SUBSTRATE TRANSFER DEVICES, SYSTEMS AND METHODS OF USE THEREOF

    公开(公告)号:US20230173661A1

    公开(公告)日:2023-06-08

    申请号:US18100522

    申请日:2023-01-23

    CPC classification number: B25J9/042 B25J9/0009 B25J9/104 B25J9/123 B25J11/0095

    Abstract: The disclosure describes devices, systems and methods relating to a transfer chamber for an electronic device processing system. For example, a method includes causing a robot arm to pick up a substrate. The robot arm is caused to pick up the substrate by causing a first mover to rotate or to change a first distance to a second mover. Rotation of the first mover or the change in the first distance causes the first robot arm to rotate about a shoulder axis. The robot arm is further caused to pick up the substrate by causing one of a) a second mover to rotate or b) a third mover to change a second distance to the second mover. Rotation of the second mover or the change in the second distance causes the robot arm to raise or lower.

    Robot system and offset acquisition method

    公开(公告)号:US11654578B2

    公开(公告)日:2023-05-23

    申请号:US17024543

    申请日:2020-09-17

    Abstract: A robot system according to an embodiment may include a robot, a wafer jig that is held by the robot, a positioning base, a positional displacement detection device, a control part, and an offset acquisition part for acquiring an offset that occurs between a command position for the robot and an actual position. The positioning base includes contacting members. The wafer jig has a tapered surface. The tapered surface guides the wafer jig so that a center of the wafer jig approaches a predetermined position as a position where the taped surface contacts the contacting members is relatively higher. The robot places the wafer jig on the positioning base, then holds and conveys the wafer jig to the positional displacement detection device. The offset acquisition part acquires the offset based on a result in which the positional displacement detection device detects a positional displacement of the conveyed wafer jig.

    CALIBRATION DEVICE AND ROBOT SYSTEM USING SAME

    公开(公告)号:US20180169854A1

    公开(公告)日:2018-06-21

    申请号:US15737372

    申请日:2016-06-15

    Inventor: Koji SHIRATSUCHI

    Abstract: A calibration unit includes: an approximate curve generation unit configured to generate an approximate curve based on position information and force information obtained when a tool part is rotated in accordance with an attitude command value; a bias value estimation unit configured to estimate the bias value of the force information based on the approximate curve, the position information, and the force information; a mass/center-of-gravity position estimation unit configured to remove the bias value from the force information, and to calculate a mass and a center-of-gravity position vector of the hand tip load based on the obtained force information; and an external force component calculation unit configured to subtract the bias value and the gravity action component of the hand tip load from the force information based on the bias value, and the mass and the center-of-gravity position vector.

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