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    HIGH-PRECISION ALIGNMENT METHOD FOR PRODUCING A DEVICE, AND DEVICE
    32.
    发明公开
    HIGH-PRECISION ALIGNMENT METHOD FOR PRODUCING A DEVICE, AND DEVICE 审中-公开

    公开(公告)号：US20240262683A1

    公开(公告)日：2024-08-08

    申请号：US18562827

    申请日：2022-05-18

    申请人： ams-OSRAM International GmbH

    发明人： Nicole Berner ,  Daniel Richter ,  Gunnar Petersen

    IPC分类号： B81C3/00 ,  G02B6/42

    CPC分类号： B81C3/004 ,  G02B6/423 ,  B81C2203/054

    摘要： In an embodiment a method includes providing a coupling element with at least one predefined coupling point, arranging at least one component with a temporary alignment with the predefined coupling point, wherein the component comprises a decoupling point which is approximately aligned with the predefined coupling point of the coupling element, performing an assisted self-alignment of the component with the predefined coupling point, wherein the self-alignment is assisted by utilizing an action of a capillary force on an alignment material which is embedded in the component or attached to the component or by diverting the alignment material, and wherein the decoupling point of the component is moved to the predefined coupling point of the coupling element and adjusted, and permanent fixing of the component to the coupling element after carrying out the assisted self-alignment of the component.

    POSITIONING METHOD IN MICROPROCESSING PROCESS OF BULK SILICON
    36.
    发明申请
    POSITIONING METHOD IN MICROPROCESSING PROCESS OF BULK SILICON 有权

    公开(公告)号：US20170113930A1

    公开(公告)日：2017-04-27

    申请号：US15315640

    申请日：2015-08-19

    申请人： CSMC TECHNOLOGIES FAB1 CO., LTD.

    发明人： Errong JING

    IPC分类号： B81C3/00

    CPC分类号： B81C3/004 ,  B81C1/00 ,  B81C1/00603 ,  B81C3/00 ,  B81C2203/051 ,  G03F9/00 ,  H01L21/68

    摘要： A positioning method in a microprocessing process of bulk silicon comprises the steps of: fabricating, on a first surface of a first substrate (10), a first pattern (100), a stepper photo-etching machine alignment mark (200) for positioning the first pattern, and a double-sided photo-etching machine first alignment mark (300) for positioning the stepper photo-etching machine alignment mark; fabricating, on a second surface, opposite to the first surface, of the first substrate, a double-sided photo-etching machine second alignment mark (400) corresponding to the double-sided photo-etching machine first alignment mark; bonding a second substrate (20) on the first surface of the first substrate; performing thinning on a first surface of the second substrate; fabricating, on the first surface of the second substrate, a double-sided photo-etching machine third alignment mark (500) corresponding to the double-sided photo-etching machine second alignment mark; and finding, on the first surface of the second substrate by using the double-sided photo-etching machine third alignment mark, a corresponding position of the stepper photo-etching machine alignment mark.

    Device for measuring alignment of adjoining structures
    40.
    发明授权
    Device for measuring alignment of adjoining structures 有权
    用于测量相邻结构的对准的装置

    公开(公告)号：US08195420B2

    公开(公告)日：2012-06-05

    申请号：US12545383

    申请日：2009-08-21

    申请人： Francois De Crecy

    发明人： Francois De Crecy

    IPC分类号： G01B21/00

    CPC分类号： G01B21/085 ,  B81C3/004 ,  B81C2203/051 ,  G01B21/16 ,  G01M99/002 ,  H01L21/67242

    摘要： The invention relates to the field of micro- and nanotechnologies. In these techniques, it is sometimes necessary to glue several structures face to face and it is important to be able to check the alignment of the structures. A new method for measuring alignment, which comprises the following operations, is proposed for this purpose: activation of a heating element placed on the surface of the first structure, generation of electronic signals representative of a distribution of temperatures, on the basis of an array of temperature sensitive elements placed on the surface of the second structure, determination of a relative position of the heating element with respect to the array of sensitive elements, therefore of the first structure with respect to the second, on the basis of the distribution of temperatures, in a calculation circuit receiving the electronic signals engendered in the array of sensitive elements.

    摘要翻译： 本发明涉及微纳米技术领域。 在这些技术中，有时需要面对面地粘合几个结构，并且能够检查结构的对准是重要的。 提出了一种用于测量对准的新方法，其包括以下操作：基于阵列激活放置在第一结构的表面上的加热元件，产生代表温度分布的电子信号 温度敏感元件放置在第二结构的表面上，基于温度分布来确定加热元件相对于敏感元件阵列的相对位置，因此第一结构相对于第二结构相对于第二结构 在计算电路中接收产生在敏感元件阵列中的电子信号。