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    Surface micromachining using a thick release process
    31.
    发明授权
    Surface micromachining using a thick release process 失效
    使用厚释放工艺进行表面微加工

    公开(公告)号：US06531332B1

    公开(公告)日：2003-03-11

    申请号：US09756860

    申请日：2001-01-10

    Applicant: Andrei M Shkel ,  Michael J Little

    Inventor： Andrei M Shkel ,  Michael J Little

    IPC: H01L2100

    CPC classification number: B81C1/00944 ,  B81B3/004 ,  B81C2201/0107

    Abstract: A hybrid process combines a thin-film surface micromachining process such as by sputtering, evaporation or chemical vapor deposition with a thick-film surface micromachining and release process such as dry-film lamination. Such combination results in thin film micro-structures with all the benefits of surface micromachining without the typical problems of stiction and limited range of motion.

    Abstract translation: 混合工艺将诸如溅射，蒸发或化学气相沉积的薄膜表面微加工工艺与诸如干膜层压的厚膜表面微机械加工和释放方法相结合。 这种组合导致薄膜微结构具有表面微机械加工的所有优点，而没有典型的静摩擦和运动范围的问题。

    Structuring three-dimensional components with non-diffusing noble or special metals and their alloys, with use being made of sputter technology
    33.
    发明授权
    Structuring three-dimensional components with non-diffusing noble or special metals and their alloys, with use being made of sputter technology 有权
    用不扩散的贵金属或特殊金属及其合金构造三维元件，并采用溅射技术制成

    公开(公告)号：US09090975B2

    公开(公告)日：2015-07-28

    申请号：US13164305

    申请日：2011-06-20

    Applicant: Heiko Specht ,  Andreas Reisinger ,  Ulrich Hausch ,  Frank Krueger ,  Jens Troetzschel

    Inventor： Heiko Specht ,  Andreas Reisinger ,  Ulrich Hausch ,  Frank Krueger ,  Jens Troetzschel

    IPC: C23C28/02 ,  B81C1/00

    CPC classification number: C23C28/023 ,  B81C1/00619 ,  B81C2201/0107 ,  B81C2201/0181

    Abstract: One aspect is a method for the production of a three-dimensional structure of successive layers producing a multitude of successive layers wherein, with the exception of a first layer, each of the successive layers is arranged on a preceding layer. Each of the successive layers includes at least two materials wherein one material is a sacrificial material and one material is a structure material. Each of the successive layers defines a successive cross-section through the three-dimensional structure. Producing each of the layers includes depositing the sacrificial material by means of an electrochemical process and depositing the structure material by means of physical gas phase deposition. After a multitude of successive layers has been produced, the three-dimensional structure is uncovered by removing at least a part of the sacrificial material. The sacrificial material is at least one of a group consisting of nickel, silver, palladium, and gold.

    Abstract translation: 一个方面是制造连续层的产生多个连续层的三维结构的方法，其中除了第一层之外，每个连续层被布置在前一层上。 每个连续层包括至少两种材料，其中一种材料是牺牲材料，一种材料是结构材料。 每个连续的层限定通过三维结构的连续横截面。 生产每个层包括通过电化学方法沉积牺牲材料并通过物理气相沉积沉积结构材料。 在已经生产了多个连续层之后，通过去除至少一部分牺牲材料来覆盖三维结构。 牺牲材料是由镍，银，钯和金组成的组中的至少一种。

    MICRO-DEVICE ON GLASS
    35.
    发明申请
    MICRO-DEVICE ON GLASS 有权
    玻璃上的MICRO-DEVICE

    公开(公告)号：US20140054261A1

    公开(公告)日：2014-02-27

    申请号：US14040698

    申请日：2013-09-29

    Applicant: Viswanadam Gautham

    Inventor： Viswanadam Gautham

    IPC: B81C1/00

    CPC classification number: B81C1/00341 ,  B81B2201/051 ,  B81B2203/0315 ,  B81B2203/0338 ,  B81C1/00476 ,  B81C2201/0107 ,  B81C2203/036 ,  H01L21/00

    Abstract: A method of fabricating a micro-device having micro-features on glass is presented. The method includes the steps of preparing a first glass substrate, fabricating a metallic pattern on the first glass substrate, preparing a second glass substrate and providing one or more apertures on the second glass substrate, heating the first glass substrate and the second glass substrate with a controlled temperature raise, bonding the first glass substrate and the second glass substrate by applying pressure to form a bonded substrate, wherein the metallic pattern is embedded within the bonded substrate, cooling the bonded substrate with a controlled temperature drop and thereafter maintaining the bonded substrate at a temperature suitable for etching, etching the metallic pattern within the bonded substrate, wherein an etchant has access to the metallic pattern via the apertures, forming a void within the bonded substrate, wherein the void comprises micro-features.

    Abstract translation: 提出了一种在玻璃上制造具有微特征的微器件的方法。 该方法包括以下步骤：制备第一玻璃基板，在第一玻璃基板上制造金属图案，制备第二玻璃基板并在第二玻璃基板上提供一个或多个孔，加热第一玻璃基板和第二玻璃基板， 控制温度升高，通过施加压力来接合第一玻璃基板和第二玻璃基板以形成接合基板，其中金属图案嵌入在接合基板内，以受控的温度下降冷却接合基板，然后保持接合基板 在适于蚀刻的温度下蚀刻所述键合衬底内的所述金属图案，其中所述蚀刻剂经由所述孔进入所述金属图案，在所述键合衬底内形成空隙，其中所述空隙包括微特征。

    REMOVAL OF MOLYBDENUM
    36.
    发明申请
    REMOVAL OF MOLYBDENUM 审中-公开
    去除莫氏

    公开(公告)号：US20130335383A1

    公开(公告)日：2013-12-19

    申请号：US13527467

    申请日：2012-06-19

    Applicant: Teruo Sasagawa

    Inventor： Teruo Sasagawa

    IPC: C23F1/02 ,  G06F3/038 ,  G06T1/00 ,  G02B26/00 ,  H05K13/00

    CPC classification number: G02B26/001 ,  B81C1/00476 ,  B81C2201/0107 ,  B81C2201/0132 ,  C23F4/00

    Abstract: This disclosure provides systems, methods and apparatus which involve selectively removing a sacrificial portion of molybdenum (Mo) relative to other structural materials in a self-limiting manner. The Mo is only partially removed, leaving behind a remaining portion of molybdenum. The self-limiting etch can form an internal cavity by removing only a portion of a Mo layer between electromechanical systems electrodes. The remaining Mo can serve as a support structure between the electrodes.

    Abstract translation: 本公开提供了涉及以自限制的方式相对于其他结构材料选择性地去除钼（Mo）的牺牲部分的系统，方法和装置。 Mo仅部分除去，留下剩余部分的钼。 自限蚀刻可以通过在机电系统电极之间仅去除Mo层的一部分来形成内部空腔。 剩余的Mo可用作电极之间的支撑结构。

    STRUCTURING THREE-DIMENSIONAL COMPONENTS WITH NON-DIFFUSING NOBLE OR SPECIAL METALS AND THEIR ALLOYS, WITH USE BEING MADE OF SPUTTER TECHNOLOGY
    39.
    发明申请
    STRUCTURING THREE-DIMENSIONAL COMPONENTS WITH NON-DIFFUSING NOBLE OR SPECIAL METALS AND THEIR ALLOYS, WITH USE BEING MADE OF SPUTTER TECHNOLOGY 有权
    用非扩散型金属或特殊金属及其合金构造三维构件，使用溅射技术

    公开(公告)号：US20110308957A1

    公开(公告)日：2011-12-22

    申请号：US13164305

    申请日：2011-06-20

    Applicant: Heiko Specht ,  Andreas Reisinger ,  Ulrich Hausch ,  Frank Krueger ,  Jens Troetzschel

    Inventor： Heiko Specht ,  Andreas Reisinger ,  Ulrich Hausch ,  Frank Krueger ,  Jens Troetzschel

    IPC: C23C28/02 ,  C23C28/00

    CPC classification number: C23C28/023 ,  B81C1/00619 ,  B81C2201/0107 ,  B81C2201/0181

    Abstract: One aspect is a method for the production of a three-dimensional structure of successive layers producing a multitude of successive layers wherein, with the exception of a first layer, each of the successive layers is arranged on a preceding layer. Each of the successive layers includes at least two materials wherein one material is a sacrificial material and one material is a structure material. Each of the successive layers defines a successive cross-section through the three-dimensional structure. Producing each of the layers includes depositing the sacrificial material by means of an electrochemical process and depositing the structure material by means of physical gas phase deposition. After a multitude of successive layers has been produced, the three-dimensional structure is uncovered by removing at least a part of the sacrificial material. The sacrificial material is at least one of a group consisting of nickel, silver, palladium, and gold.

    Abstract translation: 一个方面是制造连续层的产生多个连续层的三维结构的方法，其中除了第一层之外，每个连续层被布置在前一层上。 每个连续层包括至少两种材料，其中一种材料是牺牲材料，一种材料是结构材料。 每个连续的层限定通过三维结构的连续横截面。 生产每个层包括通过电化学方法沉积牺牲材料并通过物理气相沉积沉积结构材料。 在已经生产了多个连续层之后，通过去除至少一部分牺牲材料来覆盖三维结构。 牺牲材料是由镍，银，钯和金组成的组中的至少一种。

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