公开(公告)号：US08837168B2

公开(公告)日：2014-09-16

申请号：US13754910

申请日：2013-01-31

Applicant: Cyntec Co., Ltd.

Inventor： Da-Jung Chen ,  Chau-Chun Wen ,  Chun-Tiao Liu

IPC: H05K7/18 ,  H05K3/30 ,  H05K1/18 ,  H01L23/64 ,  H01L25/16 ,  H01F27/29 ,  H05K9/00 ,  H01L23/24 ,  H01L23/31 ,  H01L23/552 ,  H01F27/02 ,  H05K3/34

CPC classification number: H05K1/18 ,  H01F27/027 ,  H01F27/29 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/552 ,  H01L23/645 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/181 ,  H05K3/30 ,  H05K3/3421 ,  H05K9/00 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  Y10T29/49071 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

公开(公告)号：US20140077912A1

公开(公告)日：2014-03-20

申请号：US14059472

申请日：2013-10-22

Applicant: CYNTEC CO., LTD.

Inventor： Tsung-Chan Wu

IPC: H01F3/08

CPC classification number: H05K7/026 ,  H01F3/08 ,  H01F5/00 ,  H01F17/043 ,  H01F27/02 ,  H01F27/24 ,  H01F27/2828 ,  H01F27/29 ,  H01F27/292 ,  H01F37/00 ,  H05K1/18

Abstract: An inductor includes a first core, a conducting wire, a second core and a first lead frame. There is an accommodating space formed on a first side of the first core and there is a recess portion formed on a second side of the first core, wherein the first side is opposite to the second side. The first core has a first height. The conducting wire is disposed in the accommodating space. The second core is disposed on the first side of the first core and covers the accommodating space. The first lead frame has an embedded portion embedded in the recess portion. The embedded portion has a second height. After embedding the embedded portion in the recess portion of the first core, a total height of the embedded portion and the first core is smaller than the sum of the first height and the second height.

Abstract translation: 电感器包括第一芯，导线，第二芯和第一引线框架。 在第一芯体的第一侧上形成有容纳空间，在第一芯体的第二侧形成有凹部，其中第一面与第二面相反。 第一个核心有一个高度。 导线布置在容纳空间中。 第二芯设置在第一芯的第一侧上并覆盖容纳空间。 第一引线框架具有嵌入在凹部中的嵌入部分。 嵌入部分具有第二高度。 在嵌入部分嵌入第一芯部的凹部中之后，嵌入部分和第一芯部的总高度小于第一高度和第二高度之和。

公开(公告)号：US20140055226A1

公开(公告)日：2014-02-27

申请号：US13969486

申请日：2013-08-16

Applicant: Lan-Chin Hsieh ,  Cheng-Chang Lee ,  Chih-Hung Chang ,  Chih-Siang Chuang ,  Tsung-Chan Wu ,  Roger Hsieh

Inventor： Lan-Chin Hsieh ,  Cheng-Chang Lee ,  Chih-Hung Chang ,  Chih-Siang Chuang ,  Tsung-Chan Wu ,  Roger Hsieh

IPC: H01F17/04

CPC classification number: H01F27/24 ,  H01F3/14 ,  H01F17/04 ,  H01F27/2823 ,  H01F38/023 ,  H01F2003/106

Abstract: A variable coupled inductor includes a first core, two conducting wires, a second core and a magnetic structure. The first core includes two first protruding portions, a second protruding portion and two grooves, wherein the second protruding portion is located between the two first protruding portions and each of the grooves is located between one of the first protruding portions and the second protruding portion. Each of the conducting wires is disposed in one of the grooves. The second core is disposed on the first core. A first gap is formed between each of the first protruding portions and the second core and a second gap is formed between the second protruding portion and the second core. The magnetic structure is disposed between the second protruding portion and the second core and distributed symmetrically with respect to a centerline of the second protruding portion.

Abstract translation: 可变耦合电感器包括第一芯，两个导线，第二芯和磁结构。 第一芯包括两个第一突出部分，第二突出部分和两个凹槽，其中第二突出部分位于两个第一突出部分之间，并且每个槽位于第一突出部分和第二突出部分之一之间。 每个导线设置在一个凹槽中。 第二芯设置在第一芯上。 在第一突出部和第二芯之间形成有第一间隙，在第二突出部和第二芯之间形成有第二间隙。 磁性结构设置在第二突出部和第二芯之间，并相对于第二突出部的中心线对称分布。

公开(公告)号：US20130271251A1

公开(公告)日：2013-10-17

申请号：US13571381

申请日：2012-08-10

Applicant: Shih-Hsien Tseng ,  Wen-Hsiung Liao ,  Joseph D.S. Deng ,  Ian-Chun Cheng

Inventor： Shih-Hsien Tseng ,  Wen-Hsiung Liao ,  Joseph D.S. Deng ,  Ian-Chun Cheng

IPC: H01F5/00 ,  H01F41/04

CPC classification number: H01F41/042 ,  H01F17/0013 ,  H01F2017/0066

Abstract: The present invention discloses a substrate-less electronic component. A conductive element is disposed in the plurality of insulating layers, wherein the plurality of insulating layers are not supported by a substrate. The substrate-less electronic component can be manufactured by performing film process on a plurality of conductive layers or insulating layers on the substrate before the substrate is removed. In one embodiment, a buffer layer can be formed on the substrate. After the process is done, the buffer layer can be easily removed to decouple the substrate from the layers on the substrate.

Abstract translation: 本发明公开了一种无基板电子部件。 导电元件设置在多个绝缘层中，其中多个绝缘层不被衬底支撑。 可以在去除衬底之前，在衬底上的多个导电层或绝缘层上执行膜工艺来制造无衬底电子部件。 在一个实施例中，可以在衬底上形成缓冲层。 在该过程完成之后，可以容易地去除缓冲层以使衬底与衬底上的层分离。

公开(公告)号：US20130271241A1

公开(公告)日：2013-10-17

申请号：US13861407

申请日：2013-04-12

Applicant: Chen-Chung Liu ,  Ian-Chun Cheng

Inventor： Chen-Chung Liu ,  Ian-Chun Cheng

IPC: H03H7/01

CPC classification number: H03H7/0138 ,  H03H7/422

Abstract: The invention discloses a balance filter formed from a combination of a first circuit and a second circuit, wherein both the first circuit and the second circuit have at least one through-hole via inductor. The balance filter is connected to an IC through a first terminal and a second terminal, wherein a power trace is disposed between the first circuit and the second circuit to deliver the power to the IC.

Abstract translation: 本发明公开了一种由第一电路和第二电路的组合形成的平衡滤波器，其中第一电路和第二电路均具有至少一个通孔电感器。 平衡滤波器通过第一端子和第二端子连接到IC，其中功率迹线设置在第一电路和第二电路之间以将功率传递到IC。

公开(公告)号：US08547709B2

公开(公告)日：2013-10-01

申请号：US12705389

申请日：2010-02-12

Applicant: Han-Hsiang Lee ,  Kun-Hong Shih ,  Jeng-Jen Li

Inventor： Han-Hsiang Lee ,  Kun-Hong Shih ,  Jeng-Jen Li

IPC: H05K5/02 ,  H05K7/00

CPC classification number: H05K7/1432 ,  H01L23/13 ,  H01L23/49531 ,  H01L23/49541 ,  H01L2224/49175 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H02M3/00 ,  H05K1/021 ,  H05K3/0061 ,  H05K2201/10924 ,  H05K2203/1327 ,  H01L2924/00

Abstract: A composite substrate made of a circuit board mounted on a lead frame is used for an electronic system package. High heat generated electronic components are adapted to mount on the lead frame and relatively low heat generated electronic components are adapted to mount on the circuit board. Metal lines are used for electrical coupling between the circuitry of the IC chip and the circuit board. An electronic system with the composite substrate gains both advantages—good circuitry arrangement capability from the circuit board and good heat distribution from the lead frame.

Abstract translation: 将由安装在引线框架上的电路板制成的复合基板用于电子系统封装。 高热产生的电子部件适于安装在引线框架上，相对低的发热电子部件适于安装在电路板上。 金属线用于IC芯片的电路和电路板之间的电耦合。 具有复合基板的电子系统具有两个优点 - 电路板具有良好的电路布置能力和来自引线框架的良好热分布。

公开(公告)号：US08519277B2

公开(公告)日：2013-08-27

申请号：US12860237

申请日：2010-08-20

Applicant: Yi-Min Huang ,  Tsung-Chan Wu

Inventor： Yi-Min Huang ,  Tsung-Chan Wu

IPC: H01L23/48

CPC classification number: H05K1/181 ,  H01L23/3107 ,  H01L2924/0002 ,  H01L2924/14 ,  H05K2201/09781 ,  H05K2201/10568 ,  Y02P70/611 ,  H01L2924/00

Abstract: A surface mounted electronic component is provided. The surface mounted electronic component includes a main body, a circuit element, a conductive electrode, and a virtual electrode. The circuit element is arranged in the main body. The conductive electrode is disposed on an outer surface of the main body, wherein the conductive electrode electrically is connected to the circuit element. The virtual electrode is disposed on the outer surface of the main body, wherein the virtual electrode lies near the conductive electrode. There is a distance between the virtual electrode and the conductive electrode.

Abstract translation: 提供了表面安装的电子部件。 表面安装的电子部件包括主体，电路元件，导电电极和虚拟电极。 电路元件布置在主体中。 导电电极设置在主体的外表面上，其中导电电极电连接到电路元件。 虚拟电极设置在主体的外表面上，虚拟电极位于导电电极附近。 虚拟电极和导电电极之间存在距离。

公开(公告)号：US08472158B2

公开(公告)日：2013-06-25

申请号：US12875752

申请日：2010-09-03

Applicant: Chung-Hsiung Wang ,  Hung-Ming Lin ,  Lang-Yi Chiang ,  Wen-Shiang Luo ,  Kuo-Shu Chen

Inventor： Chung-Hsiung Wang ,  Hung-Ming Lin ,  Lang-Yi Chiang ,  Wen-Shiang Luo ,  Kuo-Shu Chen

IPC: H02H5/00

CPC classification number: H02H5/00 ,  H01H69/022 ,  H01H85/0047 ,  H01H85/0065 ,  H01H85/0411 ,  H01H85/046 ,  H01H85/048 ,  H01H85/11 ,  H01H2085/466

Abstract: A protective device including a substrate, a conductive section and a first auxiliary medium is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The first auxiliary medium is disposed between the metal element and the substrate, wherein the first auxiliary medium has a melting point lower than that of the metal element. The first auxiliary medium facilitates breaking of the metal element upon melting.

Abstract translation: 提供了包括基板，导电部分和第一辅助介质的保护装置。 导电部分由衬底支撑，其中导电部分包括电连接在第一和第二电极之间的金属元件。 金属元件用作熔点低于第一和第二电极的熔点的牺牲结构。 第一辅助介质设置在金属元件和基板之间，其中第一辅助介质的熔点低于金属元件的熔点。 第一辅助介质有助于熔化时金属元件的断裂。

公开(公告)号：US20130076470A1

公开(公告)日：2013-03-28

申请号：US13681394

申请日：2012-11-19

Applicant: CYNTEC CO., LTD.

Inventor： Tsung-Chan Wu

IPC: H01F37/00

CPC classification number: H05K7/026 ,  H01F3/08 ,  H01F5/00 ,  H01F17/043 ,  H01F27/02 ,  H01F27/24 ,  H01F27/2828 ,  H01F27/29 ,  H01F27/292 ,  H01F37/00 ,  H05K1/18

Abstract: An inductor includes a first core, a conducting wire, a second core and a first lead frame. There is an accommodating space formed on a first side of the first core and there is a recess portion formed on a second side of the first core, wherein the first side is opposite to the second side. The first core has a first height. The conducting wire is disposed in the accommodating space. The second core is disposed on the first side of the first core and covers the accommodating space. The first lead frame has an embedded portion embedded in the recess portion. The embedded portion has a second height. After embedding the embedded portion in the recess portion of the first core, a total height of the embedded portion and the first core is smaller than the sum of the first height and the second height.

Abstract translation: 电感器包括第一芯，导线，第二芯和第一引线框架。 在第一芯体的第一侧上形成有容纳空间，在第一芯体的第二侧形成有凹部，其中第一面与第二面相反。 第一个核心有一个高度。 导线布置在容纳空间中。 第二芯设置在第一芯的第一侧上并覆盖容纳空间。 第一引线框架具有嵌入在凹部中的嵌入部分。 嵌入部分具有第二高度。 在嵌入部分嵌入第一芯部的凹部中之后，嵌入部分和第一芯部的总高度小于第一高度和第二高度之和。

公开(公告)号：US20120200383A1

公开(公告)日：2012-08-09

申请号：US13452265

申请日：2012-04-20

Applicant: Ta-Wen Lo ,  Yen-Ting Lin

Inventor： Ta-Wen Lo ,  Yen-Ting Lin

IPC: H01C1/012

CPC classification number: H01C7/13 ,  G01R1/203 ,  H01C1/148 ,  H01C7/003

Abstract: A resistor device includes a resistor plate and an electrode structure. The electrode structure includes an electrode layer and an auxiliary layer. The electrode layer is disposed at a first face of the resistor plate and includes a first portion and a second portion overlying a first side and a second side of the resistor plate, respectively, and a current path is conducted between the first portion and the second portion through the resistor plate. The auxiliary layer is disposed at a second face of the resistor plate and includes at least a first block and a second block overlying the first side of the resistor plate, and at least a third block overlying the second side of the resistor plate, wherein the first, second and third blocks of the auxiliary layer are separated from one another so that any current flow among the blocks is blocked.

Abstract translation: 电阻器件包括电阻器板和电极结构。 电极结构包括电极层和辅助层。 电极层设置在电阻器板的第一面上，分别包括覆盖电阻器板的第一侧和第二侧的第一部分和第二部分，并且电流通路在第一部分和第二部分之间传导 部分通过电阻板。 辅助层设置在电阻器板的第二面上，并且至少包括覆盖电阻器板的第一侧的第一块和第二块，以及覆盖电阻器板的第二侧的至少第三块，其中， 辅助层的第一，第二和第三块彼此分离，使得块之间的任何电流都被阻挡。