Abstract:
A DC--DC boost converter for directly driving a capacitive load employs four switches for cyclically commuting the connection configuration of an energy storing inductor. First and second switches are driven at a relatively high frequency and provide an impulsive charge path of the inductor by connecting one or the other end to a power supply rail. Third and fourth switches are driven in phase opposition to each other at a relatively low frequency and provide a discharge path from one and the other end of the inductor, respectively, toward an output node of the circuit to which the capacitive load is connected.
Abstract:
A circuit generates flexible timing permitting a slow or fast overall timing configuration, and two configurations of the precharge and detecting intervals by providing both with two (short or long) duration levels. For this purpose, the circuit includes a variable, asymmetrical propagation line composed of a succession of elementary delay elements enabled or disabled on the basis of memorized logic signals, the state of which is determined when debugging the memory in which the circuit is implemented.
Abstract:
A process for producing integrated circuits including the steps of: selectively growing field insulating regions of insulating material extending partly inside a substrate having a given type of conductivity; depositing a polycrystalline silicon layer on the substrate; shaping the polycrystalline silicon layer through a mask; and selectively implanting ions of the same conductivity type as the substrate, using the shaping mask, through the field insulating regions. The implanted ions penetrate the substrate and form channel stopper regions beneath the field insulating regions.
Abstract:
A voltage regulator for electrically programmable non-volatile semiconductor memory devices of the type comprising a gain stage (3), supplied by a programming voltage (Vpp) and having an input terminal connected to a divider (6) of said programming voltage (Vpp) and an output terminal (U) connected to a programming line (5) of at least one memory cell (2) comprises at least one circuit element (4) capable of adapting the line programming voltage (5) to the length (L) of the memory cell (2). This provides a drain voltage, on the bit line of the memory device, which varies according to the actual length of the memory cell.
Abstract:
An architecture for an electronic controller operated using fuzzy logic, including an input section with a plurality of inputs for analog or digital signals, a central control unit provided with memories wherein fuzzy logic membership functions are stored, and a defuzzyfier section has its input section composed of a plurality of fuzzyfiers arranged in parallel and independent of one another, each fuzzyfier including an analog input and a digital input for receiving signals from external sensors, and digital outputs connected to the input of a corresponding read-only memory of the central unit to select the address of a memory word.
Abstract:
The invention relates to a method for forming a plastic package for an integrated electronic semiconductor device to be encapsulated within a plastic body, being of the type which comprises the step of molding said plastic body so as to fully enclose a semiconductor element, on which an integrated electronic circuit has been formed and which is placed onto a metal leadframe connected electrically to said integrated electronic circuit and carrying a plurality of terminal leads for external electric connection. To compensate the outward bends uncontrollably undergone by the plastic body due to thermal stresses during the molding step, a mold is used which has a cavity delimited by perimeter walls which define a concave-shaped volume. Preferably, at least one of the large walls, a bottom wall and a top wall, has a curvature inwardly of said mold cavity. The curvature values are predetermined to compensate any outward curvature undergone by corresponding surfaces of said plastic body during the molding step. The plastic package thus obtained exhibits, at the end of the molding step, a body having a diversified thickness which is at a maximum near the edges and at a minimum in the central portion; the difference between these thicknesses is proportional to the amount of the relative deformation undergone by the central regions of the body surfaces with respect to the regions near the edges. The plastic body is within ideal overall dimensions.
Abstract:
An auxiliary power supply line for powering the functional circuits of a portable apparatus during recharging of its internal battery by a constant current battery charger is derived from a node upstream of a sensing resistance of the current delivered to the battery under charge and is provided with isolation means.
Abstract:
An initialization circuit for memory registers, having a signal input being applied a supply voltage which rises linearly from a null value, and an initializing output connected to an input of a memory register and on which a voltage signal, being equal or proportional to the supply voltage, during the initialization step, and a null voltage signal, upon the supply voltage dropping below a predetermined tripping value, are produced. Additionally, the circuit has, between the input and the output, a first circuit portion connected to the input; a second circuit portion connected after the first and having a first output connected to the initializing output; and a third, inverting circuit portion having an input connected to a second output of the second portion and an output connected to the first portion to hold off that first portion while the supply voltage drops below the threshold voltage.
Abstract:
The functioning of a simple voltage regulator loop of an integrated power stage employing a plurality of bond-wires is ensured by realizing a conductive path connecting said pads to each other having a resistance lower by at least two orders of magnitude than the resistance of a voltage sensing divider of the regulation loop. Eventual ruptures of any of the bond-wires remain detectable through a final testing of the integrated circuit.
Abstract:
A method for improved adhesion between dielectric material layers at their interface during the manufacture of a semiconductor device, comprising operations for forming a first layer (1) of a dielectric material, specifically silicon oxynitride or silicon nitride, on a circuit structure (7) defined on a substrate of a semiconductor material (6) and subsequently forming a second layer (3) of dielectric material (silicon oxynitride or silicon nitride particularly) overlying the first layer (1). Between the first dielectric material layer and the second, a thin oxide layer (2), silicon dioxide in the preferred embodiment, is formed in contact therewith. This interposed oxide (2) serves an adhesion layer function between two superimposed layers (1,3).