公开(公告)号：US06240634B1

公开(公告)日：2001-06-05

申请号：US09460727

申请日：1999-12-14

申请人： Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

发明人： Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

IPC分类号： H05K330

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/743 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75743 ,  H01L2224/75745 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  Y10T29/4913 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/53178 ,  H01L2924/00

摘要： In a method of production of a multichip package module, rough-pitch bare chips are positioned at first locations on a printed-circuit board, and the rough-pitch bare chips are temporarily attached to the board at the first locations. The rough-pitch bare chips are mounted on the board at the same time by applying heat and pressure to the rough-pitch bare chips simultaneously. A respective one of fine-pitch bare chips is positioned at a respective one of second locations on the board other than the first locations, and the respective one of the fine-pitch bare chips is mounted on the board by applying heat and pressure to the fine-pitch bare chips individually, in order to produce the multichip package module.

摘要翻译： 在制造多芯片封装模块的方法中，将粗间距裸芯片定位在印刷电路板上的第一位置处，并且在第一位置将粗糙间距裸芯片暂时附接到板上。 通过同时向粗糙的裸芯片施加热量和压力，同时将粗糙的裸芯片安装在板上。 微细间距裸芯片中的相应一个位于除了第一位置之外的板上的第二位置中的相应一个处，并且通过向第一位置施加热和压力将精细间距裸芯片中的相应一个安装在板上 单芯片的裸芯片，以生产多芯片封装模块。

公开(公告)号：US6122823A

公开(公告)日：2000-09-26

申请号：US401985

申请日：1999-09-23

申请人： Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

发明人： Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

IPC分类号： H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L25/04 ,  H01L25/18 ,  H05K3/34

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/743 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75743 ,  H01L2224/75745 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  Y10T29/4913 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/53178

摘要： In a method of production of a multichip package module, rough-pitch bare chips are positioned at first locations on a printed-circuit board, and the rough-pitch bare chips are temporarily attached to the board at the first locations. The rough-pitch bare chips are mounted on the board at the same time by applying heat and pressure to the rough-pitch bare chips simultaneously. A respective one of fine-pitch bare chips is positioned at a respective one of second locations on the board other than the first locations, and the respective one of the fine-pitch bare chips is mounted on the board by applying heat and pressure to the fine-pitch bare chips individually, in order to produce the multichip package module.

摘要翻译： 在制造多芯片封装模块的方法中，将粗间距裸芯片定位在印刷电路板上的第一位置处，并且在第一位置将粗糙间距裸芯片临时附接到板上。 通过同时向粗糙的裸芯片施加热量和压力，同时将粗糙的裸芯片安装在板上。 微细间距裸芯片中的相应一个位于除了第一位置之外的板上的第二位置中的相应一个处，并且通过向第一位置施加热和压力将精细间距裸芯片中的相应一个安装在板上 单芯片的裸芯片，以生产多芯片封装模块。

公开(公告)号：US6006426A

公开(公告)日：1999-12-28

申请号：US26490

申请日：1998-02-19

申请人： Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

发明人： Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

IPC分类号： H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L25/04 ,  H01L25/18 ,  H05K3/30

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/743 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75743 ,  H01L2224/75745 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  Y10T29/4913 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/53178

摘要： In a method of production of a multichip package module, rough-pitch bare chips are positioned at first locations on a printed-circuit board, and the rough-pitch bare chips are temporarily attached to the board at the first locations. The rough-pitch bare chips are mounted on the board at the same time by applying heat and pressure to the rough-pitch bare chips simultaneously. A respective one of fine-pitch bare chips is positioned at a respective one of second locations on the board other than the first locations, and the respective one of the fine-pitch bare chips is mounted on the board by applying heat and pressure to the fine-pitch bare chips individually, in order to produce the multichip package module.

摘要翻译： 在制造多芯片封装模块的方法中，将粗间距裸芯片定位在印刷电路板上的第一位置处，并且在第一位置将粗糙间距裸芯片临时附接到板上。 通过同时向粗糙的裸芯片施加热量和压力，同时将粗糙的裸芯片安装在板上。 微细间距裸芯片中的相应一个位于除了第一位置之外的板上的第二位置中的相应一个处，并且通过向第一位置施加热和压力将精细间距裸芯片中的相应一个安装在板上 单芯片的裸芯片，以生产多芯片封装模块。

公开(公告)号：US20080265002A1

公开(公告)日：2008-10-30

申请号：US11979913

申请日：2007-11-09

申请人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura

发明人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura

IPC分类号： B23K20/10

CPC分类号： B23K20/10 ,  B23K2101/40 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip 52 to a substrate 50 using an ultrasonic mounting apparatus including a horn 15 that propagates ultrasonic vibration of an ultrasonic vibrator, the horn 15 being made of a ceramic that has a higher vibration propagation speed than metal. The method includes steps of disposing the substrate 50 on a stage 13, disposing the semiconductor chip 52 on the substrate 50, and placing the semiconductor chip 52 in contact with a convex part 15a provided on the horn 15 and applying ultrasonic vibration to bond the semiconductor chip 52 to the substrate 50.

摘要翻译： 一种超声波安装方法可以通过使用高频超声波提高安装效率，还可以安装大型半导体芯片。 该方法使用包括传播超声波振动器的超声波振动的喇叭15的超声波安装装置将半导体芯片52超声波接合到基板50，喇叭15由具有比金属更高的振动传播速度的陶瓷制成。 该方法包括以下步骤：将基板50设置在台13上，将半导体芯片52配置在基板50上，将半导体芯片52与设置在喇叭15上的凸部15a接触并施加超声波振动， 半导体芯片52到基板50。

公开(公告)号：US20080061435A1

公开(公告)日：2008-03-13

申请号：US11979165

申请日：2007-10-31

申请人： Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Takayoshi Matsumura

发明人： Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Takayoshi Matsumura

IPC分类号： H01L23/48

CPC分类号： H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L24/75 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/759 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/00015 ,  H01L2224/13099 ,  H01L2924/00

摘要： The structure of mounting an electronic component on a circuit board is capable of securely flip-chip-bonding the electronic component having bumps, whose separations are very short, to the circuit board without displacement. The structure of mounting an electronic component on a circuit board is characterized in that bumps of the electronic component are respectively flip-chip-bonded to electrodes of the circuit board by applying ultrasonic vibrations to the electronic component, and that a center of each of the bumps is previously relatively displaced, with respect to a center of each of the electrodes in a width direction, in a direction parallel to a direction of the ultrasonic vibrations.

摘要翻译： 将电子部件安装在电路板上的结构能够将具有非常短的分离的凸块的电子部件可靠地倒置接合到电路板而没有位移。 将电子部件安装在电路板上的结构的特征在于，通过对电子部件施加超声波振动，电子部件的凸起分别与电路基板的电极倒装接合， 先前相对于每个电极的宽度方向上的中心在与超声波振动的方向平行的方向上相对移位。

公开(公告)号：US07208059B2

公开(公告)日：2007-04-24

申请号：US11041375

申请日：2005-01-25

申请人： Takayoshi Matsumura ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma

发明人： Takayoshi Matsumura ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma

IPC分类号： B32B37/00

CPC分类号： B23K20/106 ,  B23K20/10 ,  B23K2101/42 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/75 ,  H01L2224/75355 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014

摘要： The ultrasonic mounting method is capable of uniformly bonding bumps of an electronic component to a circuit board and improving reliability of ultrasonic-mounting the electronic component. The method comprises the step of applying ultrasonic vibrations to the electronic component so as to flip-chip-bond the electronic component to the circuit board having electrodes. The ultrasonic vibrations are applied in a direction parallel to a surface of the electronic component, and loads are vertically applied to the surface of the electronic component in conjunction with vibration cycles of the ultrasonic vibrations.

摘要翻译： 超声波安装方法能够将电子部件的凸块均匀地接合到电路板，并且提高超声波安装电子部件的可靠性。 该方法包括对电子部件施加超声波振动以将电子部件倒装芯片连接到具有电极的电路板的步骤。 超声波振动沿平行于电子部件的表面的方向施加，并且负载与超声波振动的振动循环一起垂直地施加到电子部件的表面。

公开(公告)号：US07196512B2

公开(公告)日：2007-03-27

申请号：US10722823

申请日：2003-11-26

申请人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Hiroshi Kobayashi ,  Katsutoshi Hirasawa ,  Takatoyo Yamakami ,  Masumi Katayama ,  Shinji Hiraoka

发明人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Hiroshi Kobayashi ,  Katsutoshi Hirasawa ,  Takatoyo Yamakami ,  Masumi Katayama ,  Shinji Hiraoka

IPC分类号： G01R33/12

CPC分类号： G11B5/4555 ,  G11B5/455 ,  G11B5/4806 ,  G11B5/60 ,  G11B2005/001

摘要： The magnetic head tester of the present invention drives a medium for rotation to float a slider from the medium so as to test a magnetic head for its characteristics, and the tester includes a holder removably holding the slider opposed to the surface of the medium, and suspension means provided in the holder which has the same function as a suspension supporting the slider in a real apparatus. With this tester, tests can be executed by exchanging the slider alone, and it is unnecessary to discard the suspension even when the magnetic head is judged to be defective, thus the loss of production costs for the suspension and processing costs for assembling the slider in the suspension can be avoided.

摘要翻译： 本发明的磁头测试器驱动用于旋转的介质以从介质浮动滑动器，以便测试磁头的特性，并且测试仪包括可移除地保持与介质表面相对的滑块的保持架，以及 悬挂装置设置在保持器中，其具有与在实际装置中支撑滑块的悬架相同的功能。 使用该测试器，可以通过单独更换滑块来执行测试，即使当磁头被判断为有缺陷时也不必丢弃悬架，因此悬架的生产成本的损失和用于组装滑块的处理成本 可以避免悬浮液。

公开(公告)号：US20070015311A1

公开(公告)日：2007-01-18

申请号：US11521482

申请日：2006-09-15

申请人： Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Takayoshi Matsumura

发明人： Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Takayoshi Matsumura

IPC分类号： H01L21/00

CPC分类号： H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L24/75 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/759 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/00015 ,  H01L2224/13099 ,  H01L2924/00

摘要： The structure of mounting an electronic component on a circuit board is capable of securely flip-chip-bonding the electronic component having bumps, whose separations are very short, to the circuit board without displacement. The structure of mounting an electronic component on a circuit board is characterized in that bumps of the electronic component are respectively flip-chip-bonded to electrodes of the circuit board by applying ultrasonic vibrations to the electronic component, and that a center of each of the bumps is previously relatively displaced, with respect to a center of each of the electrodes in a width direction, in a direction parallel to a direction of the ultrasonic vibrations.

摘要翻译： 将电子部件安装在电路板上的结构能够将具有非常短的分离的凸块的电子部件可靠地倒置接合到电路板而没有位移。 将电子部件安装在电路板上的结构的特征在于，通过对电子部件施加超声波振动，电子部件的凸起分别与电路基板的电极倒装接合， 先前相对于每个电极的宽度方向上的中心在与超声波振动的方向平行的方向上相对移位。

公开(公告)号：US20060097029A1

公开(公告)日：2006-05-11

申请号：US11062959

申请日：2005-02-23

申请人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura ,  Yukio Ozaki

发明人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura ,  Yukio Ozaki

IPC分类号： B23K1/06

CPC分类号： B23K20/10 ,  B23K1/0016 ,  B23K2101/40

摘要： A method of flip-chip bonding can favorably activate the bonding surfaces and remove oxide films when bonding pads and bumps of a semiconductor chip and a substrate and avoids problems such as the bumps being excessively flattened and the bonds between connection terminals being destroyed by subsequent ultrasonic vibration. The method includes an aligning step 2 that aligns and places in contact bumps or pads of a semiconductor chip and pads or bumps of a substrate, a leveling step 4 that levels the shapes of the bumps by pressing together the semiconductor chip and the substrate with a first predetermined load, a bonding preparation step 6 that applies ultrasonic vibration to the semiconductor chip and/or the substrate so that the amplitude of the ultrasonic vibration gradually increases while the first predetermined load weakens, and a bonding step 8 that bonds the bumps and pads by applying ultrasonic vibration to the semiconductor chip and/or the substrate in a state where the semiconductor chip and the substrate are pressed together with a second predetermined load that is smaller than the first predetermined load.

摘要翻译： 倒装芯片接合的方法可以有利地激活接合表面并且在接合半导体芯片和基板的焊盘和凸点时去除氧化膜，并且避免诸如凸块过度平坦的问题，并且连接端子之间的接合被随后的超声波破坏 振动。 该方法包括：对准步骤2，其对准和放置在半导体芯片的接触凸块或焊盘以及衬底的焊盘或凸块;调平步骤4，其通过将半导体芯片和衬底压在一起来调整凸块的形状 第一预定负载，对半导体芯片和/或基板施加超声波振动的接合准备步骤6，使得当第一预定负载变弱时超声波振动的幅度逐渐增加;以及接合步骤8，其将凸块和焊盘 通过在半导体芯片和基板以比第一预定负载小的第二预定负载被压在一起的状态下，向半导体芯片和/或基板施加超声波振动。

公开(公告)号：US20050001014A1

公开(公告)日：2005-01-06

申请号：US10816915

申请日：2004-04-05

申请人： Shuichi Takeuchi ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Hiroshi Kobayashi ,  Takayoshi Matsumura ,  Shigeo Matsunuma ,  Tomohisa Yagi

发明人： Shuichi Takeuchi ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Hiroshi Kobayashi ,  Takayoshi Matsumura ,  Shigeo Matsunuma ,  Tomohisa Yagi

IPC分类号： B23K1/00 ,  B23K1/06 ,  B23K1/20 ,  B23K3/06 ,  H01L21/56 ,  H01L21/60 ,  H01L21/607 ,  H05K3/32 ,  H05K3/34 ,  B23K20/10 ,  B23K31/02

CPC分类号： H01L21/563 ,  B23K1/0016 ,  B23K1/06 ,  B23K1/203 ,  B23K3/0607 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/328 ,  H05K3/3457 ,  H05K3/3489 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0285 ,  H01L2224/05599

摘要： The method of mounting an electronic part is capable of securely mounting the electronic part having fine solder bumps without excessively heating the part. The method of comprises the steps of: applying flux-fill, which acts as flux and under-filling resin, on a surface of a mount board, in which electrodes are formed; respectively connecting solder bums of the electronic part with the electrodes; and simultaneously filling a gap between the electronic part and the mount board with the flux-fill, wherein the solder bumps are made contact with the electrodes, and ultrasonic vibration energy is applied to contact portions of the solder bumps and the electrodes in the connecting step.

摘要翻译： 安装电子部件的方法能够牢固地安装具有细焊锡凸块的电子部件，而不会过度加热该部件。 所述方法包括以下步骤：在其中形成电极的安装板的表面上施加用作助熔剂和未充填树脂的焊剂填充物; 分别将电子部件的焊料焊接与电极连接; 并且同时用助焊剂填充电子部件和安装板之间的间隙，其中焊料凸块与电极接触，并且在连接步骤中将超声波振动能量施加到焊料凸块和电极的接触部分 。