公开(公告)号：US07189081B2

公开(公告)日：2007-03-13

申请号：US10341468

申请日：2003-01-14

Applicant: Yoshiyuki Tanaka ,  Hiroyuki Ashiya ,  Yayoi Maki

Inventor： Yoshiyuki Tanaka ,  Hiroyuki Ashiya ,  Yayoi Maki

IPC: H01R12/00

CPC classification number: B60R16/0238 ,  H01R9/2466 ,  H05K3/301 ,  H05K3/306 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/0979 ,  H05K2201/10424 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10856 ,  H05K2201/2036 ,  Y10S439/949

Abstract: The terminal mounting structure includes a board (21). The structure includes a terminal (26) mounted on the board. The terminal includes a first end (26a) removably connected to a connection component (16, 17, 18). The terminal includes a second end (26b) soldered to the board in a raised position. The terminal includes a bent portion (26d) at intermediate of the terminal and at respective angles relative to respective first and second ends. The structure includes a retaining member (30, 40) facing the board with a space therebetween, and retaining the bent portion.

Abstract translation: 端子安装结构包括板（21）。 该结构包括安装在板上的端子（26）。 端子包括可移除地连接到连接部件（16,17,18）的第一端部（26a）。 端子包括在升高位置焊接到板的第二端（26b）。 端子包括在端子的中间并相对于相应的第一和第二端成各个角度的弯曲部分（26d）。 该结构包括面对板的保持构件（30,40），并且保持弯曲部分。

公开(公告)号：US20060284287A1

公开(公告)日：2006-12-21

申请号：US11463127

申请日：2006-08-08

Applicant: Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

Inventor： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

IPC: H01L23/495

CPC classification number: H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

Abstract: In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted prong laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

Abstract translation: 在用于半导体部件的引线框架技术的两极SMT微型外壳中，半导体芯片安装在一个引线框架部分上并与另外的引线框部分接触。 另外的引线框架部分被从芯片封装的壳体中导出，作为焊接端子。 不需要修整或成形工艺，并且外壳紧凑并且能够进一步小型化。 作为引线框架的冲压部分的焊接端子从彼此相对的壳体侧壁横向进行，至少直到形成部件安装表面的壳体底板。 芯片安装表面和部件的安装表面彼此成直角。

公开(公告)号：US07137852B2

公开(公告)日：2006-11-21

申请号：US11146645

申请日：2005-06-06

Applicant: Hironori Tsukamoto

Inventor： Hironori Tsukamoto

IPC: H01R33/00

CPC classification number: H05K3/326 ,  H01R4/16 ,  H01R33/05 ,  H05K3/202 ,  H05K2201/0397 ,  H05K2201/10106 ,  H05K2201/10651

Abstract: The invention provides a fixing structure for an electron device that enables an electron device to be attached and removed from wiring with one touch. The structure is provided with bus bars formed from conductive plate material that are connected to a power source, and an LED which has lead electrodes fixed to the bus bars and which is supplied with electricity therefrom. Fixing portions of the bus bars are provided with position determining tabs for positioning the lead electrodes, and an elastic contacting tab that elastically holds each lead electrode. The position determining tabs and the elastic contacting tabs are formed by bending portions of the bus bars. Accordingly, there is no need to provide components separate from the bus bars. When attachment and removal is performed, the LED is pushed downward toward or lifted up from the fixing portions of the bus bars.

Abstract translation: 本发明提供了一种电子器件的固定结构，其能够使电子器件能够通过一触即可将布线附着和移除。 该结构设置有由连接到电源的导电板材料形成的汇流条，以及具有固定到汇流条上并由其供应电力的引线电极的LED。 母线的固定部分设置有用于定位引线电极的位置确定片，以及弹性地保持每个引线电极的弹性接触片。 位置确定片和弹性接触突片通过弯曲母线的部分而形成。 因此，不需要提供与母线分开的部件。 当执行附接和移除时，LED从汇流条的固定部分向下推或向上推。

公开(公告)号：US20060214259A1

公开(公告)日：2006-09-28

申请号：US11091665

申请日：2005-03-28

Applicant: Vernon Spaunhorst

Inventor： Vernon Spaunhorst

IPC: H01L29/00

CPC classification number: H01H85/0411 ,  H01H69/022 ,  H01H85/046 ,  H01H85/143 ,  H01H2069/025 ,  H01H2085/0412 ,  H01H2085/266 ,  H01L24/01 ,  H05K3/3426 ,  H05K2201/10181 ,  H05K2201/10583 ,  H05K2201/10651 ,  Y02P70/613

Abstract: A chip fuse includes a substrate, a fuse element extending on the substrate, and first and second wire leads coupled to the fuse element. Contact pads may extend over portions of the fuse element and establish electrical connection to the first and second leads. A conductive medium such as solder encircles the substrate to securely form a mechanical and electrical connection to the leads.

公开(公告)号：US07070418B1

公开(公告)日：2006-07-04

申请号：US11138982

申请日：2005-05-26

Applicant: Tiger Wang

Inventor： Tiger Wang

IPC: H01R12/00

CPC classification number: H01R4/182 ,  F21K9/00 ,  F21V19/0025 ,  F21Y2115/10 ,  H01R12/58 ,  H05K3/202 ,  H05K3/326 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/1084

Abstract: A light emitting diode (LED) assembly has a printed circuit board, multiple conductors and multiple light emitting diodes (LEDs). The printed circuit board has multiple mounting holes. The conductors are mounted on the PCB and serve respectively as positive electrode conductors and negative electrode conductors. Each conductor has a contact pin and at least one through hole with an inner edge. Each LED is mounted on the positive electrode conductor and the negative electrode conductor and has a die and two contact tabs. Each contact tab has a through hole having an inner edge and multiple hooks extending from the inner edge of the through hole in the contact tab and hooking the inner edge of the at least one through hole in the conductor. Consequently, neither solder nor welding is required to assemble the LED assembly.

Abstract translation: 发光二极管（LED）组件具有印刷电路板，多个导体和多个发光二极管（LED）。 印刷电路板有多个安装孔。 导体安装在PCB上，分别用作正极导体和负极导体。 每个导体具有接触销和至少一个具有内边缘的通孔。 每个LED安装在正极导体和负极导体上，并具有一个模具和两个接触片。 每个接触片具有一个通孔，该通孔具有一个内边缘和多个钩子，它们从接触片中的通孔的内边缘延伸出来并钩住导体中至少一个通孔的内边缘。 因此，组装LED组件不需要焊料或焊接。

公开(公告)号：US20060141825A1

公开(公告)日：2006-06-29

申请号：US11290558

申请日：2005-12-01

Applicant: Tooru Nakagawa ,  Kazuhiro Yamamoto

Inventor： Tooru Nakagawa ,  Kazuhiro Yamamoto

IPC: H01R12/00

CPC classification number: H01R12/58 ,  H01R13/112 ,  H05K3/301 ,  H05K2201/10333 ,  H05K2201/10651 ,  H05K2201/10962

Abstract: In a structure for attaching a circuit board terminal to a circuit board, stress is minimized in a soldered portion on a circuit section upon inserting and drawing an electrical element into and from the circuit board. The attaching structure including a holding member mounted on and secured to a circuit board, a bus bar that has a base portion supported on the holding member and a leg portion that passes one or more through-holes and to be soldered on a circuit section, and a circuit board terminal that has a base portion to be connected to the bus bar and a connection portion adapted to be coupled to a terminal of an electrical element. The bus bar is provided on the base portion with elastic tongue pieces that can contact elastically with a circuit board terminal. The circuit board terminal is connected through the bus bar to the circuit section.

公开(公告)号：US07009117B2

公开(公告)日：2006-03-07

申请号：US10618593

申请日：2003-07-15

Applicant: Satoshi Torii

Inventor： Satoshi Torii

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K3/306 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10651 ,  H05K2201/2036 ,  H05K2203/1178

Abstract: A printed circuit board, which is guaranteed to be free of defective soldering in mounting and connecting electric or electronic parts or devices to the printed circuit, has a circuit pattern printed on its substrate, and an anti-soldering layer is laid on the circuit pattern to prevent soldering material from sticking to the circuit pattern and silk-screen printing areas are laid on the anti-soldering layer to indicate where selected electric or electronic parts or devices are to be mounted. Each silk-screen printing area has terminal holes made therein. The board has a substrate-exposed zone traversing the silk-screen printing area to leave its opposite extensions open to the surrounding atmosphere, thereby allowing heated air and gases to escape from the interspace between the bottom of the electric or electronic part or device and the exposed substrate.

Abstract translation: 保证在电气或电子部件或设备安装和连接到印刷电路上无缺陷焊接的印刷电路板具有印刷在其基板上的电路图案，并且将抗焊层铺设在电路图案上 为了防止焊接材料粘附到电路图案上，并且丝网印刷区域铺设在防焊层上，以指示所选择的电气或电子部件或装置将要安装在哪里。 每个丝网印刷区域都具有端子孔。 该板具有穿过丝网印刷区域的基板暴露区域，以使其相对的延伸部向周围的大气开放，从而允许加热的空气和气体从电气或电子部件或装置的底部与 曝光底物。

公开(公告)号：US20050121224A1

公开(公告)日：2005-06-09

申请号：US10959214

申请日：2004-10-07

Applicant: Jeffrey Lien

Inventor： Jeffrey Lien

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/183 ,  H05K1/182 ,  H05K2201/09036 ,  H05K2201/09845 ,  H05K2201/10515 ,  H05K2201/10651 ,  H05K2201/10689

Abstract: The present invention relates to the structural design of a circuit board having deposit holes. The design is to allocate one or more deposit holes that are either caved in or penetrate through the board at locations specified by the spatial layout, as well as to set step-like holes on a multilayer circuit board. On the panel surrounding the edge of the deposit holes, circuit contacts are provided for connecting electronic components (for example IC transistors, connectors, resistors, capacitors, or other circuit boards), such that when placed in deposit holes, they can be welded or fixed via the circuit contacts.

Abstract translation: 本发明涉及具有沉积孔的电路板的结构设计。 该设计是分配一个或多个沉积孔，这些沉积孔在由空间布局指定的位置处被插入或穿过板，以及在多层电路板上设置阶梯状孔。 在围绕沉积孔边缘的面板上，提供电路触点用于连接电子部件（例如，IC晶体管，连接器，电阻器，电容器或其他电路板），使得当放置在沉积孔中时，它们可以被焊接或 通过电路触点固定。

公开(公告)号：US20050041367A1

公开(公告)日：2005-02-24

申请号：US10914129

申请日：2004-08-10

Applicant: Akitoshi Yoshii ,  Masanori Yamamoto

Inventor： Akitoshi Yoshii ,  Masanori Yamamoto

IPC: H01G4/228 ,  H01G2/06 ,  H01G4/005 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K3/34

CPC classification number: H01G2/065 ,  H01G4/228 ,  H01G4/232 ,  H05K3/3426 ,  H05K2201/10651 ,  Y02P70/613

Abstract: An electronic component includes: an element having a pair of terminal electrodes; and a pair of metal terminals formed of metal materials respectively and connected to the pair of terminal electrodes respectively, in which: a portion of the metal terminal that extends from a base-end side of the metal terminal connectable to an external circuit to face the terminal electrode of the element is an electrode facing portion; and a tip side portion of the metal terminal in the electrode facing portion is connected to the terminal electrode, and a gap exists between a base-end side portion of the metal terminal in the electrode facing portion and the terminal electrode. Therefore, the electronic component is capable of fully absorbing a stress and realizes reduction in production cost.

公开(公告)号：US06716673B2

公开(公告)日：2004-04-06

申请号：US10147672

申请日：2002-05-15

Applicant: Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

Inventor： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

IPC: H01L2348

CPC classification number: H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

Abstract: In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

Abstract translation: 在用于半导体部件的引线框架技术的两极SMT微型外壳中，半导体芯片安装在一个引线框架部分上并与另外的引线框部分接触。 另外的引线框架部分被从芯片封装的壳体中导出，作为焊接端子。 不需要修整或成形工艺，并且外壳紧凑并且能够进一步小型化。 作为引线框架的冲压部分的焊接端子从彼此相对的壳体侧壁横向突出，至少直到形成部件安装表面的壳体底板。 芯片安装表面和部件的安装表面彼此成直角。