公开(公告)号：US3344505A

公开(公告)日：1967-10-03

申请号：US39827464

申请日：1964-09-22

申请人： WESTINGHOUSE ELECTRIC CORP

发明人： RIVELY CLAIR M ,  LIVERA PHILLIP A

IPC分类号： C04B37/02 ,  C23C14/26 ,  H01L23/29

CPC分类号： C23C14/26 ,  C04B37/026 ,  C04B2235/666 ,  C04B2237/121 ,  C04B2237/361 ,  C04B2237/403 ,  C04B2237/64 ,  C04B2237/74 ,  C04B2237/86 ,  H01L23/291 ,  H01L2924/0002 ,  Y10S428/939 ,  Y10T428/12576 ,  Y10T428/12743 ,  H01L2924/00

公开(公告)号：US3179826A

公开(公告)日：1965-04-20

申请号：US13820461

申请日：1961-09-14

申请人： JAMES TROTT WINFIELD ,  RADFORD WILLIAM E

发明人： JAMES TROTT WINFIELD ,  RADFORD WILLIAM E

IPC分类号： B23K35/26 ,  C04B37/00 ,  C04B37/02 ,  H01L41/22

CPC分类号： C04B37/006 ,  B23K35/26 ,  C04B37/026 ,  C04B2235/5436 ,  C04B2235/604 ,  C04B2235/6567 ,  C04B2237/12 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/34 ,  C04B2237/405 ,  C04B2237/408 ,  C04B2237/52 ,  C04B2237/64 ,  C04B2237/704 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/74 ,  C04B2237/765 ,  C04B2237/88 ,  H01L41/0471 ,  H01L41/0477 ,  H01L41/277 ,  H01L41/29 ,  Y10S420/903 ,  Y10S428/929 ,  Y10T29/42 ,  Y10T428/12063 ,  Y10T428/12778 ,  Y10T428/12785 ,  Y10T428/12896

公开(公告)号：US3160480A

公开(公告)日：1964-12-08

申请号：US10943261

申请日：1961-05-11

申请人： NORTON CO

发明人： ALLIEGRO RICHARD A

IPC分类号： B23K35/30 ,  C04B37/02 ,  C25C3/08 ,  C25C3/16

CPC分类号： B23K35/3006 ,  C04B37/026 ,  C04B2235/6565 ,  C04B2235/6567 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/36 ,  C04B2237/405 ,  C04B2237/406 ,  C04B2237/52 ,  C04B2237/64 ,  C04B2237/74 ,  C04B2237/76 ,  C04B2237/765 ,  C04B2237/84 ,  C25C3/08 ,  C25C3/16 ,  Y10S428/939 ,  Y10T428/12576 ,  Y10T428/12896 ,  Y10T428/12972 ,  Y10T428/12986

公开(公告)号：US3109054A

公开(公告)日：1963-10-29

申请号：US79204859

申请日：1959-02-09

申请人： BENDIX CORP

发明人： KUHNAPFEL ROBERT H ,  WILLIAM SARDO

IPC分类号： C04B37/02

CPC分类号： C04B37/026 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/32 ,  C04B2237/403 ,  C04B2237/406 ,  C04B2237/62 ,  C04B2237/64 ,  C04B2237/74 ,  C04B2237/76 ,  C04B2237/765 ,  C04B2237/84 ,  Y10S439/935 ,  Y10T29/49211

公开(公告)号：US3088201A

公开(公告)日：1963-05-07

申请号：US83620159

申请日：1959-08-26

申请人： GEN ELECTRIC

发明人： LOUDEN WILLIAM C ,  ELMER HOMONNAY

IPC分类号： C04B37/02

CPC分类号： C04B37/026 ,  C04B2235/6581 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/126 ,  C04B2237/343 ,  C04B2237/406 ,  C04B2237/62 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/74 ,  C04B2237/76 ,  C04B2237/765 ,  C04B2237/84 ,  Y10S228/903 ,  Y10T29/49105

公开(公告)号：US20240312678A1

公开(公告)日：2024-09-19

申请号：US18281762

申请日：2021-07-07

申请人： JIANGSU NEW LINZHI ELECTRONIC TECHNOLOGY CO., LTD.

发明人： Qiuyun FU ,  Zhengan HE ,  Dongxiang ZHOU

IPC分类号： H01C7/02 ,  C04B37/02 ,  H01C1/14

CPC分类号： H01C7/021 ,  C04B37/023 ,  C04B37/028 ,  H01C1/1406 ,  C04B2237/10 ,  C04B2237/346 ,  C04B2237/74

摘要： A positive temperature coefficient ceramic thermistor element includes a sintered thermosensitive ceramic piece that uses lead barium titanate as a base, as well as metal ohmic electrodes which are positioned on two side surfaces of the thermosensitive ceramic piece. The thermistor element has a microporous channel barrier layer, and includes a glass sealing layer which wraps the outer surface of the thermosensitive ceramic piece, or an organic matter sealant which fills and blocks micro-pores in the surfaces of the metal ohmic electrodes combined on the two side surfaces of the thermosensitive ceramic piece and, at the same time, blocks gaps in the surfaces of areas, that do not have the metal ohmic electrodes, of a peripheral edge of the thermosensitive ceramic piece.

公开(公告)号：US11840487B2

公开(公告)日：2023-12-12

申请号：US17670168

申请日：2022-02-11

申请人： Ambri Inc.

发明人： David J. Bradwell ,  Brian Neltner ,  Vimal Pujari ,  Michael J. McNeley ,  Greg A. Thompson ,  Chia-Ying Lee ,  David S. Deak ,  Hari P. Nayar

IPC分类号： H01M50/186 ,  H01M50/191 ,  H01M50/176 ,  H01M50/147 ,  C04B37/02 ,  H01M10/39 ,  C22C27/04

CPC分类号： C04B37/026 ,  C22C27/04 ,  H01M10/39 ,  H01M10/399 ,  H01M50/147 ,  H01M50/176 ,  H01M50/186 ,  H01M50/191 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/366 ,  C04B2237/403 ,  C04B2237/72 ,  C04B2237/74 ,  H01M2220/10 ,  H01M2300/0057

摘要： The disclosure provides seals for devices that operate at elevated temperatures and have reactive metal vapors, such as lithium, sodium or magnesium. In some examples, such devices include energy storage devices that may be used within an electrical power grid or as part of a standalone system. The energy storage devices may be charged from an electricity production source for later discharge, such as when there is a demand for electrical energy consumption.

公开(公告)号：US20230202137A1

公开(公告)日：2023-06-29

申请号：US18115182

申请日：2023-02-28

申请人： KABUSHIKI KAISHA TOSHIBA ,  TOSHIBA MATERIALS CO., LTD.

发明人： Shota YAMAMOTO ,  Fumihiko YOSHIMURA ,  Seiichi SUENAGA ,  Tomoyuki OOZEKI

IPC分类号： B32B7/12 ,  H01L23/373 ,  B32B15/20 ,  B32B15/04 ,  C04B37/02

CPC分类号： B32B7/12 ,  H01L23/3735 ,  B32B15/20 ,  B32B15/04 ,  C04B37/023 ,  B32B2250/40 ,  B32B2307/732 ,  B32B2255/205 ,  B32B2457/08 ,  C04B2237/125 ,  C04B2237/407 ,  C04B2237/368 ,  C04B2237/708 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/74

摘要： A bonded assembly according to the present embodiment, includes a metal plate and a ceramic substrate bonded to each other through a bonding layer containing Ag. In the bonded assembly, in a measurement region that is formed in a cross section formed by a thickness direction of the bonding layer and an orthogonal direction thereto, and that has a size of a length in the thickness direction of the bonding layer×a length of 200 μm in the orthogonal direction, a Ag-rich region having a Ag concentration of 60 at % or more has an area ratio of 70% or less to a Ag-poor region having a Ag concentration of 50 at % or less.

公开(公告)号：US20180090726A1

公开(公告)日：2018-03-29

申请号：US15690863

申请日：2017-08-30

申请人： Ambri Inc.

发明人： Greg Thompson ,  David J. Bradwell ,  Vimal Pujari ,  Chia-Ying Lee ,  David McCleary ,  Jennifer Cocking ,  James D. Fritz

IPC分类号： H01M2/06 ,  H01M10/39 ,  C04B37/02 ,  C22C27/04

CPC分类号： H01M2/065 ,  C04B37/026 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/366 ,  C04B2237/403 ,  C04B2237/72 ,  C04B2237/74 ,  C22C27/04 ,  H01M2/06 ,  H01M2/08 ,  H01M10/39 ,  H01M10/399 ,  H01M2220/10 ,  H01M2300/0057

摘要： The disclosure provides seals for devices that operate at elevated temperatures and have reactive metal vapors, such as lithium, sodium or magnesium. In some examples, such devices include energy storage devices that may be used within an electrical power grid or as part of a standalone system. The energy storage devices may be charged from an electricity production source for later discharge, such as when there is a demand for electrical energy consumption.

公开(公告)号：US09833855B2

公开(公告)日：2017-12-05

申请号：US14772913

申请日：2014-03-17

申请人： MITSUBISHI MATERIALS CORPORATION

发明人： Nobuyuki Terasaki ,  Yoshiyuki Nagatomo

IPC分类号： B23K31/02 ,  B23K1/00 ,  H01L23/373 ,  C04B37/02 ,  B23K1/19 ,  B23K35/28 ,  B23K35/30 ,  B23K35/36 ,  C22C21/08 ,  H01L21/48 ,  H01L23/473 ,  B23K103/00 ,  B23K103/10 ,  B23K103/12 ,  B23K103/18

CPC分类号： B23K1/0006 ,  B23K1/0016 ,  B23K1/19 ,  B23K35/286 ,  B23K35/302 ,  B23K35/3611 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/18 ,  B23K2103/52 ,  C04B37/026 ,  C04B2237/122 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/128 ,  C04B2237/366 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/72 ,  C04B2237/74 ,  C22C21/08 ,  H01L21/4857 ,  H01L21/4871 ,  H01L23/3735 ,  H01L23/473 ,  H01L2224/32225

摘要： A method for manufacturing a power module substrate includes a first lamination step of laminating a ceramic substrate and a copper sheet through an active metal material and a filler metal having a melting point of 660° C. or lower on one surface side of the ceramic substrate; a second lamination step of laminating the ceramic substrate and an aluminum sheet through a bonding material on the other surface side of the ceramic substrate; and a heating treatment step of heating the ceramic substrate, the copper sheet, and the aluminum sheet laminated together, and the ceramic substrate and the copper sheet, and the ceramic sheet and the aluminum sheet are bonded at the same time.