公开(公告)号：US10103049B2

公开(公告)日：2018-10-16

申请号：US15117930

申请日：2015-02-11

申请人： SUSS MicroTec Lithography GmbH

发明人： Bernhard Bogner

IPC分类号： H01L21/683 ,  B25J15/00 ,  H01L21/67

摘要： The method and the apparatus prevents the deformation of a substrate, e.g. a wafer, supported with its edge area or periphery at a support or chuck, and also avoids the damage and/or contamination of the active area of the substrate. In particular, the substrate is mechanically supported at its peripheral or edge portion, namely in the non-active area of the substrate, only; an additional non-mechanical extended support is provided in the active area by a gas cushion. The gas cushion is generated by a controllable nozzle or purge for a distinct and controlled compensation of the downward deflection of the substrate.

公开(公告)号：US09859141B2

公开(公告)日：2018-01-02

申请号：US14330497

申请日：2014-07-14

申请人： SUSS MicroTec Lithography, GmbH

发明人： Hale Johnson ,  Gregory George ,  Michael Brennen

IPC分类号： H01L21/68 ,  H01L21/67

CPC分类号： H01L21/68 ,  H01L21/67092 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26

摘要： A device for locating and engaging a notch on the perimeter of a circular wafer includes a notch locating component and a first plate. The notch locating component is configured to move linearly along a first axis and includes a front elongated component extending along a second axis perpendicular to the first axis and having a front surface, a back surface opposite to the front surface and a first protrusion extending from the front surface of the elongated component. The first protrusion has a shape complementing the shape of a notch formed on the perimeter of a circular wafer. As the notch locating component is driven toward the perimeter of the circular wafer along the first axis, a distance between the back surface of the elongated component and a front surface of the first plate is measured and the value of the measured distance is used to determine engagement of the first protrusion with the notch.

公开(公告)号：US20160240414A1

公开(公告)日：2016-08-18

申请号：US15024160

申请日：2013-09-26

申请人： SUSS MICROTEC LITHOGRAPHY GMBH

发明人： Matthias Conradi ,  Sven Hansen

IPC分类号： H01L21/67 ,  H01L21/683

CPC分类号： H01L21/67288 ,  H01L21/6838

摘要： The invention relates to a chuck and a method for suction and holding a wafer by said chuck, wherein the chuck comprises: a flat top face being subdivided into several suction segments, wherein the suction segments are each configured for suctioning a fluid; and a bottom face. The method comprises the steps: bringing, within a fluid, wafer and top face of the chuck into vicinity such that two or more of the suction segments are covered, at least loosely covered, by the wafer; choosing, from the suction segments not yet been activated, a suction segment having a minimal distance to the wafer; activating the suction segment chosen in the previous step; once the wafer in the area of the last-activated suction segment tightly touches the top face of the chuck and as long as at least one suction segment is not yet activated: repeating the foregoing steps.

摘要翻译： 本发明涉及一种用于通过所述卡盘吸取和保持晶片的卡盘和方法，其中所述卡盘包括：平坦顶面，其被细分成多个抽吸段，其中所述抽吸段各自构造成用于抽吸流体; 和底面。 该方法包括以下步骤：在卡盘的流体，晶片和顶面附近进入附近，使得两个或更多个吸引段被晶片至少松散地覆盖; 从尚未激活的吸入段中选择具有与晶片最小距离的吸入段; 激活前一步骤中选择的吸入段; 一旦在最后激活的吸入段的区域中的晶片紧紧地接触到卡盘的顶面，并且只要至少一个吸入段尚未被激活：重复上述步骤。

公开(公告)号：US09329473B2

公开(公告)日：2016-05-03

申请号：US13261204

申请日：2011-02-14

申请人： Sven Hansen ,  Matthias Conradi ,  Georg Fink

发明人： Sven Hansen ,  Matthias Conradi ,  Georg Fink

IPC分类号： B29C43/58 ,  G03F7/00 ,  B82Y10/00 ,  B82Y40/00 ,  B29C43/02

CPC分类号： G03F7/0002 ,  B29C43/58 ,  B29C2043/025 ,  B29C2043/5858 ,  B82Y10/00 ,  B82Y40/00

摘要： The invention relates to a method and device for expanding the travel or control displacement of linear actuators that is available during an imprinting or embossing stroke. The wedge error compensating head (2) comprises a movable part (4), a stationary part (3) and at least three linear actuators (8). Each linear actuator (8) is connected to one of the parts (3, 4) at one end and to the other of the two parts (4, 3) by wedges (9) at the other end. By means of the wedges (9), it is possible to coarsely or roughly compensate for wedge errors and possible tolerances of individual subcomponents of the system. The linear actuators (8) are only used for fine or precision compensation for the wedge error. In this way, sufficient control displacement is available for the imprinting stroke with the linear actuators.

摘要翻译： 本发明涉及一种用于扩展在压印或压花冲程期间可用的线性致动器的行进或控制位移的方法和装置。 楔形误差补偿头（2）包括可移动部分（4），固定部分（3）和至少三个线性致动器（8）。 每个线性致动器（8）在另一端通过楔（9）在一端连接到部分（3,4）中的一个并且两个部分（4,3）中的另一个连接到另一端。 通过楔形（9），可以粗略地或粗略地补偿系统的各个子部件的楔形误差和可能的公差。 线性执行器（8）仅用于精确或精确补偿楔形误差。 以这种方式，足够的控制位移可用于具有线性致动器的压印行程。

公开(公告)号：US09281229B2

公开(公告)日：2016-03-08

申请号：US14556298

申请日：2014-12-01

申请人： SUSS MicroTec Lithography GmbH

发明人： Gregory George ,  Hale Johnson ,  Patrick Gorun ,  Emmett Hughlett ,  James Hermanowski ,  Matthew Stiles

IPC分类号： B32B38/10 ,  H01L21/683 ,  B32B43/00 ,  H01L21/67 ,  H01L21/673 ,  B32B38/18

CPC分类号： H01L21/6835 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/673 ,  H01L2221/68318 ,  H01L2221/68327 ,  Y10S156/93 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/942 ,  Y10S156/943 ,  Y10T29/49817 ,  Y10T29/53274 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1972 ,  Y10T156/1978 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26 ,  Y10T279/29

摘要： A method for debonding two temporary bonded wafers, includes providing a debonder comprising a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly and an X-axis drive control configured to drive horizontally the X-axis carriage drive and the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. Next, loading a wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly. Next, driving the X-axis carriage drive and the bottom chuck assembly to the process zone under the top chuck assembly. Next, placing the unbonded surface of the carrier wafer in contact with the top chuck assembly and holding the carrier wafer by the top chuck assembly. Next, initiating horizontal motion of the X-axis carriage drive while heat is applied to the carrier wafer and while the carrier wafer is held by the top chuck assembly.

摘要翻译： 一种用于剥离两个临时粘合晶片的方法，包括提供一个脱粘器，其包括顶部卡盘组件，底部卡盘组件，支撑顶部卡盘组件的静态机架，支撑底部卡盘组件的X轴托架驱动器和X轴驱动 控制器被配置为将X轴托架驱动器和底部卡盘组件从加载区域水平驱动到顶部卡盘组件下方的处理区域以及从处理区域到加载区域。 接下来，将负载区域上的通过粘合剂层将包含结合到器件晶片的载体晶片的晶片对装载在负载区域上的底部卡盘组件上，使得器件晶片的未结合表面与底部组件接触。 接下来，将X轴托架驱动器和底卡盘组件驱动到顶卡盘组件下的处理区域。 接下来，将载体晶片的未结合表面与顶部卡盘组件接触并且通过顶部卡盘组件保持载体晶片。 接下来，当向载体晶片施加热量并且当载体晶片被顶部卡盘组件保持时，启动X轴托架驱动器的水平运动。

公开(公告)号：US09064686B2

公开(公告)日：2015-06-23

申请号：US13790684

申请日：2013-03-08

申请人： Gregory George ,  Stefan Lutter

发明人： Gregory George ,  Stefan Lutter

IPC分类号： H01L21/00 ,  H01L21/02 ,  H01L21/20 ,  H01L21/67 ,  H01L21/683

CPC分类号： B32B37/0046 ,  B32B37/1284 ,  B32B37/18 ,  B32B2307/202 ,  B32B2457/14 ,  H01L21/0201 ,  H01L21/2007 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/17

摘要： A method for temporary bonding first and second wafers includes, applying a first adhesive layer upon a first surface of a first wafer and then curing the first adhesive layer. Next, applying a second adhesive layer upon a first surface of a second wafer. Next, inserting the first wafer into a bonder module and holding the first wafer by an upper chuck assembly so that its first surface with the cured first adhesive layer faces down. Next, inserting the second wafer into the bonder module and placing the second wafer upon a lower chuck assembly so that the second adhesive layer faces up and is opposite to the first adhesive layer. Next, moving the lower chuck assembly upwards and bringing the second adhesive layer in contact with the cured first adhesive layer, and then curing the second adhesive layer.

摘要翻译： 临时粘合第一和第二晶片的方法包括：在第一晶片的第一表面上施加第一粘合剂层，然后固化第一粘合剂层。 接下来，将第二粘合剂层施加到第二晶片的第一表面上。 接下来，将第一晶片插入粘合剂模块中，并通过上卡盘组件保持第一晶片，使得其第一表面与固化的第一粘合剂层面朝下。 接下来，将第二晶片插入到接合器模块中，并将第二晶片放置在下卡盘组件上，使得第二粘合剂层面向上并与第一粘合剂层相对。 接下来，向下移动下卡盘组件并使第二粘合剂层与固化的第一粘合剂层接触，然后固化第二粘合剂层。

公开(公告)号：US20140319786A1

公开(公告)日：2014-10-30

申请号：US14330497

申请日：2014-07-14

申请人： HALE JOHNSON ,  GREGORY GEORGE ,  MICHAEL BRENNEN

发明人： HALE JOHNSON ,  GREGORY GEORGE ,  MICHAEL BRENNEN

IPC分类号： H01L21/68 ,  H01L21/683

CPC分类号： H01L21/68 ,  H01L21/67092 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26

摘要： A device for locating and engaging a notch on the perimeter of a circular wafer includes a notch locating component and a first plate. The notch locating component is configured to move linearly along a first axis and includes a front elongated component extending along a second axis perpendicular to the first axis and having a front surface, a back surface opposite to the front surface and a first protrusion extending from the front surface of the elongated component. The first protrusion has a shape complementing the shape of a notch formed on the perimeter of a circular wafer. As the notch locating component is driven toward the perimeter of the circular wafer along the first axis, a distance between the back surface of the elongated component and a front surface of the first plate is measured and the value of the measured distance is used to determine engagement of the first protrusion with the notch.

摘要翻译： 用于定位和接合圆形晶片周界上的凹口的装置包括凹口定位部件和第一板。 凹口定位部件被构造成沿着第一轴线性地移动并且包括沿垂直于第一轴线的第二轴线延伸的前部细长部件，并且具有前表面，与前表面相对的后表面和从该前表面延伸的第一突出部 细长部件的前表面。 第一突起具有补充形成在圆形晶片的周边上的凹口的形状的形状。 当切口定位部件沿着第一轴线朝向圆形晶片的周边被驱动时，测量细长部件的后表面与第一板的前表面之间的距离，并且使用测量的距离的值来确定 第一突起与凹口的接合。

公开(公告)号：US08343300B2

公开(公告)日：2013-01-01

申请号：US12975521

申请日：2010-12-22

申请人： James Hermanowski

发明人： James Hermanowski

IPC分类号： B29C65/00 ,  B29C63/00 ,  B32B37/00 ,  B32B38/00 ,  B65H1/00 ,  B65G25/00 ,  B66C17/08 ,  H01L21/677 ,  B24B49/00 ,  B24B51/00 ,  B24B1/00 ,  B24B7/19 ,  B24B7/30 ,  B24B3/00 ,  B24B5/18 ,  B24B5/00 ,  B24B29/00

CPC分类号： H01L21/67745 ,  H01L21/67132 ,  H01L21/6719 ,  H01L21/67207 ,  H01L21/67748 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/68742 ,  H01L2221/68318 ,  H01L2221/68331 ,  H01L2924/30105 ,  Y10T156/1132 ,  Y10T156/15 ,  Y10T156/1944

摘要： An improved apparatus for debonding temporary bonded wafers includes a debonder, a cleaning module and a taping module. A vacuum chuck is used in the debonder for holding the debonded thinned wafer and remains with the thinned debonded wafer during the follow up processes steps of cleaning and mounting onto a dicing tape. In one embodiment the debonded thinned wafer remains onto the vacuum chuck and is moved with the vacuum chuck into the cleaning module and then the taping module. In another embodiment the debonded thinned wafer remains onto the vacuum chuck and first the cleaning module moves over the thinned wafer to clean the wafer and then the taping module moves over the thinned wafer to mount a dicing tape onto the wafer.

摘要翻译： 用于剥离临时粘合晶片的改进的装置包括剥离器，清洁模块和胶带模块。 在脱粘器中使用真空吸盘来保持脱粘的薄化晶片，并且在清洁和安装到切割带上的后续处理步骤期间保持与变薄的脱粘晶片。 在一个实施例中，剥离的薄化晶片保留在真空卡盘上，并且随着真空卡盘移动到清洁模块中，然后移动到胶带模块。 在另一个实施例中，脱粘的薄化晶片保留在真空卡盘上，并且首先清洁模块在薄的晶片上移动以清洁晶片，然后胶带模块在薄的晶片上移动以将切割带安装到晶片上。

公开(公告)号：US08267143B2

公开(公告)日：2012-09-18

申请号：US12761014

申请日：2010-04-15

申请人： Gregory George ,  Hale Johnson ,  Patrick Gorun ,  James Hermanowski ,  Matthew Stiles

发明人： Gregory George ,  Hale Johnson ,  Patrick Gorun ,  James Hermanowski ,  Matthew Stiles

IPC分类号： B32B38/10

CPC分类号： H01L21/6835 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/673 ,  H01L2221/68318 ,  H01L2221/68327 ,  Y10S156/93 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/942 ,  Y10S156/943 ,  Y10T29/49817 ,  Y10T29/53274 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1972 ,  Y10T156/1978 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26 ,  Y10T279/29

摘要： An apparatus for debonding two temporary bonded wafers includes a chuck assembly, a flex plate assembly and a contact roller. The chuck assembly includes a chuck and a first wafer holder to hold wafers in contact with the top surface of the chuck. The flex plate assembly includes a flex plate and a second wafer holder configured to hold wafers in contact with a first surface of the flex plate. The flex plate comprises a first edge arranged adjacent to a first edge of the chuck and connected to a hinge. The flex plate is configured to swing around the hinge and to be placed above the top surface of the chuck. The contact roller is arranged adjacent to a second edge of the chuck, which is diametrically opposite to its first edge. A debond drive motor moves the contact roller vertical to the plane of the chuck top surface.

摘要翻译： 用于剥离两个临时粘合晶片的装置包括卡盘组件，柔性板组件和接触辊。 卡盘组件包括卡盘和第一晶片保持器，以保持晶片与卡盘的顶表面接触。 柔性板组件包括柔性板和第二晶片保持器，第二晶片保持器被构造成保持与柔性板的第一表面接触的晶片。 柔性板包括与卡盘的第一边缘相邻并且连接到铰链的第一边缘。 柔性板被构造成围绕铰链摆动并且被放置在卡盘的顶表面之上。 接触辊被布置成与卡盘的与其第一边缘径向相对的第二边缘相邻。 脱粘驱动电机使接触辊垂直于卡盘顶面的平面移动。

公开(公告)号：US06966560B2

公开(公告)日：2005-11-22

申请号：US10631330

申请日：2003-07-31

申请人： Walter Demel ,  Ralph Zoberbier

发明人： Walter Demel ,  Ralph Zoberbier

IPC分类号： G03F7/20 ,  B23Q3/08 ,  H01L21/027 ,  H01L21/683 ,  B23B31/30

CPC分类号： H01L21/6838 ,  Y10T279/11

摘要： A device or chuck for fixing thin and/or flexible substrates allows a uniform and all-over sucking-up of the substrates without any disadvantageous warping or bending. The chuck has notches and holes communicating with a plurality of microgrooves arranged on the bearing surface. If a vacuum device sucks off air through the bores and the notches, a vacuum extends in the microgrooves so that a substrate located on the bearing surface is sucked up.

摘要翻译： 用于固定薄和/或柔性基板的装置或卡盘允许基板的均匀和全面吸附，而没有任何不利的翘曲或弯曲。 卡盘具有与布置在支承表面上的多个微槽连通的凹口和孔。 如果真空装置通过孔和凹口吸出空气，则真空在微槽中延伸，使得位于支承表面上的基板被吸入。