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公开(公告)号：US20200094371A1
公开(公告)日：2020-03-26
申请号：US16575844
申请日：2019-09-19
Applicant: EBARA CORPORATION
Inventor： Kenichi Akazawa , Makoto Kashiwagi , Yu Ishii , Atsushi Yoshida , Kenichi Kobayashi , Tetsuji Togawa , Hozumi Yasuda
Abstract: Disclosed is a polishing head for a polishing apparatus for polishing a quadrangular substrate using a polishing pad attached to a polishing table, comprising a head body portion, a plurality of elastic bags disposed in a surface of the head body portion, which is to face the polishing table, and a substrate holding plate for holding the substrate, the substrate holding plate being pressed by the elastic bags in a direction away from the head body portion, the head body portion being provided with channels for bags, which are in communication with the respective elastic bags, the polishing head further including at least two support plates disposed between the elastic bags on one hand and the substrate holding plate on the other, the elastic bags being configured to press the substrate holding plate through the support plates.
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公开(公告)号：US10035239B2
公开(公告)日：2018-07-31
申请号：US15163571
申请日：2016-05-24
Applicant: EBARA CORPORATION
Inventor： Hozumi Yasuda , Makoto Fukushima , Osamu Nabeya
Abstract: A polishing apparatus which can allow easy replacement of a retainer ring and can allow the retainer ring to be secured to a drive ring without causing deformation of the retainer ring is disclosed. The polishing head includes a head body having a substrate contact surface, a drive ring coupled to the head body, and a retainer ring surrounding the substrate contact surface and coupled to the drive ring. A first screw thread is formed on the drive ring, a second screw thread, which engages with the first screw thread, is formed on the retainer ring. The second screw thread extends in a circumferential direction of the retainer ring.
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公开(公告)号：US09999956B2
公开(公告)日：2018-06-19
申请号：US14672747
申请日：2015-03-30
Applicant: Ebara Corporation
Inventor： Keisuke Namiki , Hozumi Yasuda , Osamu Nabeya , Makoto Fukushima , Shingo Togashi , Satoru Yamaki , Shintaro Isono
CPC classification number: B24B37/015 , B24B37/32 , B24B37/345 , B24B49/003 , B24B49/105 , B24B49/12
Abstract: A polishing device is provided to suppress deterioration in reproducibility of a polishing profile due to a variation or change with time of a shape of a retaining ring of a substrate holding member for each of retaining rings. The polishing device includes: a polishing head configured to press a substrate against a polishing pad and have a retainer ring surrounding the substrate pressed against the polishing pad; a measurement sensor configured to measure a surface shape of the retainer ring; and a controller configured to determine a polishing condition of the substrate based on the surface shape of the retainer ring measured by the measurement sensor.
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公开(公告)号：USD793976S1
公开(公告)日：2017-08-08
申请号：US29573831
申请日：2016-08-10
Applicant: EBARA CORPORATION
Designer： Makoto Fukushima , Hozumi Yasuda , Keisuke Namiki , Osamu Nabeya , Shingo Togashi , Satoru Yamaki
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公开(公告)号：US09662764B2
公开(公告)日：2017-05-30
申请号：US13752659
申请日：2013-01-29
Applicant: EBARA CORPORATION
Inventor： Makoto Fukushima , Hozumi Yasuda , Keisuke Namiki , Osamu Nabeya , Shingo Togashi , Satoru Yamaki
CPC classification number: B24B37/32 , B24B37/04 , B24B37/042 , B24B37/30
Abstract: The substrate holder is a device for holding a substrate and pressing it against a polishing pad. The substrate holder includes: an inner retaining ring vertically movable independently of the top ring body and arranged around the substrate; an inner pressing mechanism to press the inner retaining ring against the polishing surface of the polishing pad; an outer retaining ring to vertically movable independently of the inner retaining ring and the top ring body; an outer pressing mechanism to press the outer retaining ring against the polishing surface; and a supporting mechanism to receive a lateral force applied to the inner retaining ring from the substrate during polishing of the substrate and to tiltably support the outer retaining ring.
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Patent Agency Ranking
公开(公告)号：US09550271B2
公开(公告)日：2017-01-24
申请号：US14599976
申请日：2015-01-19
Applicant: EBARA CORPORATION
Inventor： Hozumi Yasuda , Makoto Fukushima , Osamu Nabeya , Masahiko Kishimoto
CPC classification number: B24B37/32 , B24B37/107
Abstract: A substrate holding apparatus and a polishing apparatus which can reduce vibrations of a top ring in its entirety by damping vibrations transmitted from a retaining ring to a top ring body is disclosed. The substrate holding apparatus includes a top ring body having a substrate holding surface configured to hold and press a substrate against a polishing surface, a retaining ring configured to surround the substrate and to contact the polishing surface, and a drive ring comprising a ring member configured to hold the retaining ring on a lower surface thereof, a central member disposed at a central part of the top ring body and supported by the top ring body, and a connecting portion configured to connect the ring member and the central member. The drive ring includes a first material and a second material having a modulus of longitudinal elasticity smaller than the first material.
Abstract translation: 公开了一种基板保持装置和抛光装置，其可以通过阻止从保持环传递到顶环体的振动来整体减小顶环的振动。 基板保持装置包括：顶环主体，具有基板保持面，被配置为将基板保持并压靠在研磨面上;保持环，被配置为围绕基板并接触抛光面;以及驱动环，其包括环状构件 将保持环保持在其下表面上，中心构件设置在顶环体的中心部分并由顶环体支撑，以及连接部分，其构造成连接环构件和中心构件。 驱动环包括第一材料和具有小于第一材料的纵向弹性模量的第二材料。
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公开(公告)号：USD769200S1
公开(公告)日：2016-10-18
申请号：US29472346
申请日：2013-11-12
Applicant: EBARA CORPORATION
Designer： Makoto Fukushima , Hozumi Yasuda , Keisuke Namiki , Osamu Nabeya , Shingo Togashi , Satoru Yamaki
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公开(公告)号：US09403255B2
公开(公告)日：2016-08-02
申请号：US13905763
申请日：2013-05-30
Applicant: Ebara Corporation
Inventor： Makoto Fukushima , Hozumi Yasuda , Keisuke Namiki , Osamu Nabeya , Shingo Togashi , Satoru Yamaki
CPC classification number: B24B37/005 , B24B7/228 , B24B37/042 , B24B37/07 , B24B37/32 , B24B49/16
Abstract: A polishing apparatus polishes a substrate by bringing the substrate into sliding contact with a polishing surface. The polishing apparatus includes: a substrate holder having a substrate holding surface configured to press the substrate against the polishing surface, a retaining ring coupled to the substrate holding surface and configured to surround the substrate, wherein the retaining ring is brought into contact with the polishing surface during operation of the polishing apparatus, the retaining ring being configured to be tiltable independently of the substrate holding surface; a rotating mechanism configured to rotate the substrate holder about its own axis; and at least one local load exerting mechanism configured to exert a local load on a part of the retaining ring in a direction perpendicular to the polishing surface, the at least one local load exerting mechanism being arranged so as not to move in accordance with the substrate holder.
Abstract translation: 抛光装置通过使基板与抛光表面滑动接触来抛光基板。 抛光装置包括：基板保持器，其具有被配置为将基板压靠在抛光表面上的基板保持表面;保持环，其联接到基板保持表面并且构造成围绕基板，其中保持环与抛光接触 所述保持环被构造成可以独立于所述基板保持表面倾斜; 旋转机构，其构造成使所述衬底保持器围绕其自身的轴线旋转; 以及至少一个局部负载施加机构，其被构造成沿与所述抛光表面垂直的方向在所述保持环的一部分上施加局部负载，所述至少一个局部负载施加机构被布置成不依照所述衬底移动 持有人
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公开(公告)号：US09399277B2
公开(公告)日：2016-07-26
申请号：US14672003
申请日：2015-03-27
Applicant: EBARA CORPORATION
Inventor： Hiroshi Yoshida , Makoto Fukushima , Hozumi Yasuda
IPC: H01L21/302 , H01L21/461 , B24B37/10 , B24B37/34 , H01L21/02 , H01L21/67
CPC classification number: B24B37/10 , B24B37/345 , H01L21/02024 , H01L21/67219 , H01L21/67742
Abstract: A polishing apparatus capable of performing multi-stage polishing of a substrate, such as wafer, is disclosed. The polishing apparatus includes: a plurality of polishing tables each for supporting a polishing pad; a plurality of polishing heads each configured to press a substrate against the polishing pad; and a transporting device configured to transport the substrate to at least two of the plurality of polishing heads. The plurality of polishing heads have different structures.
Abstract translation: 公开了能够进行诸如晶片的基板的多阶段抛光的抛光装置。 抛光装置包括：多个用于支撑抛光垫的抛光台; 多个抛光头，每个抛光头都构造成将基板压靠在抛光垫上; 以及传送装置，其构造成将所述基板传送到所述多个抛光头中的至少两个。 多个抛光头具有不同的结构。
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公开(公告)号：USD729753S1
公开(公告)日：2015-05-19
申请号：US29496207
申请日：2014-07-10
Applicant: EBARA CORPORATION
Designer： Makoto Fukushima , Hozumi Yasuda , Osamu Nabeya , Katsuhide Watanabe , Keisuke Namiki
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