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175 条记录 (耗时 0.051 秒)

    Enhanced methods for at least partial in situ release of sacrificial material from cavities or channels and/or sealing of etching holes during fabrication of multi-layer microscale or millimeter-scale complex three-dimensional structures
    41.
    发明授权
    Enhanced methods for at least partial in situ release of sacrificial material from cavities or channels and/or sealing of etching holes during fabrication of multi-layer microscale or millimeter-scale complex three-dimensional structures 有权
    用于在多层微米级或毫米级复杂三维结构的制造期间至少部分原位释放来自空腔或通道的牺牲材料和/或蚀刻孔的密封的方法

    公开(公告)号：US08262916B1

    公开(公告)日：2012-09-11

    申请号：US12828274

    申请日：2010-06-30

    申请人： Dennis R. Smalley ,  Michael S. Lockard ,  Adam L. Cohen

    发明人： Dennis R. Smalley ,  Michael S. Lockard ,  Adam L. Cohen

    IPC分类号： C23F1/22

    CPC分类号： B81C1/00071 ,  C25D1/003

    摘要： Embodiments of the invention are directed to multi-layer, multi-material fabrication methods (e.g. electrochemical fabrication methods) which provide improved versatility in producing complex microdevices and in particular in removing sacrificial material from passages, channels, or cavities that are complex or that include etching access ports in their final configurations that are small relative to passage, channel, or cavity lengths. Embodiments of the present invention provide for removal of sacrificial material from these passages, channels or cavities using one or more initial or preliminary removal steps that occur prior to completion of the such passages that results from the completion of the layer forming steps. In some embodiments, first sacrificial material is replaced after a secondary solid sacrificial material after the initial removal step or steps. In other embodiments, the first sacrificial material is replaced after a liquid material after the initial removal step or steps. In some embodiments, desired structure formation may occur along or separately from one or more etchant directing manifolds that can force etchant into the passages, channels, and cavities.

    摘要翻译： 本发明的实施例涉及多层，多材料制造方法（例如电化学制造方法），其提供了在复杂微器件生产中提供改进的多功能性，特别是从复杂的通道，通道或腔中去除牺牲材料， 蚀刻其相对于通道，通道或腔长度较小的最终构造的进入端口。 本发明的实施例提供了从这些通道，通道或空腔中去除牺牲材料，使用在完成层形成步骤后产生的这种通道完成之前发生的一个或多个初始或初步去除步骤。 在一些实施例中，在初始移除步骤或步骤之后，在第二固体牺牲材料之后，替换第一牺牲材料。 在其它实施例中，在初始移除步骤或步骤之后，在液体材料之后替换第一牺牲材料。 在一些实施方案中，期望的结构形成可以沿着或分开地与一个或多个蚀刻剂导向歧管发生，其可以迫使蚀刻剂进入通道，通道和空腔。

    Endoscope channel cap
    42.
    发明授权
    Endoscope channel cap 有权
    内窥镜通道帽

    公开(公告)号：US08231525B2

    公开(公告)日：2012-07-31

    申请号：US11320491

    申请日：2005-12-29

    申请人： Adam L. Cohen ,  John Golden ,  Liem T. Vu

    发明人： Adam L. Cohen ,  John Golden ,  Liem T. Vu

    IPC分类号： A61M5/178 ,  A61B1/00 ,  A61B1/12

    CPC分类号： A61B1/00137 ,  A61B1/018 ,  A61B17/3462 ,  A61M39/0606

    摘要： The invention relates to an endoscope channel cap that may be used separately with two or more endoscopes each having a cap interface portion with a different configuration. The channel cap also may include one or more seals to maintain insufflation pressure both when an endoscopic instrument is inserted in a working channel of the endoscope and when the instrument is not inserted in the channel.

    摘要翻译： 本发明涉及一种内窥镜通道盖，其可以与两个或更多个内窥镜分开使用，每个内窥镜具有不同构型的盖接口部分。 当内窥镜器械插入到内窥镜的工作通道中并且当仪器未插入通道中时，通道盖还可以包括一个或多个密封件，以保持吹入压力。

    Method for Electrochemical Fabrication
    43.
    发明申请
    Method for Electrochemical Fabrication 有权
    电化学加工方法

    公开(公告)号：US20110247941A1

    公开(公告)日：2011-10-13

    申请号：US13167451

    申请日：2011-06-23

    申请人： Adam L. Cohen

    发明人： Adam L. Cohen

    IPC分类号： C25D5/02

    CPC分类号： C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

    摘要： An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

    摘要翻译： 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

    Method for electrochemical fabrication
    44.
    发明授权
    Method for electrochemical fabrication 有权
    电化学制造方法

    公开(公告)号：US07998331B2

    公开(公告)日：2011-08-16

    申请号：US12698026

    申请日：2010-02-01

    申请人： Adam L. Cohen

    发明人： Adam L. Cohen

    IPC分类号： C25D5/02

    CPC分类号： C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

    摘要： An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

    摘要翻译： 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

    Multi-Layer, Multi-Material Fabrication Methods for Producing Micro-Scale and Millimeter-Scale Devices with Enhanced Electrical and/or Mechanical Properties
    45.
    发明申请
    Multi-Layer, Multi-Material Fabrication Methods for Producing Micro-Scale and Millimeter-Scale Devices with Enhanced Electrical and/or Mechanical Properties 有权
    用于生产具有增强的电气和/或机械性能的微尺度和毫米级装置的多层，多材料制造方法

    公开(公告)号：US20110132767A1

    公开(公告)日：2011-06-09

    申请号：US12906970

    申请日：2010-10-18

    申请人： Ming Ting Wu ,  Rulon Joseph Larsen, III ,  Young Kim ,  Kieun Kim ,  Adam L. Cohen ,  Ananda H. Kumar ,  Michael S. Lockard ,  Dennis R. Smalley

    发明人： Ming Ting Wu ,  Rulon Joseph Larsen, III ,  Young Kim ,  Kieun Kim ,  Adam L. Cohen ,  Ananda H. Kumar ,  Michael S. Lockard ,  Dennis R. Smalley

    IPC分类号： C25D5/02 ,  C25D5/48

    CPC分类号： G01R1/06716 ,  B33Y10/00 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  G01R1/06744 ,  G01R1/06755 ,  G01R3/00 ,  H01L21/4853

    摘要： Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions. Each of these groups of embodiments incorporate both the core material and the coating material during the formation of each layer and each layer is also formed with a sacrificial material that is removed after formation of all layers of the structure. In some embodiments the core material may be a genuine structural material while in others it may be only a functional structural material (i.e. a material that would be removed with sacrificial material if it were accessible by an etchant during removal of sacrificial material.

    摘要翻译： 本发明的一些实施方案涉及用于从芯材料和部分涂覆结构表面的壳或涂层材料形成结构或器件（例如用于半导体器件的晶片级测试的微探针）的电化学制造方法。 其它实施方案涉及用于从芯材和壳或涂层材料制造结构或器件（例如微探针）的电化学制造方法，其完全涂覆形成探针的每个层的表面，包括中间层区域。 本发明的另外的实施方案涉及用于从核心材料和壳或涂层材料形成结构或器件（例如微针）的电化学制造方法，其中涂层材料围绕结构的每一层定位，而不将涂层材料定位在相互之间， 层区域。 这些实施例组中的每一个在形成每个层期间都包括芯材料和涂层材料，并且每个层还形成有牺牲材料，该牺牲材料在形成所述结构的所有层之后被去除。 在一些实施例中，芯材料可以是真正的结构材料，而在其它实施例中，其可以仅是功能性结构材料（即，如果在去除牺牲材料期间可通过蚀刻剂获得牺牲材料，则该材料将被除去。

    Discrete or Continuous Tissue Capture Device and Method for Making
    48.
    发明申请
    Discrete or Continuous Tissue Capture Device and Method for Making 审中-公开
    离散或连续组织捕获装置及其制造方法

    公开(公告)号：US20100241027A1

    公开(公告)日：2010-09-23

    申请号：US12729719

    申请日：2010-03-23

    申请人： Adam L. Cohen

    发明人： Adam L. Cohen

    IPC分类号： A61B10/00

    CPC分类号： A61B10/0266 ,  A61B10/04 ,  A61B17/149 ,  A61B17/320016 ,  A61B17/320783 ,  A61B2010/0225 ,  A61B2017/00243 ,  A61B2017/00345 ,  A61B2017/00526 ,  A61B2017/320064 ,  B33Y80/00

    摘要： Some embodiments of the invention provide an instrument for mechanically removing segments of tissue from a patient during a minimally invasive surgical procedure. An exemplary instrument provides an inlet for receiving tissue a mechanism for cutting away received tissue and for simultaneously moving the cut away tissue away from the inlet to allow additional material to enter the inlet for removal wherein multiple specimens can be captured and eventually removed from the patient's body without the need of removing the instrument after each capture.

    摘要翻译： 本发明的一些实施例提供一种用于在微创手术过程中从患者机械地去除组织的部分的器械。 示例性仪器提供用于接收组织的入口，用于切除接收的组织并同时移动切除组织远离入口的机构，以允许另外的材料进入入口以移除，其中可以捕获多个样本并最终从患者的组织中移除 每次捕获后无需去除仪器。