公开(公告)号：US20100040895A1

公开(公告)日：2010-02-18

申请号：US12541594

申请日：2009-08-14

申请人： Yoshitaka Hamada ,  Fujio Yagihashi ,  Takeshi Asano

发明人： Yoshitaka Hamada ,  Fujio Yagihashi ,  Takeshi Asano

IPC分类号： B32B27/28 ,  C08L83/04 ,  B32B37/12

CPC分类号： C09J183/14 ,  C08G77/50 ,  C08G77/52 ,  C08G77/54 ,  H01L21/187 ,  H01L23/296 ,  H01L24/29 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/83801 ,  H01L2224/83855 ,  H01L2225/06513 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01056 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/351 ,  H01L2924/0715 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A high-temperature bonding composition comprising a silicon base polymer as a thermosetting binder is provided. The silicon base polymer is obtained from dehydrolytic condensation of a condensate precursor comprising a silane compound having at least one pair of silicon atoms tied by a crosslink composed of an aliphatic hydrocarbon, heterocyclic or aromatic hydrocarbon group, and having at least three hydroxyl and/or hydrolyzable groups. Those silicon atoms having a direct bond to the crosslink composed of the aliphatic hydrocarbon, heterocyclic or aromatic hydrocarbon group are present in a proportion of at least 90 mol % relative to all silicon atoms in the polymer.

摘要翻译： 提供包含硅基聚合物作为热固性粘合剂的高温粘合组合物。 硅基聚合物是由包含具有至少一对硅原子的硅烷化合物的缩合物前体的脱水缩合得到的，所述硅原子被由脂族烃，杂环或芳族烃基组成的交联键合，并具有至少三个羟基和/或 可水解基团。 与由脂族烃，杂环或芳族烃基组成的交联直接键合的那些硅原子相对于聚合物中的全部硅原子的比例至少为90摩尔％。

公开(公告)号：US08277600B2

公开(公告)日：2012-10-02

申请号：US12541594

申请日：2009-08-14

申请人： Yoshitaka Hamada ,  Fujio Yagihashi ,  Takeshi Asano

发明人： Yoshitaka Hamada ,  Fujio Yagihashi ,  Takeshi Asano

IPC分类号： C09J7/02 ,  B32B9/04 ,  C08L83/00 ,  C08L83/04

CPC分类号： C09J183/14 ,  C08G77/50 ,  C08G77/52 ,  C08G77/54 ,  H01L21/187 ,  H01L23/296 ,  H01L24/29 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/83801 ,  H01L2224/83855 ,  H01L2225/06513 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01056 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/351 ,  H01L2924/0715 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A high-temperature bonding composition comprising a silicon base polymer as a thermosetting binder is provided. The silicon base polymer is obtained from dehydrolytic condensation of a condensate precursor comprising a silane compound having at least one pair of silicon atoms tied by a crosslink composed of an aliphatic hydrocarbon, heterocyclic or aromatic hydrocarbon group, and having at least three hydroxyl and/or hydrolyzable groups. Those silicon atoms having a direct bond to the crosslink composed of the aliphatic hydrocarbon, heterocyclic or aromatic hydrocarbon group are present in a proportion of at least 90 mol % relative to all silicon atoms in the polymer.

摘要翻译： 提供包含硅基聚合物作为热固性粘合剂的高温粘合组合物。 硅基聚合物是由包含具有至少一对硅原子的硅烷化合物的缩合物前体的脱水缩合得到的，所述硅原子被由脂族烃，杂环或芳族烃基组成的交联键合，并具有至少三个羟基和/或 可水解基团。 与由脂族烃，杂环或芳族烃基组成的交联直接键合的那些硅原子相对于聚合物中的全部硅原子的比例至少为90摩尔％。

公开(公告)号：US20100040893A1

公开(公告)日：2010-02-18

申请号：US12540764

申请日：2009-08-13

申请人： Fujio Yagihashi ,  Yoshitaka Hamada ,  Takeshi Asano

发明人： Fujio Yagihashi ,  Yoshitaka Hamada ,  Takeshi Asano

IPC分类号： B32B37/00 ,  B32B9/04

CPC分类号： H01L21/2007 ,  H01L2924/0002 ,  Y10T156/10 ,  H01L2924/00

摘要： A pair of substrates each having a bonding surface are joined together by interposing a bond layer precursor coating between the bonding surfaces of the substrates and heating the precursor coating to form a bond layer. Prior to the joining step, the substrate on the bonding surface is provided with a gas-permeable layer. Even when a material which will evolve a noticeable volume of gas upon heat curing is used as the precursor coating, substrates can be joined via a robust bond without the peeling problem by gas evolution.

摘要翻译： 将具有接合面的一对基板通过在基板的接合面之间插入接合层前体涂层并加热前体涂层而形成接合层而接合在一起。 在接合步骤之前，接合表面上的基底设置有透气层。 即使当热固化时将产生显着体积的气体的材料用作前体涂层时，可以通过坚固的粘结将衬底接合，而不会由气体逸出造成剥离问题。

公开(公告)号：US08257528B2

公开(公告)日：2012-09-04

申请号：US12540764

申请日：2009-08-13

申请人： Fujio Yagihashi ,  Yoshitaka Hamada ,  Takeshi Asano

发明人： Fujio Yagihashi ,  Yoshitaka Hamada ,  Takeshi Asano

IPC分类号： B32B37/00 ,  B32B9/04 ,  C09J163/00 ,  C09J5/06 ,  C09J201/00 ,  H01L21/20 ,  H01L21/50 ,  H01L21/52

CPC分类号： H01L21/2007 ,  H01L2924/0002 ,  Y10T156/10 ,  H01L2924/00

摘要： A pair of substrates each having a bonding surface are joined together by interposing a bond layer precursor coating between the bonding surfaces of the substrates and heating the precursor coating to form a bond layer. Prior to the joining step, the substrate on the bonding surface is provided with a gas-permeable layer. Even when a material which will evolve a noticeable volume of gas upon heat curing is used as the precursor coating, substrates can be joined via a robust bond without the peeling problem by gas evolution.

摘要翻译： 将具有接合面的一对基板通过在基板的接合面之间插入接合层前体涂层并加热前体涂层而形成接合层而接合在一起。 在接合步骤之前，接合表面上的基底设置有透气层。 即使当热固化时将产生显着体积的气体的材料用作前体涂层时，可以通过坚固的粘结将衬底接合，而不会由气体逸出造成剥离问题。

公开(公告)号：US20060220253A1

公开(公告)日：2006-10-05

申请号：US11446160

申请日：2006-06-05

申请人： Yoshitaka Hamada ,  Fujio Yagihashi ,  Hideo Nakagawa ,  Masaru Sasao

发明人： Yoshitaka Hamada ,  Fujio Yagihashi ,  Hideo Nakagawa ,  Masaru Sasao

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： C08J9/0014 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/31695

摘要： A porous film-forming composition comprising (A) a curable silicone resin having a Mn of at least 100, (B) a micelle-forming surfactant, and (C) a compound which generates an acid upon pyrolysis remains stable during storage. The composition is coated and heat treated to form a porous film which has flatness, uniformity, a low dielectric constant and a high mechanical strength so that it is best suited as an interlayer dielectric film in the fabrication of semiconductor devices.

公开(公告)号：US07651829B2

公开(公告)日：2010-01-26

申请号：US10854568

申请日：2004-05-26

申请人： Yoshitaka Hamada ,  Fujio Yagihashi ,  Mutsuo Nakashima ,  Kazumi Noda ,  Katsuya Takemura

发明人： Yoshitaka Hamada ,  Fujio Yagihashi ,  Mutsuo Nakashima ,  Kazumi Noda ,  Katsuya Takemura

IPC分类号： G03F7/039 ,  G03F7/20 ,  G03F7/30 ,  G03F7/36 ,  G03F7/38

CPC分类号： G03F7/0045 ,  G03F7/0757 ,  Y10S430/143

摘要： Provided is a positive resist material, particularly a chemically amplified positive resist material having higher sensitivity, higher resolution, a higher exposure latitude and better process adaptability than conventional positive resist materials, and providing a good pattern profile after exposure, particularly having lessened line edge roughness and exhibiting excellent etching resistance. These materials may contain, preferably an organic solvent and acid generator, more preferably a dissolution inhibitor or a basic compound and/or a surfactant. Provided is a positive resist material comprising a polymer comprising at least one monomer unit selected from a group consisting of a monomer unit (A), a monomer unit (B) and a monomer unit (C) represented by the following formula (1); and having a glass transition temperature (Tg) of 100° C. or greater.

摘要翻译： 本发明提供了正电阻材料，特别是具有比常规正性抗蚀剂材料更高的灵敏度，更高分辨率，更高的曝光宽容度和更好的工艺适应性的化学放大的正性抗蚀剂材料，并且在曝光之后提供良好的图案轮廓，特别是具有减小的线边缘粗糙度 并具有优异的耐蚀刻性。 这些材料可以优选含有有机溶剂和酸产生剂，更优选含有溶解抑制剂或碱性化合物和/或表面活性剂。 提供一种正性抗蚀剂材料，其包含包含选自由下式（1）表示的单体单元（A），单体单元（B）和单体单元（C））组成的组中的至少一种单体单元的聚合物; 玻璃化转变温度（Tg）为100℃以上。

公开(公告)号：US20120207917A1

公开(公告)日：2012-08-16

申请号：US13372673

申请日：2012-02-14

申请人： Yoshitaka Hamada ,  Fujio Yagihashi

发明人： Yoshitaka Hamada ,  Fujio Yagihashi

IPC分类号： B05D5/12 ,  H01B1/22 ,  H01B1/20

CPC分类号： H01B1/22 ,  C09D7/69 ,  C09D11/322 ,  C09D11/52

摘要： A conductive pattern-forming composition is obtained by loading a silicone rubber composition comprising a curable organopolysiloxane and a curing agent with conductive submicron particles.

摘要翻译： 通过将包含可固化的有机聚硅氧烷和固化剂的硅橡胶组合物与导电的亚微米颗粒相加来获得导电图案形成组合物。

公开(公告)号：US07202013B2

公开(公告)日：2007-04-10

申请号：US10858997

申请日：2004-06-02

申请人： Tsutomu Ogihara ,  Takeshi Asano ,  Motoaki Iwabuchi ,  Fujio Yagihashi

发明人： Tsutomu Ogihara ,  Takeshi Asano ,  Motoaki Iwabuchi ,  Fujio Yagihashi

IPC分类号： G03C1/73

CPC分类号： G03F7/091 ,  C09D183/04 ,  G03F7/0045 ,  G03F7/0757 ,  Y10T428/31663

摘要： It is an object of the present invention to provide a material for an antireflective film that has high etching selectivity with respect to the resist, that is, that has a faster etching speed than the resist, a pattern formation method for forming an antireflective film layer on a substrate using this antireflective film material, and a pattern formation method using this antireflective film as a hard mask for substrate processing.The present invention provides an antireflective film material comprising a polymer (A) comprising copolymerized repeating units expressed by the Formula (1) and/or the Formula (2), an organic solvent (B), an acid generator (C) and an optional crosslinking agent (D)

摘要翻译： 本发明的目的是提供一种抗蚀剂材料，该防反射膜相对于抗蚀剂具有高蚀刻选择性，即具有比抗蚀剂更快的蚀刻速度，用于形成抗反射膜层的图案形成方法 在使用该防反射膜材料的基板上，使用该抗反射膜作为基板处理的硬掩模的图案形成方法。

公开(公告)号：US07303785B2

公开(公告)日：2007-12-04

申请号：US10859531

申请日：2004-06-02

申请人： Tsutomu Ogihara ,  Takeshi Asano ,  Motoaki Iwabuchi ,  Fujio Yagihashi

发明人： Tsutomu Ogihara ,  Takeshi Asano ,  Motoaki Iwabuchi ,  Fujio Yagihashi

IPC分类号： B05D3/02 ,  C08G77/16

CPC分类号： C09D183/04 ,  G03F7/0757 ,  G03F7/091 ,  H01L21/0276 ,  Y10T428/31663

摘要： It is an object of the present invention to provide a material for an antireflective film that has high etching selectivity with respect to the resist, that is, that has a faster etching speed than the resist, a pattern formation method for forming an antireflective film layer on a substrate using this antireflective film material, and a pattern formation method using this antireflective film as a hard mask for substrate processing. The present invention provides a silicone resin for preventing reflection comprising an organic group comprising a carbon-oxygen single bond and/or a carbon-oxygen double bond; a light-absorbing group; and a silicon atom whose terminal end or ends are Si—OH and/or Si—OR. It also provides an antireflective film material comprising this silicone resin (A) for preventing reflection film, an organic solvent (B) and an acid generator (C).

摘要翻译： 本发明的目的是提供一种抗蚀剂材料，该防反射膜相对于抗蚀剂具有高蚀刻选择性，即具有比抗蚀剂更快的蚀刻速度，用于形成抗反射膜层的图案形成方法 在使用该防反射膜材料的基板上，使用该抗反射膜作为基板处理的硬掩模的图案形成方法。 本发明提供一种防止反射的硅树脂，其包含含有碳 - 氧单键和/或碳 - 氧双键的有机基团; 光吸收组; 以及其末端或末端为Si-OH和/或Si-OR的硅原子。 还提供一种抗反射膜材料，其包含用于防止反射膜的有机硅树脂（A），有机溶剂（B）和酸产生剂（C）。

公开(公告)号：US06841334B2

公开(公告)日：2005-01-11

申请号：US10683107

申请日：2003-10-10

申请人： Fujio Yagihashi ,  Tomoyoshi Furihata ,  Jun Watanabe ,  Akinobu Tanaka ,  Yoshio Kawai ,  Tadahito Matsuda

发明人： Fujio Yagihashi ,  Tomoyoshi Furihata ,  Jun Watanabe ,  Akinobu Tanaka ,  Yoshio Kawai ,  Tadahito Matsuda

IPC分类号： C07C381/12 ,  C08K5/36 ,  C08L25/00 ,  C08L25/18 ,  G03F7/004 ,  G03F7/029 ,  G03F7/039 ,  H01L21/027 ,  H01L21/30 ,  G03F7/038

CPC分类号： G03F7/039 ,  C07C381/12 ,  G03F7/0045 ,  Y10S430/106 ,  Y10S430/115

摘要： Disclosed are novel onium salts represented by general formula (R)3S+M, wherein three R's may be the same or different, each being an aryl group, provided that at least one of R's is a t-alkoxy substituted phenyl group, and M is an anion capable of forming the sulfonium salts; and high energy radiation-responsive positive resist materials using said novel onium salts as acid generator.

摘要翻译： 公开了由通式（R）3S + M表示的新型鎓盐，其中三个R可以相同或不同，各自为芳基，条件是R的至少一个为叔烷氧基取代的苯基， M是能形成锍盐的阴离子; 和使用所述新型鎓盐作为酸发生剂的高能辐射响应正抗蚀材料。