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    Dry etch release of MEMS structures
    32.
    发明申请
    Dry etch release of MEMS structures 失效

    公开(公告)号：US20030080082A1

    公开(公告)日：2003-05-01

    申请号：US10046593

    申请日：2001-10-29

    Inventor： Jeffrey D. Chinn ,  Vidyut Gopal ,  Sofiane Soukane ,  Toi Yue Becky Leung

    IPC: C23F001/00

    CPC classification number: B81B3/0005 ,  B81B3/0008 ,  B81B2201/033 ,  B81C2201/016 ,  B81C2201/112

    Abstract: The present invention pertains to a method of fabricating a surface within a MEM which is free moving in response to stimulation. The free moving surface is fabricated in a series of steps which includes a release method, where release is accomplished by a plasmaless etching of a sacrificial layer material. An etch step is followed by a cleaning step in which by-products from the etch step are removed along with other contaminants which may lead to stiction. There are a series of etch and then clean steps so that a number of nullcyclesnull of these steps are performed. Between each etch step and each clean step, the process chamber pressure is typically abruptly lowered, to create turbulence and aid in the removal of particulates which are evacuated from the structure surface and the process chamber by the pumping action during lowering of the chamber pressure. The final etch/clean cycle may be followed by a surface passivation step in which cleaned surfaces are passivated and/or coated.

    Methods of applying coatings to micro electromechanical devices using a carbon dioxide carrier solvent
    33.
    发明申请
    Methods of applying coatings to micro electromechanical devices using a carbon dioxide carrier solvent 审中-公开
    使用二氧化碳载体溶剂将涂层施加到微机电装置的方法

    公开(公告)号：US20030064149A1

    公开(公告)日：2003-04-03

    申请号：US10241999

    申请日：2002-09-12

    Inventor： Seth A. Miller

    IPC: B05D005/06

    CPC classification number: G02B26/0841 ,  B05D1/025 ,  B05D2401/90 ,  B81B3/0005 ,  B81C1/0096 ,  B81C2201/112 ,  B81C2201/117

    Abstract: A method of coating one or more surfaces of a micromechanical device. The coating is applied as a material dissolved in CO2. The CO2 is used a carrier solvent, with the coating being applied as a spray or in liquid form, to form a film on the surface. The CO2 may be used in supercritical form to dissolve the material.

    Abstract translation: 一种涂覆微机械装置的一个或多个表面的方法。 将涂层作为溶解在二氧化碳中的材料施加。 使用CO 2作为载体溶剂，涂层以喷雾或液体形式施用，以在表面上形成膜。 CO2可以以超临界形式使用，以溶解材料。

    Diluent assisted lubrication of micromechanical devices
    35.
    发明授权
    Diluent assisted lubrication of micromechanical devices 有权
    稀释剂辅助微机械装置的润滑

    公开(公告)号：US06475570B2

    公开(公告)日：2002-11-05

    申请号：US10036611

    申请日：2001-12-31

    Applicant: Simon Joshua Jacobs

    Inventor： Simon Joshua Jacobs

    IPC: B05D102

    CPC classification number: B81C1/0096 ,  B05D1/60 ,  B05D5/083 ,  B81B3/0005 ,  B81C2201/0181 ,  B81C2201/112

    Abstract: A method and apparatus for delivering a fine mist of a lubricant to a micromechanical device. A mixture 402 of a lubricant and a diluent carrier fluid is held in a supply reservoir 404. The mixture is forced through a nebulizer tip 406 to produce a fine aerosol. A particle selector 408 removes large droplets from the aerosol as the aerosol passes. The aerosol travels a distance through a delivery conduit 410 while the diluent carrier fluid evaporates from the nebulized droplets. The evaporation removes the vast majority of the diluent carrier fluid from the droplets, greatly reducing the size of the lubricant droplets. The evaporated aerosol enters a deposition chamber 412 and is deposited on a micromechanical device 414. The micromechanical devices may be lubricated in wafer form, in which case the lubricant aerosol will lubricate an entire wafer of micromechanical devices at one time. One embodiment produces an aerosol having a mean droplet size of less than 10 microns. Evaporation of the diluent carrier fluid reduces this droplet size to 10-500 nm by the time the lubricant is deposited on the micromechanical devices. The preceding abstract is submitted with the understanding that it only will be used to assist in determining, from a cursory inspection, the nature and gist of the technical disclosure as described in 37 C.F.R. §1.72(b). In no case should this abstract be used for interpreting the scope of any patent claims.

    Abstract translation: 一种用于将微细油雾润滑剂输送到微机械装置的方法和装置。 润滑剂和稀释剂载体流体的混合物402被保持在供应容器404中。混合物被迫通过雾化器尖端406以产生细小的气溶胶。 颗粒选择器408随着气溶胶通过而从气溶胶中去除大​​的液滴。 气雾剂通过输送管道410行进一段距离，同时稀释剂载体流体从喷雾的液滴中蒸发。 蒸发从液滴中除去大部分稀释剂载体流体，大大减小了润滑剂液滴的尺寸。 蒸发的气溶胶进入沉积室412并沉积在微机械装置414上。微机械装置可以以晶片形式润滑，在这种情况下，润滑剂气溶胶将一次润滑整个微机械装置的晶片。 一个实施例产生具有小于10微米的平均液滴尺寸的气溶胶。 润滑剂沉积在微机械装置上时，稀释剂载体流体的蒸发将该液滴尺寸减小到10-500nm。 提交上述摘要的理解是，它只会用于协助从粗略检查中确定37 C.F.R.描述的技术披露的性质和要点。 §1.72（b）。 在任何情况下，本摘要不得用于解释任何专利权利要求的范围。

    Micromechanical device including time-release passivant
    38.
    发明授权
    Micromechanical device including time-release passivant 失效
    微机械装置包括时间放电钝化剂

    公开(公告)号：US5939785A

    公开(公告)日：1999-08-17

    申请号：US833166

    申请日：1997-04-03

    Applicant: Homer B. Klonis ,  Arlene Y. Yeh ,  Mark Reed

    Inventor： Homer B. Klonis ,  Arlene Y. Yeh ,  Mark Reed

    IPC: B81B7/00 ,  G02B26/08 ,  H01L27/14

    CPC classification number: B81B7/0038 ,  B81B3/0016 ,  G02B26/0841 ,  B81C2201/112

    Abstract: An electronic device (10) such as that of the micromechanical type having a time-released source of a passivant (20). This source (20) is preferably comprised of an impregnated molecular sieve/binder combination, preferably being a polymer. The passivant may be PFDA. The time-released passivant source continuously over the life of the device reduces any tendency of engaged or contacting elements to stick, adhere, or otherwise resist separation. The present invention finds particular use in spatial light modulators of the DMD type. The molecular sieve/binder can also include getter/desiccant source, such as a non-evaporable getter to remove moisture from the hermetically sealed electronic device.

    Abstract translation: 诸如微机械型电子设备的电子设备（10）具有时间释放的钝化剂源（20）。 该源（20）优选由浸渍的分子筛/粘合剂组合物组成，优选为聚合物。 钝化剂可能是PFDA。 在设备的使用寿命内连续释放的钝化剂源减少了接合或接触元件粘附，粘附或以其他方式抵抗分离的倾向。 本发明特别用于DMD型空间光调制器。 分子筛/粘合剂还可以包括吸气剂/干燥剂源，例如从气密密封的电子设备中除去水分的非蒸发性吸气剂。

    Low surface energy passivation layer for micromechanical devices
    40.
    发明授权
    Low surface energy passivation layer for micromechanical devices 失效
    用于微机械器件的低表面能钝化层

    公开(公告)号：US5602671A

    公开(公告)日：1997-02-11

    申请号：US193689

    申请日：1994-02-04

    Applicant: Larry J. Hornbeck

    Inventor： Larry J. Hornbeck

    IPC: B81B3/00 ,  G02B26/08 ,  G02B26/02

    CPC classification number: B81B3/0005 ,  G02B26/0841 ,  B81C2201/112 ,  B82Y10/00 ,  B82Y30/00

    Abstract: It is possible to use an oriented monolayer to limit the Van der Waals forces between two elements by passivation. An oriented monolayer (34) is formed on a surface of a micromechanical device. When the surface comes in contact with another surface, the oriented monolayer decreases the Van der Waals forces to reduce the attraction between the surfaces.

    Abstract translation: 可以使用取向的单层通过钝化来限制两个元件之间的范德华力。 在微机械装置的表面上形成定向单层（34）。 当表面与另一个表面接触时，取向的单层减小范德华力，以减少表面之间的吸引力。

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