Abstract:
A manufacturing method of a semiconductor device is provided with an inspecting of a semiconductor substrate by an inspection method, the method including heating the semiconductor substrate, measuring first and second characteristics. The measuring of a first characteristic is performed by bringing a plurality of probes into contact with the heated semiconductor substrate and making a first electric current flow in the semiconductor substrate. The measuring of a second characteristic is performed, after the measuring of the first characteristic, by bringing a plurality of probes into contact with the heated semiconductor substrate and making a second electric current flow in the semiconductor substrate. A number of the plurality of probes used in the measuring of the second characteristic is larger than a number of the plurality of probes used in the measuring of the first characteristic. The second electric current is larger than the first electric current.
Abstract:
A test handler comprises an orientation changing device having a device holder for holding electronic devices, the device holder having a vertical rotary axis. A conveying device is operative to convey electronic devices to the device holder, and a rotary motor connected to the device holder is operative to rotate the device holder about the vertical rotary axis to change an orientation of the electronic device held on it. A rotary turret of the test handler has a plurality of pick heads arranged on the rotary turret, and each pick head is configured to pick up electronic devices from the device holder.
Abstract:
A method and apparatus for extracting the contents of voids and/or pores present in a semiconductor device to obtain information indicative of the nature of the voids and/or pores, e.g. to assist with metrology measurements. The method includes heating the semiconductor wafer to expel the contents of the voids and/or pores, collecting the expelled material in a collector, and measuring a consequential change in mass of the semiconductor wafer and/or the collector, to extract information indicative of the nature of the voids. This information may include information relating to the distribution of the voids and/or pores, and/or the sizes of the voids and/or pores, and/or the chemical contents of the voids and/or pores. The collector may include a condenser having a temperature-controlled surface (e.g. in thermal communication with a refrigeration unit) for condensing the expelled material.
Abstract:
An apparatus for determining and/or monitoring at least one process variable of a medium. The apparatus includes at least one probe unit and at least one electronics unit, which supplies the probe unit with an electrical, exciter signal and which receives from the probe unit an electrical, measurement signal. The invention includes, that the probe unit has at least one inner electrode and at least one outer electrode surrounding the inner electrode.
Abstract:
A circuit integrity detection system for use in detecting the integrity of a sensing wire in a heating pad wherein the integrity of the sensing wire is checking the inputs from a first and second A/D converter connected to opposite ends of the sensing wire.
Abstract:
A humidity detection sensor includes a lower electrode provided on a board, an upper electrode provided so as to face the lower electrode, a humidity sensing film which is formed at least between the lower electrode and the upper electrode and whose dielectric constant changes in response to humidity, and a protective film provided so as to cover the upper electrode. Each of the upper electrode and the protective film has an opening through which the humidity sensing film is partially exposed to the outside. In the opening, the humidity sensing film is provided so as to reach at least a position higher than the position of the lower surface of the protective film.
Abstract:
A circuit integrity detection system for use in detecting the integrity of sensing wire in a heating pad wherein the integrity of the sensing wire is checking the inputs from a first and second A/D converter connected to opposite ends of the sensing wire.
Abstract:
A probe having a sliding rail is provided and includes a probe head, a probe tail, an elastic element made of an elastic material and connected between the probe head and the probe tail, and a sliding rail assembly. The sliding rail assembly includes a slide rail and a position limit protrusion. The slide rail has a fixed end and a free end. The fixed end is fixedly connected to the probe tail, and the free end extends to the probe head. The position limit protrusion is fixedly connected to the probe head, and has a sliding slot formed thereon through which the slide rail can pass. The sliding rail assembly is made of a conductive material, and a cross-section area of the slide rail is greater than a cross-section area of the elastic material of the elastic element.
Abstract:
Eddy current detection probes and related methods are disclosed. In some embodiments, the eddy current detection probes are hybrid probes, including a solid state sensor and a detection loop. In some embodiments, the eddy current detection probes include a drive coil and a detection loop, with the detection loop having a sensitive axis that is not parallel to principal axis of the drive coil. In some such embodiments, the sensitive axis of the detection loop is perpendicular to the principal axis of the drive coil.
Abstract:
A vehicle step apparatus including an extending and retracting device having a mounting bracket, a step bracket, and an arm assembly. A gear box has a cavity into which at least a portion of a motor shaft of a motor is inserted. A worm wheel is rotatably disposed in the cavity and has a worm wheel body meshing with the motor shaft. An output shaft is mounted to the worm wheel body. A sun gear is fitted over the output shaft. A planet carrier is rotatably disposed in the cavity and connected with the arm assembly. A planet gear is rotatably mounted to the planet carrier and meshes with the sun gear. An adjusting member is mounted in the gear box, and is movable in an axial direction of the motor shaft and abuts against a free end of the motor shaft.