Abstract:
An illumination unit 6 illuminates a scene object (i.e., mail) 2 moved in a predetermined direction by a transport means (transport conveyor) 1, the imaging distance up to the scene object 2 is detected before imaging, and auto-focusing is made according to distance data detected at the time of the imaging.
Abstract:
An ultraviolet-curing resin composition of (a) 5 to 35 parts by mass of a chlorinated polyolefin with a chlorine content of 15 to 40 mass %, (b) 15 to 60 parts by mass of an alicyclic hydrocarbon mono(meth)acrylate, and (c) 5 to 80 parts by mass of a polypropylene glycol di(meth)acrylate; and, per 100 parts by mass of the total amount of components (a), (b) and (c), (d) 0 to 1100 parts by mass of an aliphatic hydrocarbon di(meth)acrylate and (e) 0 to 600 parts by mass of a polyfunctional monomer having 3 to 6 (meth)acryloyl groups in its molecule; and, per 100 parts by mass of the total amount of components (b), (c), (d) and (e), (f) 1 to 15 parts by mass of a photoinitiator; and the composition as an active ingredient in paints, inks, adhesives, sealing agents and primers.
Abstract:
It is an object of the present invention to provide a method and apparatus for efficiently remove bubbles present on a surface of molten glass, which can solve a problem that bubbles remaining on a surface of molten glass are get inside at a time of forming the glass to cause inside bubbles, to thereby provide a glass substrate of good quality, and which can improve productivity of glass substrates; and to provide a process for producing glass employing the above method for removing bubbles.The present invention provides a method for removing bubbles from molten glass, which is a method for removing floating bubbles on a surface of molten glass, wherein a floating bubble on the surface of molten glass is irradiated with at least one laser beam.
Abstract:
A semiconductor device comprises: a semiconductor chip; a first frame; a solder layer which bonds the solder bonding metal layer of the semiconductor chip and the first frame; and a second frame bonded to the rear face of the semiconductor chip. The semiconductor chip includes: a semiconductor substrate; a first metal layer provided on a major surface of the semiconductor substrate and forming a Schottky junction with the semiconductor substrate; a second metal layer provided on the first metal layer and primarily composed of aluminum; a third metal layer provided on the second metal layer and primarily composed of molybdenum or titanium; and a solder bonding metal layer provided on the third metal layer and including at least a fourth metal layer which is primarily composed of nickel, ion or cobalt.
Abstract:
A semiconductor device has a semiconductor device chip with upper and lower terminal electrodes, and upper and lower frames bonded to the upper and lower terminal electrodes, respectively, with solder material, wherein the semiconductor device chip includes: a semiconductor layer of a first conductivity type; a diffusion layer of a second conductivity type, which is selectively formed in the semiconductor layer; a plurality of guard-ring layers of the second conductivity type, which are formed outside of the diffusion layer in the semiconductor layer; an insulating film formed on the semiconductor layer; and a field plate formed of a poly-crystalline silicon film embedded in the insulating film.
Abstract:
An information serving system includes a broadcasting station module (TV), user module (RV), and advertising agency module (AD). The broadcasting station module (TV) broadcasts pieces of broadcast information including at least video information. The user module (RV) receives the broadcast information, selects an image component composing an image from the received broadcast information, and produces specification information indicative of the selected image component. The user module (RV) transmits the produced specification information, while receiving component information to represent the received component information. The advertising company module (AD) acquires the specification information, and transmits to the user module (RV) the component information indicating an image component specified by the acquired specification information. This allows a viewer viewing a broadcasted program to acquire detailed information about a desired image component in an easier and quicker manner, thus enhancing usability of a broadcasting business.
Abstract:
The vacuum cleaner includes a vacuum cleaner body (20) having a dust collector (60) and an electric blower (33) for producing an intake negative pressure in the dust collector, a filter (100) for separating dust absorbed in the dust collector with air by the negative pressure, and a dust dumping member (304) for dumping the dust attached to the filter by vibrating the filter. Moreover, the vacuum cleaner includes a handle (200) mounted on the vacuum cleaner body for carrying the vacuum cleaner body, the handle being movable in a vertical direction between a storing position and a using position; a storage spring (323) for energizing the handle to the storing position; and a power transmission unit (300A) for driving the dust dumping member by linking with the vertical movement of the handle.
Abstract:
An ultraviolet-curing resin composition of (a) 5 to 35 parts by mass of a chlorinated polyolefin with a chlorine content of 15 to 40 mass %, (b) 15 to 60 parts by mass of an alicyclic hydrocarbon mono(meth)acrylate, and (c) 5 to 80 parts by mass of a polypropylene glycol di(meth)acrylate; and, per 100 parts by mass of the total amount of components (a), (b) and (c), (d) 0 to 1100 parts by mass of an aliphatic hydrocarbon di(meth)acrylate and (e) 0 to 600 parts by mass of a polyfunctional monomer having 3 to 6 (meth)acryloyl groups in its molecule; and, per 100 parts by mass of the total amount of components (b), (c), (d) and (e), (f) 1 to 15 parts by mass of a photoinitiator; and the composition as an active ingredient in paints, inks, adhesives, sealing agents and primers.
Abstract:
A height-restriction plate having a size in plan view larger than that of an IC chip is bonded to an upper face of the IC chip which is fixed to a FPC formed along a suspension. The IC chip is sealed at the periphery thereof with an adhesive which reaches the height-restriction plate and the FPC.
Abstract:
A color cathode ray tube includes a generally rectangular shadow mask structure in which a skirt portion of a shadow mask is secured to a support frame. The shadow mask is formed by an apertured portion having a large number of electron beam transmission apertures, an imperforate portion disposed around the entire periphery of the apertured portion, a skirt portion being bent back and drooping from the entire periphery of the imperforate portion, and a support frame including a rectangular frame portion. The skirt portion of the shadow mask is secured to the inside of the rectangular frame portion, and a bent portion of the shadow mask, which defines a transitional region between the imperforate portion, and the skirt portion is formed in a shape where long sides are recessed inwardly and ends of the long sides of the skirt portion come into contact with the frame portion.