公开(公告)号：US20230054450A1

公开(公告)日：2023-02-23

申请号：US17820876

申请日：2022-08-18

Applicant: InvenSense, Inc.

Inventor： Ardalan HESHMATI ,  Hideaki FUKUZAWA

IPC: G02B27/01 ,  G02B26/10

Abstract: A retinal projection display system includes a light source for projecting an image, a scanning mirror having a field of view larger than the image, and a reflective surface on which the image is projected, wherein the reflective surface is larger than the image. The scanning mirror projects the image onto a viewable region of the reflective surface such that the image is projected into a retina of a user.

公开(公告)号：US20230037849A1

公开(公告)日：2023-02-09

申请号：US17877089

申请日：2022-07-29

Applicant: InvenSense, Inc.

Inventor： Daesung Lee ,  Alan Cuthbertson

IPC: B81C1/00

Abstract: A method includes forming a bumpstop from a first intermetal dielectric (IMD) layer and forming a via within the first IMD, wherein the first IMD is disposed over a first polysilicon layer, and wherein the first polysilicon layer is disposed over another IMD layer that is disposed over a substrate. The method further includes depositing a second polysilicon layer over the bumpstop and further over the via to connect to the first polysilicon layer. A standoff is formed over a first portion of the second polysilicon layer, and wherein a second portion of the second polysilicon layer is exposed. The method includes depositing a bond layer over the standoff.

公开(公告)号：US20230030211A1

公开(公告)日：2023-02-02

申请号：US17964520

申请日：2022-10-12

Applicant: InvenSense, Inc.

Inventor： Calin Miclaus ,  Chung-Hsien Lin ,  Jye Ren ,  Tim Piessens ,  Pei-Wen Yen ,  Manish Sharma-Kulamarva

IPC: G01L19/06 ,  G01L19/00 ,  G01L9/00 ,  G01N27/22 ,  G01N25/56 ,  G01N27/04

Abstract: A device includes a housing unit with an internal volume. The device further includes a sensor coupled to a substrate via an electrical coupling, wherein the sensor is disposed within the internal volume of the housing unit, and wherein the sensor is in communication with an external environment of the housing unit from a side other than a side associated with the substrate. The device also includes a moisture detection unit electrically coupled to the sensor, wherein the moisture detection unit comprises at least two looped wires forming electrodes, and wherein the moisture detection unit is configured to detect presence of a moisture within an interior environment of the housing unit by measuring a capacitance between the electrodes and by detecting a change between the measured capacitance and a capacitance between the electrodes in absence of moisture.

公开(公告)号：US11563166B2

公开(公告)日：2023-01-24

申请号：US16812752

申请日：2020-03-09

Applicant: INVENSENSE, INC.

Inventor： Chienliu Chang

IPC: H01L41/257 ,  B06B1/02 ,  B06B1/06 ,  H01L41/04 ,  H01L41/047 ,  H01L41/193 ,  H01L41/29 ,  H01L41/332 ,  H01L41/08 ,  G06V40/13

Abstract: An array of piezoelectric micromachined ultrasound transducers (PMUTs) has a layer of piezoelectric material that requires poling during fabrication in order to properly align the piezoelectric dipoles to create a desired ultrasonic signal. The PMUT may have an interconnected set of lower electrodes that are fabricated between a processing layer of the PMUT and the piezoelectric layer. An upper electrode is fabricated overlaying the piezoelectric layer, and a poling voltage is applied between the upper electrode and the interconnected set of lower electrodes. After poling is complete, portions of the interconnected set of lower electrodes are removed to permanently isolate permanent lower electrodes from each other.

公开(公告)号：US11548780B2

公开(公告)日：2023-01-10

申请号：US17516245

申请日：2021-11-01

Applicant: INVENSENSE, INC.

Inventor： David deKoninck ,  Varun Subramaniam Kumar ,  Matthew Julian Thompson ,  Vadim Tsinker ,  Logeeswaran Veerayah Jayaraman ,  Sarah Nitzan ,  Houri Johari-Galle ,  Jongwoo Shin ,  Le Jin

IPC: G01L19/04 ,  G01K1/20 ,  B81B7/00 ,  G01L9/00

Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.

公开(公告)号：US11542154B2

公开(公告)日：2023-01-03

申请号：US17206079

申请日：2021-03-18

Applicant: InvenSense, Inc.

Inventor： Ashfaque Uddin ,  Daesung Lee ,  Alan Cuthbertson

IPC: B81C1/00 ,  B81B7/00

Abstract: A method includes fusion bonding a handle wafer to a first side of a device wafer. The method further includes depositing a first mask on a second side of the device wafer, wherein the second side is planar. A plurality of dimple features is formed on an exposed portion on the second side of the device wafer. The first mask is removed from the second side of the device wafer. A second mask is deposited on the second side of the device wafer that corresponds to a standoff. An exposed portion on the second side of the device wafer is etched to form the standoff. The second mask is removed. A rough polysilicon layer is deposited on the second side of the device wafer. A eutectic bond layer is deposited on the standoff. In some embodiments, a micro-electro-mechanical system (MEMS) device pattern is etched into the device wafer.

公开(公告)号：US11536571B2

公开(公告)日：2022-12-27

申请号：US17082490

申请日：2020-10-28

Applicant: INVENSENSE, INC.

Inventor： Gennadii Berkovich ,  Dmitry Churikov

IPC: G01C21/08 ,  G01C21/20 ,  G01R33/10 ,  G01C21/00 ,  G01C21/32

Abstract: Vehicle position is determined using magnetic field measurements within an indoor environment. Magnetic field measurements and sensor information are obtained from the vehicle and magnetic map information is obtained for the indoor environment. Parameters of vehicle motion are derived from the sensor information. The magnetic field measurements are processed to mitigate vehicular interference and then compensated for a magnetometer bias induced at least in part by the vehicle. Vehicle position is determined based at least in part on the compensated magnetic field magnetic measurements, the magnetic map information and the parameters of vehicle motion.

公开(公告)号：US20220397395A1

公开(公告)日：2022-12-15

申请号：US17344525

申请日：2021-06-10

Applicant: INVENSENSE, INC.

Inventor： Vito Avantaggiati

IPC: G01C19/5776 ,  G01P15/08

Abstract: Methods and systems for compensation of a microelectromechanical system (MEMS) sensor may include associating test temperature values with input test signal values, identifying temperature-input signal pairs, and applying one of the test temperature values and one of the test signal values to the MEMS sensor. Desired output signal values may be determined, with each of the desired output signal values corresponding to one of the applied temperature-input signal pairs. Measured output signal values from the MEMS sensor may be measured, with each of the measured output signal values corresponding to one of the applied temperature-input signal pairs. Compensation terms may be determined based on the plurality of temperature-input signal pairs, the corresponding plurality of measured output signal values, and the corresponding plurality of desired output signal values. Compensation terms may be used to modify a sense signal of the MEMS sensor.

公开(公告)号：US11517938B2

公开(公告)日：2022-12-06

申请号：US16107894

申请日：2018-08-21

Applicant: InvenSense, Inc.

Inventor： Mei-Lin Chan ,  Nikhil Apte ,  Renata Melamud Berger

IPC: B06B1/06 ,  G10K11/00 ,  G10K11/28 ,  G01H11/08 ,  H01L41/09 ,  B06B1/02 ,  H01L41/047

Abstract: An electronic device includes a substrate layer having a front surface and a back surface opposite the front surface, a plurality of ultrasonic transducers formed on the front surface of the substrate layer, wherein the plurality of ultrasonic transducers generate backward waves during operation, the backward waves propagating through the substrate layer, and a plurality of substrate structures formed within the back surface of the substrate layer, the plurality of substrate structures configured to modify the backward waves during the operation.

公开(公告)号：US20220381605A1

公开(公告)日：2022-12-01

申请号：US17818820

申请日：2022-08-10

Applicant: INVENSENSE, INC.

Inventor： Jeremy Parker ,  Kieran Harney

IPC: G01H3/00 ,  B81B3/00 ,  B81B7/00

Abstract: An alternate venting path can be employed in a sensor device for pressure equalization. A sensor component of the device can comprise a diaphragm component and/or backplate component disposed over an acoustic port of the device. The diaphragm component can be formed with no holes to prevent liquid or particles from entering a back cavity of the device, or gap between the diaphragm component and backplate component. A venting port can be formed in the device to create an alternate venting path to the back cavity for pressure equalization for the diaphragm component. A venting component, comprising a filter, membrane, and/or hydrophobic coating, can be associated with the venting port to inhibit liquid and particles from entering the back cavity via the venting port, without degrading performance of the device. The venting component can be designed to achieve a desired low frequency corner of the sensor frequency response.