Abstract:
A wetting device for the mat (10) of a carrier material comprises a grasping frame which is constituted by side ledges (101, 102, 104), whereby the mat to be coated (10) can be fixed by clamps (105) to the side ledges. At least one of the side ledges of the frame is configured flexible (bendable), since it preferably comprises several segments (101, 102) which are hinged together. Thus, the clamped mat (10) can be brought into a cylindrical configuration in which it can be coated by a spray device which is introduced into the inner space of the cylinder. Due to the subsequent bending of the flexible side ledge in the opposite direction, the mat (10) can be brought into a second cylindrical configuration for which its other upper surface constitutes the inner side of the cylinder and is thus available for being coated by the spray device. During the spraying operation, the cylinder axis is preferably orientated vertically in order to avoid non-homogeneities of the coating because of the gravitation.
Abstract:
A plasma processing apparatus includes a plurality of plasma processing units. Each of the plasma processing units has a plasma excitation electrode, a radiofrequency generator connected to the plasma excitation electrode, and a matching circuit which matches the impedance between the radiofrequency generator and the plasma processing unit. The absolute value nullnullRAnull of the difference nullRA between the AC resistance RA0 at a time t0 and the AC resistance RA1 at a later time t1 and the absolute value nullnullRBnull of the difference nullRB between the AC resistance RB0 at the time t0 and the AC resistance RB1 at the later time t1 are maintained at a value less than an upper limit. Based on these values, whether or not the plasma processing apparatus which is reassembled or used at a user site maintains a required level of performance is evaluated.
Abstract:
An apparatus for passing multiple fibers having curable coating thereon through a high intensity curing zone comprises an irradiator having a curing zone; a transparent tube enclosing the curing zone; a plurality of coating dies disposed upstream of the irradiator to coat the fibers; and a plurality of take-up mechanisms disposed downstream of the irradiator to guide the fibers through the curing zone. The coating dies and the take-up mechanisms are rotatably displaced relative to each other about a longitudinal axis through the centerline of the curing zone so that the fibers at an intermediate location between the coating dies and the take-up mechanisms define a cylindrical volume having a diameter less than the diameter of the tube so that the multiple fibers can pass simultaneously through the tube.
Abstract:
A plating apparatus comprises a plating unit having a plating bath for holding a plating liquid therein, and a plating liquid monitoring unit having a liquid chromatography device and an arithmetical unit. The liquid chromatography device serves to separate and quantify an additive in a sample of the plating liquid. The arithmetical unit serves to compare a quantified value of the additive with a given concentration predetermined for the additive and to produce an output signal representing the compared result. The plating apparatus further comprises an additive replenishing unit for adding a solution including the additive from an additive tank to the plating liquid in the plating bath based on the output signal from the arithmetical unit in the plating liquid monitoring unit.
Abstract:
An external electrode forming apparatus is used to form external electrodes on the component chips. The external electrode forming apparatus comprises a component conveyer belt, a belt feeding mechanism, a component-inserting machine, a component-reversing machine, a paste-coating machine, and a component-discharging machine. For the component-inserting machine, the component-reversing machine, and the component-discharging machine, pressure pins are used to insert or move the component chips. These pressure pins have at the tip part a taper portion with a tip shape smaller than that of the component holding hole. Since the pressure pins of this type are used, the tip portions of these pressure pins may be prevented from impinging upon the opening edges of the component holding holes, and the pressure pins after the impingement may be hindered from forcibly being inserted into the component holding holes, whereby damage to the interiors of the component holding holes can be extremely diminished.
Abstract:
The interior of a port mechanism for exchanging a wafer between a coating/developing system and an exposure apparatus is evacuated, and a predetermined atmospheric gas is introduced. In loading/unloading a wafer into/from the exposure apparatus, the wafer is heated/cooled as needed.
Abstract:
In a conveyor system with a radiant heating system, convection is provided with hollow elongated tubes having small holes for providing a gentle air flow toward a workpiece to heat the workpiece with convection and radiation.
Abstract:
A method and apparatus for controlling a temperature of a microelectronic substrate. In one embodiment, the apparatus can include a substrate support configured to engage and support the microelectronic substrate. The apparatus can further include a temperature controller having one or more thermal links coupled directly with the substrate when the substrate is supported by the substrate support. The thermal links can maintain thermal contact with the substrate when the substrate is either stationary or mobile relative to the temperature controller. The temperature controller can heat or cool different portions of the substrate at different rates with one or more of several heat transfer devices, including liquid jets, gas jets, resistive electrical elements and/or thermoelectric elements.
Abstract:
A system for making a thin-film device includes a substrate-supply station that supplies a substrate having a major surface area. The substrate has a first layer on a first surface area of the substrate's major surface area. Also included is a device for depositing a second layer onto the first layer, wherein the device supplies energy to the second layer to aid in layer formation without substantially heating the substrate.
Abstract:
The present invention provides an applicator for applying and distributing a substance onto a target surface. The applicator comprises a substantially planar sheet of compressible, conformable material having opposed first and second surfaces and an interior region between said first and second surfaces. The sheet of material has a thickness between the first and second surfaces which decreases when the sheet of material is subjected to an externally-applied force in a direction substantially normal to the first surface. The applicator further includes at least one discrete reservoir extending inwardly of the first surface into the interior of the sheet of material which is at least partially filled with a substance and at least one discrete aperture formed in the first surface which is in fluid communication with the reservoir. Compression of the sheet of material via an externally-applied force substantially normal to said first surface expresses product from the aperture and translational motion of the first surface relative to a target surface applies and distributes said product onto the target surface. In a preferred embodiment, a plurality of apertures are associated with corresponding reservoirs forming a delivery zone near one end of a hand-held applicator, and the sheet material is preferably resilient both in compression and in bending to conform to irregular target surfaces. A wide variety of substances are contemplated, including particularly antiperspirant/deodorant products. Other embodiments include a single reservoir feeding a plurality of apertures.