 低聚合产物，由此生产高分子量聚酯，其中第二反应器是具有多个同心分隔的反应室的垂直圆柱形聚合容器，每个反应室设有搅拌叶片和加热器， 在容器的上部设置挥发性物质的出口。 第二反应器有助于有效和连续地生产质量好的聚对苯二甲酸丁二醇酯。

公开(公告)号：US5012426A

公开(公告)日：1991-04-30

申请号：US340067

申请日：1989-04-18

申请人： Susumu Harada ,  Hiroshi Kumazaki

发明人： Susumu Harada ,  Hiroshi Kumazaki

IPC分类号： B22D17/26 ,  B29C45/56 ,  B29C45/67 ,  B29C45/70 ,  B29C45/76 ,  B29C45/77 ,  B29C45/80

CPC分类号： B29C45/7653 ,  B29C45/561

摘要： In a method of controlling an injection compression molding of the type wherein resin is injected into a mold cavity while the metal molds are separated away a little, and thereafter the metal molds are clamped together, a pulsating mold clamping pressure is applied to the metal molds during compression. The apparatus for controlling injection compression molding comprises a mold clamping pressure setter for outputting a mold clamping signal, a pulse waveform setter for generating a pulse signal, a signal calculating unit connected to receive the mold clamping signal and the pulse signal for outputting a mold clamping control signal, a mold clamping device, and a valve responsive to the mold clamping control signal for controlling a pressurized operating fluid supplied to the mold clamping device.

摘要翻译： 在一种控制注射压缩成型的方法中，其中将树脂注射到模具腔中，同时金属模具被分离一点，然后金属模夹紧在一起，将脉动模具夹紧压力施加到金属模具 在压缩期间。 用于控制注射压缩成型的装置包括用于输出合模信号的模具夹紧压力设定器，用于产生脉冲信号的脉冲波形设定器，连接以接收合模信号的信号计算单元和用于输出合模的脉冲信号 控制信号，模具夹紧装置和响应于模具夹持控制信号的阀，用于控制供给到模具夹紧装置的加压工作流体。

公开(公告)号：US5005116A

公开(公告)日：1991-04-02

申请号：US267254

申请日：1988-11-04

申请人： Shigeru Fujita ,  Hideo Tanaka ,  Susumu Harada

发明人： Shigeru Fujita ,  Hideo Tanaka ,  Susumu Harada

IPC分类号： B29C45/76 ,  G05B19/10 ,  G05B19/409

CPC分类号： B29C45/766 ,  G05B19/108 ,  G05B19/409 ,  B29C2045/7606 ,  G05B2219/23029 ,  G05B2219/36168 ,  G05B2219/36171 ,  G05B2219/45244

摘要： In an input display apparatus including a display member adapted to display a plurality of set items, and a transparent panel including key elements and superposed on the display member, there are provided a profile controlled graphic display picture wherein such operating conditions as a speed, pressure and number of revolutions of a screw during one operation step of an injection molding machine are displayed in multi-stages in accordance with an operating position of the screw, and level changing means for changing the levels of the profile display picture in accordance with the magnitude of a changed value when an operating condition of the injection molding machine is changed. According to a modification, the display surface of the display member is divided into upper and lower sections. The upper section is provided with the function of an increment key and the lower section is provided with the function of a decrement key.

摘要翻译： 在包括适于显示多个设定项目的显示构件的输入显示装置和包括键元件并且重叠在显示构件上的透明面板上设置有轮廓控制图形显示画面，其中诸如速度，压力 并且根据螺杆的操作位置以多级显示注射成型机的一个操作步骤期间的螺杆的转数，以及用于根据幅度改变轮廓显示图像的电平的电平改变装置 当注射成型机的操作条件改变时具有变化的值。 根据变形例，显示部件的显示面被分割为上部和下部。 上部具有增量键的功能，下部具有递减键的功能。

公开(公告)号：US4844847A

公开(公告)日：1989-07-04

申请号：US143621

申请日：1988-01-13

申请人： Susumu Harada

发明人： Susumu Harada

IPC分类号： B29C45/50 ,  B29C45/57 ,  B29C45/77 ,  B29C45/78

CPC分类号： B29C45/77 ,  B29C45/78 ,  B29C2045/776

摘要： In a method of controlling an injection molding machine wherein a pressure holding step is controlled in multiple steps, the transfer points of respective holding pressures are transferred in accordance with the temperature of injected resin or a metal mold detected by a temperature sensor provided for the metal mold.

摘要翻译： 在控制注射成型机的方法中，其中压力保持步骤被多个步骤控制，各个保持压力的转移点根据注入的树脂或金属模具的温度转移，该温度由设置在金属上的温度传感器检测 模子。

公开(公告)号：US4543176A

公开(公告)日：1985-09-24

申请号：US585861

申请日：1984-03-02

申请人： Takashi Harada ,  Akio Kobayashi ,  Masakazu Honda ,  Susumu Harada ,  Masaya Fujimoto ,  Masatoshi Suzuki

发明人： Takashi Harada ,  Akio Kobayashi ,  Masakazu Honda ,  Susumu Harada ,  Masaya Fujimoto ,  Masatoshi Suzuki

IPC分类号： F02D41/14 ,  G01N27/406 ,  G01N27/41 ,  G01N27/58

CPC分类号： G01N27/4067 ,  G01N27/4065

摘要： An oxygen concentration detector under a temperature control for an internal combustion engine. An oxygen sensor of a critical current type is held between a gas under test and a reference gas, in the vicinity of which a heater is located for heating up the oxygen sensor in a sensor activating temperature range. A first voltage is applied for a positive bias control to the oxygen sensor during a first period, and a second voltage is applied for a negative bias control thereto during a second period. Electric current flowing through the oxygen sensor is detected during the first period in order to detect the oxygen concentration in the gas under test. The current value is also detected during the second period in order to detect and maintain constant the internal electric resistance of the oxygen sensor by controlling the heater heating output.

摘要翻译： 在内燃机的温度控制下的氧浓度检测器。 临时电流型的氧传感器被保持在被测气体和参考气体之间，在其附近设置有用于在传感器激活温度范围内加热氧传感器的加热器。 在第一周期期间，向氧传感器施加第一电压用于正偏压控制，并且在第二时段期间施加第二电压用于负偏压控制。 在第一期间检测流过氧传感器的电流，以便检测被测气体中的氧气浓度。 为了通过控制加热器加热输出来检测和保持氧传感器的内部电阻，也检测到电流值。

公开(公告)号：US4127086A

公开(公告)日：1978-11-28

申请号：US713833

申请日：1976-08-12

申请人： Susumu Harada ,  Kunio Endo

发明人： Susumu Harada ,  Kunio Endo

IPC分类号： F02D41/34 ,  F02D41/12 ,  F02D41/18 ,  F02B3/00

CPC分类号： F02D41/182 ,  F02D41/12

摘要： A fuel injection system in which the valve control pulses are generated on the basis of information regarding the engine rpm and the combustion air flow rate and in which the air flow rate is measured by a baffle plate and a position sensor. When the throttle is abruptly closed, the inertia of the air and of the baffle plate prevents a precise measurement and an overly lean fuel mixture may be admitted. Accordingly, the apparatus of the invention is sensitive to the rate of change of the signal from the baffle plate sensor and when that rate is too great, additional current is fed to a multiplying circuit, thereby extending the control pulse length and increasing the amount of fuel fed to the engine.

摘要翻译： 一种燃料喷射系统，其中基于关于发动机转速和燃烧空气流量的信息产生阀控制脉冲，并且其中空气流量由挡板和位置传感器测量。 当节气门突然闭合时，空气和挡板的惯性阻止了精确的测量，并且可能会允许过度稀释的燃料混合物。 因此，本发明的装置对来自挡板传感器的信号的变化率敏感，并且当该速率太大时，附加电流被馈送到乘法电路，从而延长控制脉冲长度并增加 燃料供给发动机。

公开(公告)号：US3963002A

公开(公告)日：1976-06-15

申请号：US504248

申请日：1974-09-09

申请人： Motoharu Sueishi ,  Susumu Harada

发明人： Motoharu Sueishi ,  Susumu Harada

IPC分类号： F02D41/14 ,  F02D41/18 ,  F02D41/30 ,  F02D41/34 ,  F02B3/00

CPC分类号： F02D41/1475 ,  F02D41/182 ,  F02D41/30

摘要： An electronically controlled fuel injection system mounting an oxygen content detector in the exhaust system of the engine comprises at least two kinds of fuel injection valve, one of which has a different injection opening from the other, whereby an optimum air-fuel ratio for reducing harmful components in the exhaust gas from the engine is obtained.

摘要翻译： 在发动机的排气系统中安装氧含量检测器的电控燃料喷射系统包括至少两种燃料喷射阀，其中一种燃料喷射阀与另一种具有不同的喷射开口，由此用于减少有害物质的最佳空燃比 得到来自发动机的废气中的成分。

公开(公告)号：US08426977B2

公开(公告)日：2013-04-23

申请号：US12539037

申请日：2009-08-11

申请人： Kazumasa Tanida ,  Hideko Mukaida ,  Susumu Harada ,  Chiaki Takubo

发明人： Kazumasa Tanida ,  Hideko Mukaida ,  Susumu Harada ,  Chiaki Takubo

IPC分类号： H01L23/48

CPC分类号： H01L27/14618 ,  H01L23/481 ,  H01L24/13 ,  H01L27/14683 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/0557 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor apparatus includes, a semiconductor substrate having first and second main surfaces and a through hole connecting the first and second main surfaces; a first insulation layer arranged on the first main surface, and having an opening corresponding to the through hole; a first conductive layer arranged on the first insulation layer, and covering the through hole; a second insulation layer arranged on an inner wall of the through hole and the second surface; a second conductive layer arranged in the through hole and on the second insulation layer, the second conductive layer contacting the first conductive layer; and a filling member arranged on the second conductive layer in the through hole, and having a gap between the second conductive layer on the first main surface side.

摘要翻译： 半导体装置包括具有第一和第二主表面的半导体衬底和连接第一和第二主表面的通孔; 布置在所述第一主表面上并具有与所述通孔对应的开口的第一绝缘层; 布置在所述第一绝缘层上并覆盖所述通孔的第一导电层; 布置在所述通孔的内壁和所述第二表面上的第二绝缘层; 布置在所述通孔中和所述第二绝缘层上的第二导电层，所述第二导电层与所述第一导电层接触; 以及填充构件，其布置在所述通孔中的所述第二导电层上，并且在所述第一主表面侧上的所述第二导电层之间具有间隙。