公开(公告)号：US11837464B2

公开(公告)日：2023-12-05

申请号：US17569629

申请日：2022-01-06

Applicant: Applied Materials, Inc.

Inventor： Ying Wang ,  Guan Huei See ,  Gregory J. Wilson

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/683 ,  B08B3/02

CPC classification number: H01L21/02076 ,  B08B3/02 ,  H01L21/67051 ,  H01L21/6836

Abstract: Methods, systems, and apparatus for cleaning and drying a tape-frame substrate are provided. In embodiments, an apparatus for supporting a tape-frame substrate includes a chuck having a first side and a second side opposite the first side, the first side having a convex surface configured to support the tape-frame substrate; and a plurality of channels extending through the chuck and having outlets along the first side, wherein the plurality of channels are configured to dispense fluid from the outlets along the convex surface of the first side. In embodiments, a support system includes the chuck and a holder configured to mount a tape-frame substrate to the chuck. The plurality of channels are configured to dispense fluid from the outlets and between the tape-frame substrate and the convex surface of the chuck when the tape-frame substrate is mounted to the chuck.

公开(公告)号：US20230313405A1

公开(公告)日：2023-10-05

申请号：US18129999

申请日：2023-04-03

Applicant: Applied Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson ,  Kwan Wook Roh ,  Kyle M. Hanson ,  Forrest G. Reinhart ,  David J. Reis ,  James E. Brown ,  Nolan L. Zimmerman

IPC: C25D17/00 ,  C25D3/38 ,  C25D21/04 ,  C25D21/02

CPC classification number: C25D17/002 ,  C25D3/38 ,  C25D21/04 ,  C25D21/02

Abstract: Embodiments of the present technology include electroplating methods that include providing a first portion of an electrolyte feedstock to a first compartment of an electrochemical cell. The first portion of an electrolyte feedstock may be characterized by an initial metal ion concentration and an initial acid concentration. The methods may include providing a second portion of an electrolyte feedstock to a second compartment of the electrochemical cell. The second compartment and first compartment may be separated by a first membrane. The methods may include providing an acidic solution to a third compartment of the electrochemical cell. The third compartment and second compartment may be separated by a second membrane. The acidic solution may be characterized by an initial acid concentration. The methods may include applying a current to an anode of the electrochemical cell. The anode of the electrochemical cell may be disposed proximate the first compartment and across from the first membrane.

公开(公告)号：US20230307213A1

公开(公告)日：2023-09-28

申请号：US18205690

申请日：2023-06-05

Applicant: Applied Materials, Inc.

Inventor： Tsutomu Tanaka ,  Jared Ahmad Lee ,  Rakesh Ramadas ,  Dmitry A. Dzilno ,  Gregory J. Wilson ,  Sriharish Srinivasan

IPC: H01J37/32

CPC classification number: H01J37/32733 ,  H01J37/32082 ,  H01J37/3244 ,  H01J37/32522 ,  H01J2237/20235 ,  H01J2237/332

Abstract: The disclosure describes a plasma source assemblies comprising a differential screw assembly, an RF hot electrode, a top cover, an upper housing and a lower housing. The differential screw assembly is configured to provide force to align the plasma source assembly vertically matching planarity of a susceptor. More particularly, the differential screw assembly increases a distance between the top cover and the upper housing to align the gap with the susceptor. The disclosure also provides a better thermal management by cooling fins. A temperature capacity of the plasma source assemblies is extended by using titanium electrode. The disclosure provides a cladding material covering a portion of a first surface of RF hot electrode, a second surface of RF hot electrode, a bottom surface of RF hot electrode, a portion of a surface of the showerhead and a portion of lower housing surface.

公开(公告)号：US20230235474A1

公开(公告)日：2023-07-27

申请号：US18160109

申请日：2023-01-26

Applicant: Applied Materials, Inc.

Inventor： Joel L. Cannone ,  Gregory J. Wilson ,  Douglas William Carr ,  James E. Brown

IPC: C25D17/00 ,  C25D7/12 ,  C25D17/02 ,  C25D21/14

CPC classification number: C25D17/001 ,  C25D7/12 ,  C25D17/002 ,  C25D17/02 ,  C25D21/14

Abstract: Exemplary methods of semiconductor processing may include performing an electroplating operation on a semiconductor substrate in an electroplating bath within a vessel of an electroplating system. The methods may include removing the semiconductor substrate from the electroplating bath. The methods may include closing a valve associated with a first drain from the electroplating system. The methods may include increasing flow to a second drain from the electroplating system. The second drain may be associated with a drain channel from the vessel of the electroplating system.

公开(公告)号：US11697887B2

公开(公告)日：2023-07-11

申请号：US17078413

申请日：2020-10-23

Applicant: Applied Materials, Inc.

Inventor： Nolan L. Zimmerman ,  Charles Sharbono ,  Gregory J. Wilson ,  Paul R. McHugh ,  Paul Van Valkenburg ,  Deepak Saagar Kalaikadal ,  Kyle M. Hanson

IPC: C25D17/10 ,  C25D21/12 ,  C25D21/18 ,  C25D7/12 ,  C25D17/00

CPC classification number: C25D17/10 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D21/12 ,  C25D21/18

Abstract: Electroplating systems may include an electroplating chamber. The systems may also include a replenish assembly fluidly coupled with the electroplating chamber. The replenish assembly may include a first compartment housing anode material. The first compartment may include a first compartment section in which the anode material is housed and a second compartment section separated from the first compartment section by a divider. The replenish assembly may include a second compartment fluidly coupled with the electroplating chamber and electrically coupled with the first compartment. The replenish assembly may also include a third compartment electrically coupled with the second compartment, the third compartment including an inert cathode.

公开(公告)号：US20230092346A1

公开(公告)日：2023-03-23

申请号：US17478252

申请日：2021-09-17

Applicant: Applied Materials, Inc.

Inventor： Charles Sharbono ,  Paul R. McHugh ,  Gregory J. Wilson ,  John L. Klocke ,  Nolan L. Zimmerman

IPC: C25D5/02 ,  H01L21/288 ,  C25D7/12

Abstract: Exemplary electroplating systems may include a vessel. The systems may include a paddle disposed within the vessel. The paddle may be characterized by a first surface and a second surface. The first surface of the paddle may be include a plurality of ribs that extend upward from the first surface. The plurality of ribs may be arranged in a generally parallel manner about the first surface. The paddle may define a plurality of apertures through a thickness of the paddle. Each of the plurality of apertures may have a diameter of less than about 5 mm. The paddle may have an open area of less than about 15%.

公开(公告)号：US11367653B2

公开(公告)日：2022-06-21

申请号：US16572920

申请日：2019-09-17

Applicant: Applied Materials, Inc.

Inventor： Paul McHugh ,  Kwan Wook Roh ,  Gregory J. Wilson

IPC: H01L21/768 ,  H01L21/288 ,  G06F30/394 ,  H01L23/522

Abstract: Exemplary methods of producing a semiconductor substrate may include characterizing a substrate pattern to identify a zonal distribution of a plurality of vias and a height and a radius of each via of the plurality of vias. The methods may include determining a fill rate for each via within the zonal distribution of the plurality of vias. The methods may include modifying a die pattern to adjust via fill rates between two zones of vias. The methods may also include producing a substrate according to the die pattern.

公开(公告)号：US20210102307A1

公开(公告)日：2021-04-08

申请号：US17064785

申请日：2020-10-07

Applicant: Applied Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson

IPC: C25D21/10 ,  C25D17/02

Abstract: Systems and methods for electroplating are described. The electroplating system may include a vessel configured to hold a first portion of a liquid electrolyte. The system may also include a substrate holder configured for holding a substrate in the vessel. The system may further include a first reservoir in fluid communication with the vessel. In addition, the system may include a second reservoir in fluid communication with the vessel. Furthermore, the system may include a first mechanism configured to expel a second portion of the liquid electrolyte from the first reservoir into the vessel. The system may also include a second mechanism configured to take in a third potion of the liquid electrolyte from the vessel into the second reservoir when the second portion of the liquid electrolyte is expelled from the first reservoir. Methods may include oscillating flow of the electrolyte within the vessel.

公开(公告)号：US20190153611A1

公开(公告)日：2019-05-23

申请号：US16261157

申请日：2019-01-29

Applicant: APPLIED Materials, Inc.

Inventor： Gregory J. Wilson ,  Paul R. McHugh

IPC: C25D17/00 ,  C25D21/10 ,  C25D5/08

CPC classification number: C25D17/001 ,  C25D5/08 ,  C25D21/10

Abstract: Electroplating apparatus agitates electrolyte to provide high velocity fluid flows at the surface of a wafer. The apparatus includes a paddle which provides uniform high mass transfer over the entire wafer, even with a relatively large gap between the paddle and the wafer. Consequently, the processor may have an electric field shield positioned between the paddle and the wafer for effective shielding at the edges of the wafer. The influence of the paddle on the electric field across the wafer is reduced as the paddle is spaced relatively farther from the wafer.

公开(公告)号：US10227707B2

公开(公告)日：2019-03-12

申请号：US14802859

申请日：2015-07-17

Applicant: APPLIED Materials, Inc.

Inventor： Gregory J. Wilson ,  Paul R. McHugh ,  John L. Klocke

IPC: C25B15/08 ,  C25B15/02 ,  C25B9/08 ,  C25B9/18 ,  C25B1/02 ,  C25D21/18 ,  C25D7/12 ,  C25D17/10 ,  C25D17/00 ,  C25D17/06 ,  C25D3/38

Abstract: An electroplating processor has a vessel holding an electrolyte. An inert anode in the vessel has an anode wire within an anode membrane tube. A head for holds a wafer in contact with the electrolyte in the vessel. The wafer is connected to a cathode. A catholyte replenisher is connected to the vessel. The catholyte replenisher adds metal ions into the catholyte by moving ions of a bulk metal through a catholyte membrane in the catholyte replenisher.