Abstract:
A chip scale power converter package having an inductor substrate and a power integrated circuit flipped onto the inductor substrate is disclosed. The inductor substrate includes a high resistivity substrate having a planar spiral inductor formed thereon.
Abstract:
Improved electrical transient blocking is provided with a transient blocking unit (TBU) having a partial disconnect capability. A TBU is an arrangement of voltage controlled switches that normally conducts, but switches to a disconnected state in response to an above-threshold input transient. Partial disconnection improves the power handling capability of a TBU by preventing thermal damage to the TBU. Partial TBU disconnection can be implemented to keep power dissipation in the TBU below a predetermined level Pmax, thereby avoiding thermal damage to the TBU by keeping the TBU temperature below a temperature limit Tmax. Alternatively, partial TBU disconnection can be implemented to keep TBU temperature below Tmax using direct temperature sensing and feedback.
Abstract:
A transient blocking unit (TBU) having improved damage resistance is provided. A TBU includes two or more depletion mode transistors arranged to provide a low series impedance in normal operation and a high series impedance when the input current exceeds a predetermined threshold. At least one of the TBU transistors is a protecting device having a shunt circuit element connected in parallel with its channel. When the TBU is in its high impedance state, the shunt circuit element provides a current path, thereby decreasing terminal voltages on at least one of the TBU transistors. The shunt element can be a discrete or integrated resistor, a current source including a transistor, or an appropriately engineered device parasitic.
Abstract:
An apparatus and method for enhanced transient blocking employing a transient blocking unit (TBU) that uses at least one depletion mode n-channel device interconnected with at least one depletion mode p-channel device. The interconnection is performed such that a transient alters a bias voltage Vp of the p-channel device and a bias voltage Vn of the n-channel device such that the p- and n-channel devices mutually switch off to block the transient. The apparatus has an enhancer circuit for applying an enhancement bias to a gate terminal of at least one of the depletion mode n-channel devices of the TBU to reduce a total resistance Rtot of the apparatus. Alternatively, the apparatus has an enhancement mode NMOS transistor and a TBU connected thereto to help provide an enhancement bias to a gate terminal of the enhancement mode NMOS.
Abstract translation:一种用于增强瞬态阻塞的装置和方法,其采用使用与至少一个耗尽型p沟道器件互连的至少一个耗尽型n沟道器件的瞬态阻塞单元(TBU)。 执行互连,使得瞬态改变p沟道器件的偏置电压V P和N沟道器件的偏置电压V N n N,使得p - 和n通道设备相互关闭以阻止瞬态。 该装置具有增强器电路,用于向TBU中的至少一个耗尽型n沟道器件的栅极端子施加增强偏置,以减小器件的总电阻R tht。 或者,该装置具有增强型NMOS晶体管和与其连接的TBU,以帮助向增强型NMOS的栅极端提供增强偏置。
Abstract:
A high voltage MOS transistor with a gate extension that has a reduced electric field in the drain region near the gate is provided. The high voltage MOS transistor includes a first and second gate layers, and a dielectric layer between the gate layers. The first and second gate layers are electrically coupled together and form the gate of the transistor. The second gate layer extends over the drain of the transistor above the dielectric and gate oxide layers to form the gate extension. The gate extension reduces the peak electric field in the drain by providing a wide area for the voltage to drop between the drain and the gate of the transistor. The dielectric layer also reduces the peak electric field in the drain near the gate by providing insulation between the gate and the drain. A lower electric field in the drain reduces the impact generation rate of carriers. The high voltage MOS transistor of the present invention may be fabricated without additional processing steps in BiCMOS and CMOS processes that use dual polysilicon layers and a dielectric layer that are used to form capacitors.
Abstract:
A current mirror bias circuit for an RF amplifier transistor is modified whereby the reference transistor of the current mirror tracks hot carrier degradation in the RF transistor. Gate bias to the current mirror transistor is modified whereby the drain-to-gate voltage can be positive, and the lightly doped drain region in the lateral n-channel reference transistor is shortened and dopant concentration increased to increase the electric field of the reference transistor to provide the hot carrier injection degradation characteristics similar to the main transistor. Additionally, the gate length of the reference transistor can be shortened to effect the hot carrier injection degradation.
Abstract:
A method of fabricating a MOSFET transistor and resulting structure having a drain-gate feedback capacitance shield formed in a recess between a gate electrode and the drain region. The shield does not overlap the gate and thereby minimizes effect on the input capacitance of the transistor. The process does not require complex or costly processing since one additional non-critical mask is required with selective etch used to create the recess.
Abstract:
An IGFET device (lateral DMOS transistor) with reduced cell dimensions which is especially suitable for RF and microwave applications, includes a semiconductor substrate having an epitaxial layer with a device formed in a surface of the epitaxial layer. A sinker contact is provided from the surface to the epitaxial layer to the substrate for use in grounding the source region to the grounded substrate. The sinker contact is aligned with the source region and spaced from the width of the channel region whereby lateral diffusion in forming the sinker contact does not adversely affect the pitch of the cell structure. The reduced pitch increases output power and reduces parasitic capacitance whereby the device is well-suited for low side switches and as an RF/microwave power transistor.
Abstract:
A novel device isolation scheme for separating active regions on a semiconductor substrate by combining field oxide formation with trench isolation is disclosed. According to this scheme, shallow and deep trenches are etched into the semiconductor substrate. A layer of nitride is deposited over the entire substrate followed by a layer of poly-silicon. Oxide spacers on the poly-silicon and a photoresist mask is aligned within the oxide spacers, thereby permitting the selective etching of the poly-silicon layer. The poly-silicon layer overlying the active regions of the semiconductor substrate are etched away. Then an oxidation step is performed such that the poly-silicon layer filling the shallow trenches is oxidized while the poly-silicon filling the deep trenches remains unoxidized. The alignment of the photoresist becomes highly non-critical because of the use of the oxide spacers and fully walled junctions are provided.
Abstract:
Light sensors including dielectric optical coatings to shape their spectral responses, and methods for fabricating such light sensors in a manner that accelerates lift-off processes and increases process margins, are described herein. In certain embodiments, a short duration soft bake is performed. Alternatively, or additionally, temperature cycling is performed. Alternatively, or additionally, photolithography is performed using a photomask that includes one or more dummy corners, dummy islands and/or dummy rings. Each of the aforementioned embodiments form and/or increase a number of micro-cracks in the dielectric optical coating not covering the photodetector sensor region, thereby enabling an accelerated lift-off process and an increased process margin. Alternatively, or additionally, a portion of the photomask can include chamfered corners so that the dielectric optical coating includes chamfered corners, which improves the thermal reliability of the dielectric optical coating.