Abstract:
A semiconductor device comprises a substrate with a first side and a second side, wherein a plurality of active circuits are formed adjacent to the first side of the substrate and a plurality of through silicon vias arranged in a polygon shape and extending from the first side of to the second side, wherein the polygon shape has more than six sides, and wherein each through silicon via is placed at a corresponding apex of the polygon shape.
Abstract:
A bridge structure for use in a semiconductor device includes a semiconductor substrate and a semiconductor structure layer. The semiconductor structure layer is formed on a surface of the semiconductor substrate and a lattice difference is formed between the semiconductor structure layer and the semiconductor substrate. The semiconductor structure layer includes at least a first block, at least a second block and at least a third block, wherein the first block and the third block are bonded on the surface of the semiconductor substrate, the second block is floated over the semiconductor substrate and connected with the first block and the third block.
Abstract:
A thin film solar cell structure and the fabricating method thereof are disclosed. A passivation layer is embedded into the thin film solar cell structure to be in contact with an absorbing layer. The interface trap density of the absorbing layer is reduced by the surface electric field of the passivation layer. The invention helps improve the power conversion efficiency and protect the absorbing layer.
Abstract:
A photovoltaic cell includes a first type doped mono-crystalline silicon substrate, an intrinsic amorphous silicon layer, a second type doped amorphous silicon layer, a first type doped crystalline Ge-containing layer, and a pair of electrodes. The first type doped mono-crystalline silicon substrate has a front surface and a rear surface. The intrinsic amorphous silicon layer is disposed on the front surface. The second type doped amorphous silicon layer is disposed on the intrinsic amorphous silicon layer. The first type doped crystalline Ge-containing layer is disposed on the rear surface. The pair of electrodes are electrically connected to the second type doped amorphous silicon layer and first type doped crystalline Ge-containing layer, respectively.
Abstract:
The present disclosure passivates solar cell defects. Plasma immersion ion implantation (PIII) is used to repair the defects during or after making the solar cell. Hydrogen ion is implanted into absorption layer with different sums of energy to fill gaps of defects or surface recombination centers. Thus, solar cell defects are diminished and carriers are transferred with improved photovoltaic conversion efficiency.
Abstract:
A non-volatile memory is provided. The non-volatile memory comprises at least a silicon-on-insulator transistor including a substrate; an insulating layer disposed on the substrate; an active region disposed on the insulating layer; and an energy barrier device disposed in the active region and outputting a relatively small current when the non-volatile memory is read.
Abstract:
A structure and a method of the solar cell efficiency improvement by the strain technology are provided. The solar cell has a first surface and a second surfaces which at least a gasket is disposed thereon for supporting the solar cell and being the axle whiling stressing. The method includes the steps of: (a) applying at least a stress on the first surface; (b) generating a supporting force on the second surface; and (c) generating at least a strain in the solar cell. In addition, the present invention also includes a method involving a step of: (a) applying a mechanical stress to the solar cell; (b) generating a tension in the solar cell by at least two materials having different lattice constants; or (c) generating another tension in the solar cell by a shallow trench isolation filler, a high tensile/compressive stress silicon nitride layer and a combination thereof.
Abstract:
A method for producing a flexible electronic device is provided. The method comprises steps of providing a flexible substrate, forming an inorganic film on the flexible substrate and etching the inorganic film to obtain an electronic element of the electronic device. In another aspect, a flexible electronic device is provided. The flexible electronic device comprises a flexible substrate and an inorganic film disposed on the flexible substrate and having an electronic element, wherein the electronic element is formed by etching the inorganic film.
Abstract:
A method for changing a characteristic of a thin film transistor (TFT) is provided. The method comprises the steps of (1) providing a substrate; (2) forming the TFT having a channel on the substrate; (3) providing a pressure source; and (4) causing the pressure source to form a strain on the channel. The method for changing the characteristic of the TFT can further raise the operational speed thereof.
Abstract:
A method for manufacturing a light-emitting element with a heterojunction of group IV is provided. The method comprises at least the steps of: (1) providing a silicon substrate having a first and a second surfaces; (2) forming a germanium layer on the first surface; (3) forming a cap layer on the germanium layer; (4) forming a oxidation layer on the cap layer; (5) forming a first conductive layer on the oxidation layer; (6) forming a second conductive layer on the second surface; and (7) respectively forming a conductive wire on the first and second conductive layers. The light-emitting element of MOS semiconductor manufactured by the abovementioned steps is characterized in the emission of long wavelength.