摘要:
A polymerized toner is provided. The polymerized toner comprises a reactive anionic surfactant having at least one reactive functional group. The reactive anionic surfactant is added simultaneously with a dispersant to prepare an aqueous dispersion or is added within 2 hour after a polymerization reaction of a monomer mixture is initiated in an aqueous dispersion. This simultaneous or rapid addition allows the reactive anionic surfactant to be dispersed on the surface of the toner particles. The reactive anionic surfactant is located over the entire surface of the toner particles to increase the surface charge density of the toner, achieving good charge stability and excellent imaging characteristics.
摘要:
A method of stacking a flexible substrate is provided. The method includes the steps of: preparing a carrier substrate; stacking an adhesive layer on the carrier substrate; and stacking a flexible substrate having at least one image display device on the adhesive layer using a laminating or pressing method. Thus, the flexible substrate is easily fabricated without modification of conventional mass-production equipment for fabricating a display, and thereby a lightweight, thin, and compact flexible display can be realized.
摘要:
A cup holder apparatus for a vehicle may include an accommodating tray provided inside a vehicle compartment and having an accommodation space for accommodating a cup therein, a cup support member rotatably provided around a rotating shaft (Z axis) against the accommodating tray and including a bottom portion for safe-placing the cup in the accommodation space and a support portion formed in a stand from the bottom portion to support an outer periphery of the cup, and a release prevention member prepared separately from the cup support member and connected to the bottom portion of the cup support member, while being rotatably coupled to the accommodating tray, to prevent release of the cup support member from the accommodating tray, wherein the release of the release prevention member from the accommodating tray is hindered by an upper stopper formed on the accommodating tray while the cup support member is rotatably coupled to the upper stopper and is rotated around the rotating shaft.
摘要:
A method of stacking a flexible substrate is provided. The method includes the steps of: preparing a carrier substrate; stacking an adhesive layer on the carrier substrate; and stacking a flexible substrate having at least one image display device on the adhesive layer using a laminating or pressing method. Thus, the flexible substrate is easily fabricated without modification of conventional mass-production equipment for fabricating a display, and thereby a lightweight, thin, and compact flexible display can be realized.
摘要:
A manufacturing method of a package on package with a cavity. The method can include forming a first upper substrate cavity in one side of an upper substrate; mounting an upper semiconductor chip on the other side of the upper substrate; forming a lower substrate cavity in one side of a lower substrate; mounting a lower semiconductor chip in the lower substrate cavity formed in the lower substrate; and stacking the upper substrate above the lower substrate such that the first upper substrate cavity accommodates a part of the lower semiconductor chip. The package on package and a manufacturing method thereof can reduce the overall thickness of the package by forming cavities in both upper and lower substrates to accommodate a semiconductor chip mounted in the lower substrate.
摘要:
The present invention relates to an oil-free turbocharger assembly using an airfoil bearing that may be useful in high speed conditions. The assembly can be cooled easily. A heat-proof coating can also be easily applied to the turbo charger's rotating shaft. In one embodiment, an oil-free turbocharger assembly has a constant distance between a journal portion and a rotating shaft so that the mass of the rotating body can be minimized and the rotating body assembly can have a small moment of inertia. The turbocharger in some embodiments of the invention may be cooled by a refrigerant which improves cooling efficiency. Each part of the rotating body assembly in some embodiments may be individually treated with a heat-proof process so that productivity can be improved.
摘要:
A core substrate using paste bumps, the core substrate including a first paste bump board having a plurality of first paste bumps joined to a surface thereof; a second paste bump board having a plurality of second paste bumps facing the first paste bumps joined thereto; and an insulation element placed between the first paste bump board and the second paste bump board. In the core substrate, the first paste bumps and the second paste bumps are electrically interconnected.
摘要:
A core substrate using paste bumps, the core substrate including a first paste bump board having a plurality of first paste bumps joined to a surface thereof; a second paste bump board having a plurality of second paste bumps facing the first paste bumps joined thereto; and an insulation element placed between the first paste bump board and the second paste bump board. In the core substrate, the first paste bumps and the second paste bumps are electrically interconnected.
摘要:
A core substrate and multilayer printed circuit board using paste bumps and manufacturing method thereof are disclosed. With the method of manufacturing a core substrate using paste bumps comprising: (a) aligning a pair of paste bump boards, each of which has a plurality of paste bumps joined to its surface, such that the paste bumps face each other, and (b) pressing the pair of paste bump boards together, where an insulation element is placed between the pair of paste bump boards, it is easier to implement interlayer electrical interconnection between circuit patterns, the thickness of the core substrate can readily be adjusted by adjusting the thickness of the insulation layer, the stiffness is improved as a pair of paste bump boards are pressed from the top and bottom, and high-density wiring can be formed more easily as the paste bumps are connected in pairs so that the diameters of the paste bumps formed on the paste bump boards can be reduced.
摘要:
The method of manufacturing a printed circuit board using paste bumps includes perforating a core board to form at least one via hole, filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, stacking a paste bump board on at least one surface of the core board, and forming an outer layer circuit on a surface of the paste bump board. The method provides a structurally stable all-layer IVH structure due to increased strength in the BVH's of the plated core boards and the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained.