公开(公告)号：US20130203856A1

公开(公告)日：2013-08-08

申请号：US13809432

申请日：2011-07-11

申请人： Il Hwan Cho ,  Eui Jin Hwang ,  Moo Seok Seo ,  Young Soo Park ,  Byung Su Kim ,  Sei Kwang Hahn ,  Jung Kyu Park ,  Jun Seok Yeom ,  Eun Ju Oh

发明人： Il Hwan Cho ,  Eui Jin Hwang ,  Moo Seok Seo ,  Young Soo Park ,  Byung Su Kim ,  Sei Kwang Hahn ,  Jung Kyu Park ,  Jun Seok Yeom ,  Eun Ju Oh

IPC分类号： A61K8/73 ,  A61Q19/08 ,  A61K31/167

CPC分类号： A61K8/735 ,  A61K31/167 ,  A61L27/20 ,  A61L27/52 ,  A61L27/54 ,  A61L2300/402 ,  A61L2400/06 ,  A61Q19/08 ,  C08B37/0072 ,  C08J3/075 ,  C08J2305/08 ,  C08L5/08

摘要： The present invention relates to a filler composition for tissue reinforcement, including hyaluronic acid and alkylene diamine crosslinked hydrogel. The filler composition exhibits the positive physical properties required for tissue reinforcement, such as biocompatibility and swelling ability, as well as useful effects in that the same can remain in vivo for a long time.

摘要翻译： 本发明涉及用于组织增强的填充剂组合物，包括透明质酸和亚烷基二胺交联的水凝胶。 填充剂组合物显示组织增强所需的正性物理性质，例如生物相容性和溶胀能力，以及有益效果，因为它们长时间保留在体内。

公开(公告)号：US08132953B2

公开(公告)日：2012-03-13

申请号：US12244393

申请日：2008-10-02

申请人： Jung Kyu Park ,  Seong Ah Joo ,  Seung Hwan Choi

发明人： Jung Kyu Park ,  Seong Ah Joo ,  Seung Hwan Choi

IPC分类号： F21V7/04

CPC分类号： G02F1/133603 ,  G02F1/133605 ,  G02F2001/133612 ,  H05K1/0274 ,  H05K1/053 ,  H05K1/092 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10S362/80

摘要： There are provided a light emitting diode substrate module and a method of manufacturing the same, and a backlight unit and a method of manufacturing the same. A light emitting diode substrate module according to an aspect of the invention includes: a metal plate; an insulating film having a predetermined thickness and provided on an entire outer surface of the metal plate; a reflective film having a predetermined thickness and provided on an entire outer surface of the insulating film; and at least one light emitting diode package electrically connected to a driving circuit provided on the reflective film by pattern printing.Unnecessary material costs can be avoided by forming a predetermined driving circuit by pattern printing, and optical characteristics can be improved by stably maintaining reflection characteristics.

摘要翻译： 提供了一种发光二极管衬底模块及其制造方法，以及背光单元及其制造方法。 根据本发明的一个方面的发光二极管衬底模块包括：金属板; 具有预定厚度并设置在金属板的整个外表面上的绝缘膜; 具有预定厚度并设置在绝缘膜的整个外表面上的反射膜; 以及通过图案印刷电连接到设置在反射膜上的驱动电路的至少一个发光二极管封装。 通过图案印刷形成预定的驱动电路可以避免不必要的材料成本，通过稳定地保持反射特性可以提高光学特性。

公开(公告)号：US20050199884A1

公开(公告)日：2005-09-15

申请号：US10890178

申请日：2004-07-14

申请人： Seon Goo Lee ,  Seung Mo Park ,  Chan Wang Park ,  Jung Kyu Park

发明人： Seon Goo Lee ,  Seung Mo Park ,  Chan Wang Park ,  Jung Kyu Park

IPC分类号： H01L27/15 ,  H01L33/48 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62

CPC分类号： H01L33/54 ,  H01L24/17 ,  H01L24/73 ,  H01L24/97 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16245 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A high power LED package, in which substantially planar first and second lead frames made of high reflectivity metal are spaced from each other for a predetermined gap. An LED chip is seated on at least one of the lead frames, and having terminals electrically connected to the lead frames, respectively. A package body made of resin seals the LED chip therein while fixedly securing the lead frame in the bottom thereof. The encapsulant preferably fills up the gap between the first and second lead frames. The LED package is structured to raise thermal radiation efficiency thereby reducing the size and thickness thereof.

摘要翻译： 大功率LED封装，其中由高反射率金属制成的大致平面的第一和第二引线框架彼此间隔开预定的间隙。 LED芯片位于至少一个引线框架上，并且具有分别电连接到引线框架的端子。 由树脂制成的包装体将LED芯片密封在其中，同时将引线框固定在其底部。 密封剂优选地填充第一和第二引线框架之间的间隙。 LED封装构造为提高热辐射效率，从而减小其尺寸和厚度。

公开(公告)号：US20210324865A1

公开(公告)日：2021-10-21

申请号：US16315450

申请日：2018-05-25

申请人： Jung Kyu Park

发明人： Jung Kyu Park

IPC分类号： F04D25/08 ,  F04D25/10 ,  F04D25/16 ,  F04D29/56

摘要： The present invention relates to a neck band type fan and, more specifically, relates to a neck band type fan, allowing a user to wear a fan on a neck and use the same, so as to cool a face, a chest, and the like in a state in which both hands are free. The neck band type fan of the present invention comprises: a main body formed in a shape which surrounds the back of a neck and has both ends descending to a lower portion of the front of the neck when worn; a head provided on both ends of the main body and having an inner space and a plurality of wind holes; and a blade installed in the head and rotated by a motor to generate wind.

公开(公告)号：US08563338B2

公开(公告)日：2013-10-22

申请号：US13369157

申请日：2012-02-08

申请人： Jung Kyu Park ,  Yu Dong Kim ,  Seung Hwan Choi ,  Seong Ah Joo

发明人： Jung Kyu Park ,  Yu Dong Kim ,  Seung Hwan Choi ,  Seong Ah Joo

IPC分类号： H01L21/00

CPC分类号： H01L33/505 ,  H01L24/97 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： Provided is a light emitting diode (LED) package including a phosphor substrate; an LED chip mounted on the phosphor substrate; a circuit board mounted on the other region of the phosphor substrate excluding the region where the LED chip is mounted; an electrode connection portion for electrically connecting the LED chip and the circuit board; and a sealing member that covers the LED chip, the circuit board, and the phosphor substrate.

摘要翻译： 提供了包括荧光体基板的发光二极管（LED）封装; 安装在荧光体基板上的LED芯片; 安装在除了安装有LED芯片的区域之外的荧光体基板的另一区域上的电路板; 用于电连接LED芯片和电路板的电极连接部分; 以及覆盖LED芯片，电路板和荧光体基板的密封构件。

公开(公告)号：USD667800S1

公开(公告)日：2012-09-25

申请号：US29393824

申请日：2011-06-09

申请人： Seung Hwan Choi ,  Jung Kyu Park ,  Young Sik Jeong ,  Jin Mo Kim ,  Sung Ho Youn ,  Man Ki Hong ,  Churl Wung Shin ,  Tae Heon Han

设计人： Seung Hwan Choi ,  Jung Kyu Park ,  Young Sik Jeong ,  Jin Mo Kim ,  Sung Ho Youn ,  Man Ki Hong ,  Churl Wung Shin ,  Tae Heon Han

公开(公告)号：US08183229B2

公开(公告)日：2012-05-22

申请号：US12438628

申请日：2007-08-27

申请人： Sei Kwang Hahn ,  Eun Ju Oh ,  Jung Kyu Park ,  Kwang Bum Park ,  Kyoung Ho Ryoo ,  Seok Kyu Choi ,  Dong Jun Yang ,  Hyun Wook An

发明人： Sei Kwang Hahn ,  Eun Ju Oh ,  Jung Kyu Park ,  Kwang Bum Park ,  Kyoung Ho Ryoo ,  Seok Kyu Choi ,  Dong Jun Yang ,  Hyun Wook An

IPC分类号： A61K31/70 ,  C07H5/04

CPC分类号： A61L27/46 ,  A61F2/28 ,  A61L2430/02 ,  C08L5/08

摘要： Provided is a bone filling complex and method of preparing the same. The bone filling complex includes a matrix including a hydrogel-type hyaluronic acid derivative; and a bone derivative filling the matrix For example, the bone filling complex can be used to regenerate an injured alveolar bone.

摘要翻译： 提供骨填充复合物及其制备方法。 骨填充复合物包括包含水凝胶型透明质酸衍生物的基质; 和填充基质的骨衍生物例如，骨填充复合物可用于再生受损的牙槽骨。

公开(公告)号：US07598528B2

公开(公告)日：2009-10-06

申请号：US11808810

申请日：2007-06-13

申请人： Kyung Seob Oh ,  Jae Ky Roh ,  Jung Kyu Park ,  Jong Hwan Baek ,  Seung Hwan Choi

发明人： Kyung Seob Oh ,  Jae Ky Roh ,  Jung Kyu Park ,  Jong Hwan Baek ,  Seung Hwan Choi

IPC分类号： H01L33/00 ,  H01L29/22 ,  H01L29/24

CPC分类号： H01L25/0753 ,  H01L33/46 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49113 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A high power Light Emitting Diode (LED) package and a method of producing the same. The high power LED package according to the present invention includes a plurality of light emitting diode chips, a first lead frame with the light emitting diode chips mounted thereon, and a second lead frame disposed at a predetermined interval from the first lead frame. The LED package also includes a package body fixing the first and second lead frames and bonding wires for electrically connecting the plurality of LED chips. The package body includes at least one first reflecting part separately surrounding each of the plurality of LED chips with upward-inclined inner side walls thereof and a second reflecting part surrounding the entire plurality of LED chips with an upward-inclined inner side wall thereof.

摘要翻译： 一种高功率发光二极管（LED）封装及其制造方法。 根据本发明的大功率LED封装包括多个发光二极管芯片，其上安装有发光二极管芯片的第一引线框架和从第一引线框架以预定间隔设置的第二引线框架。 LED封装还包括固定第一和第二引线框架以及用于电连接多个LED芯片的接合线的封装体。 封装体包括至少一个第一反射部分，其分别围绕多个LED芯片中的每一个具有向上倾斜的内侧壁，以及围绕整个多个LED芯片的第二反射部分，其具有向上倾斜的内侧壁。

公开(公告)号：US20080233666A1

公开(公告)日：2008-09-25

申请号：US12153719

申请日：2008-05-23

申请人： Jung Kyu Park ,  Seon Goo Lee ,  Kyung Taeg Han ,  Seong Yeon Han

发明人： Jung Kyu Park ,  Seon Goo Lee ,  Kyung Taeg Han ,  Seong Yeon Han

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L24/97 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention relates to an LED package having a metal reflective layer for focusing and emitting light through a side of the package, and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, a light emitting diode chip disposed on the substrate, and an encapsulant covering the LED chip and the substrate to protect the LED chip. The LED package also includes a metal reflective layer surrounding side surfaces of the encapsulant to form a light transmitting surface on a top surface of the encapsulant. The invention minimizes light loss, improves luminance, can be mass-produced as a PCB type, and adopts EMC transfer molding to minimize irregular color distribution, thereby improving optical quality.

摘要翻译： 本发明涉及一种具有用于聚焦并通过封装侧发光的金属反射层的LED封装及其制造方法。 LED封装包括其上形成有电极的基板，设置在基板上的发光二极管芯片以及覆盖LED芯片和基板的密封剂以保护LED芯片。 LED封装还包括围绕密封剂的侧表面的金属反射层，以在密封剂的顶表面上形成透光表面。 本发明使光损失最小化，亮度提高，可以作为PCB类型批量生产，并采用EMC传递模塑，以减少不规则的颜色分布，从而提高光学质量。

公开(公告)号：US07190587B2

公开(公告)日：2007-03-13

申请号：US10995508

申请日：2004-11-24

申请人： Joong El Kim ,  Alexander T. Kynin ,  Jung Kyu Park ,  Si Young Yang

发明人： Joong El Kim ,  Alexander T. Kynin ,  Jung Kyu Park ,  Si Young Yang

IPC分类号： H05K7/20 ,  H01J17/28 ,  F28F13/16

CPC分类号： H05K7/20972 ,  H05K7/20172

摘要： Disclosed herein is a fanless high-efficiency cooling device that is applicable to electronic products having heat sources, such as plasma display panel (PDP) televisions, liquid crystal display (LCD) televisions, and liquid crystal display (LCD) monitors. The fanless high-efficiency cooling device using ion wind comprises a heat sink having a fixing part fixedly attached to a heat-generating part of an electronic product and a plurality of protrusions extending a predetermined height from a bottom surface of the fixing part, a cover that covers the upper part of the heat sink, at least one electric wire for generating ion wind between the corresponding protrusions when high voltage is applied to the electric wire, an electric wire-supporting member that supports both ends of the electric wire, and a power supply that connects a high-voltage terminal to the electric wire and connects a ground terminal to the heat sink to supply high voltage to the electric wire.

摘要翻译： 这里公开了一种无风扇式高效率冷却装置，其适用于具有等离子体显示面板（PDP）电视机，液晶显示器（LCD）电视机，液晶显示器（LCD））监视器等热源的电子产品。 使用离子风的无风扇式高效冷却装置包括：散热器，其具有固定部，固定部固定在电子产品的发热部上;多个突出部，其从固定部的底面延伸规定的高度;盖 覆盖散热器的上部的至少一个电线，当对电线施加高压时，至少一根电线用于在相应的突起之间产生离子风;支撑电线的两端的电线支撑件，以及 电源，其将高压端子与电线连接，并将接地端子连接到散热器，以向电线提供高电压。