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公开(公告)号：US09913370B2
公开(公告)日：2018-03-06
申请号：US15154077
申请日：2016-05-13
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. Busby , Silvio Dragone , Michael J. Fisher , Michael A. Gaynes , David C. Long , Kenneth P. Rodbell , William Santiago-Fernandez , Thomas Weiss
CPC classification number: H05K1/0275 , G06F21/87 , H05K1/181 , H05K1/185 , H05K5/0208 , H05K2201/10151 , H05K2201/10371
Abstract: Tamper-proof electronic packages and fabrication methods are provided which include a glass enclosure enclosing, at least in part, at least one electronic component within a secure volume, and a tamper-respondent detector. The glass enclosure includes stressed glass with a compressively-stressed surface layer, and the tamper-respondent detector monitors, at least in part, the stressed glass to facilitate defining the secure volume. The stressed glass fragments with an attempted intrusion event through the stressed glass, and the tamper-respondent detector detects the fragmenting of the stressed glass. In certain embodiments, the stressed glass may be a machined glass enclosure that has undergone ion-exchange processing, and the compressively-stressed surface layer of the stressed glass may be compressively-stressed to ensure that the stressed glass fragments into glass particles of fragmentation size less than 1000 μm with the intrusion event.
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公开(公告)号：US09717154B2
公开(公告)日：2017-07-25
申请号：US15409851
申请日：2017-01-19
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. Brodsky , John R. Dangler , Zachary T. Dreiss , David C. Long , Michael T. Peets , William Santiago-Fernandez , Thomas Weiss
CPC classification number: H05K5/0247 , G06F1/00 , H05K5/0208 , H05K13/00
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include an electronic enclosure and a tamper-respondent electronic circuit structure. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner main surface, and an inner sidewall surface which has at least one inner-sidewall corner. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner sidewall surface of the electronic enclosure. The tamper-respondent sensor includes a flexible layer(s) with tamper-detect circuit lines and multiple slots provided therein. The multiple slots facilitate disposing the tamper-respondent sensor to cover the at least one inner-sidewall corner of the inner sidewall surface by allowing for one or more regions of overlap of the flexible layer(s) of the tamper-respondent sensor at the at least one inner-sidewall corner of the electronic enclosure.
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公开(公告)号：US11083082B2
公开(公告)日：2021-08-03
申请号：US16567034
申请日：2019-09-11
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Kathleen Ann Fadden , James A. Busby , David C. Long , John R. Dangler , Alexandra Echegaray , Michael J. Fisher , William Santiago-Fernandez
Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure-to-circuit board protection. The tamper-respondent assemblies include a circuit board, and an enclosure mounted to the circuit board along an enclosure-to-board interface. The enclosure facilitates enclosing at least one electronic component coupled to the circuit board within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and includes one or more tamper-detect circuits including at least one conductive trace disposed, at least in part, within the enclosure-to-board interface. The conductive trace(s) includes stress rise regions to facilitate tamper-detection at the enclosure-to-board interface. An adhesive is provided to secure the enclosure to the circuit board. The adhesive contacts, at least in part, the conductive trace(s) of the tamper-detect circuit(s) at the enclosure-to-board interface, including at the stress rise regions of the conductive trace(s).
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公开(公告)号：US10798816B1
公开(公告)日：2020-10-06
申请号：US16747075
申请日：2020-01-20
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. Busby , Arthur J. Higby , David C. Long , Michael J. Fisher , Russell A. Budd , Michel Turgeon , Sylvain Tetreault
Abstract: Tamper-respondent assemblies are provided which include an enclosure with an edge surface, and a tamper-respondent sensor. The tamper-respondent sensor covers, at least in part, the edge surface and an inner surface of the enclosure. The sensor includes at least one tamper-detect circuit. The tamper-detect circuit(s) includes a conductive trace(s) in a tamper-detect pattern. The tamper-respondent sensor includes exposed regions and unexposed regions of the conductive trace(s) at the edge surface of the enclosure to facilitate an adhesive directly contacting the at least one conductive trace in the exposed regions.
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公开(公告)号：US20200187367A1
公开(公告)日：2020-06-11
申请号：US16792233
申请日：2020-02-15
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Arthur Higby , James Busby , David C. Long , Robert Weiss , Michael Fisher , Tristen Gaudette
Abstract: A process for deforming a flex circuit using a fixture assembly including a base plate having a recess, a wrinkle reducer plate, a stiffening block and a punch. The process including heating the fixture assembly; applying a force to the punch deforming the flex circuit into the recess in the base plate; holding the punch in contact with the flex circuit while heating the fixture assembly; cooling the fixture assembly with the punch in contact with the flex circuit; subsequent to cooling the fixture assembly, removing the force of the punch; and removing the flex circuit from the fixture assembly. The flex circuit having a recessed portion resulting from deforming the flex circuit into the recess in the base plate and a flat portion surrounding the recessed portion.
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Patent Agency Ranking
公开(公告)号：US10575398B2
公开(公告)日：2020-02-25
申请号：US15810295
申请日：2017-11-13
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. Busby , John R. Dangler , Michael J. Fisher , David C. Long
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). In addition, the tamper-respondent sensor(s) includes at least one interconnect element associated with one or more conductive lines of the conductive lines forming, at least in part, the tamper-detect network(s). The interconnect element(s) includes at least one interconnect characteristic selected to facilitate obscuring a circuit lay of the at least one tamper-detect network. In operation, the detector monitors the tamper-detect network(s) of the tamper-respondent sensor(s) for a tamper event.
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公开(公告)号：US10257924B2
公开(公告)日：2019-04-09
申请号：US15831534
申请日：2017-12-05
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. Busby , Silvio Dragone , Michael J. Fisher , Michael A. Gaynes , David C. Long , Kenneth P. Rodbell , William Santiago-Fernandez , Thomas Weiss
Abstract: Tamper-proof electronic packages and fabrication methods are provided which include a glass enclosure enclosing, at least in part, at least one electronic component within a secure volume, and a tamper-respondent detector. The glass enclosure includes stressed glass with a compressively-stressed surface layer, and the tamper-respondent detector monitors, at least in part, the stressed glass to facilitate defining the secure volume. The stressed glass fragments with an attempted intrusion event through the stressed glass, and the tamper-respondent detector detects the fragmenting of the stressed glass. In certain embodiments, the stressed glass may be a machined glass enclosure that has undergone ion-exchange processing, and the compressively-stressed surface layer of the stressed glass may be compressively-stressed to ensure that the stressed glass fragments into glass particles of fragmentation size less than 1000 μm with the intrusion event.
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公开(公告)号：US10242931B2
公开(公告)日：2019-03-26
申请号：US14936902
申请日：2015-11-10
Applicant: International Business Machines Corporation
Inventor： Raschid J. Bezama , David C. Long , Govindarajan Natarajan , Thomas Weiss
IPC: F28F7/00 , H01L23/473 , F28D15/00 , H01L23/373 , F28F13/00
Abstract: A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.
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公开(公告)号：US09936573B2
公开(公告)日：2018-04-03
申请号：US14941887
申请日：2015-11-16
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. Brodsky , James A. Busby , Phillip Duane Isaacs , David C. Long
CPC classification number: H05K1/0275 , H05K1/0298 , H05K1/034 , H05K1/09 , H05K1/183 , H05K3/12 , H05K3/30 , H05K3/301 , H05K3/46 , H05K5/0208 , H05K7/023 , H05K2201/015 , H05K2201/05 , H05K2201/055 , H05K2201/056
Abstract: Methods of fabricating tamper-respondent assemblies are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl≤200 μm, as well as a line-to-line spacing width Ws≤200 μm. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.
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公开(公告)号：US09924591B2
公开(公告)日：2018-03-20
申请号：US14865632
申请日：2015-09-25
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. Brodsky , James A. Busby , Phillip Duane Isaacs , David C. Long
CPC classification number: H05K1/0275 , H05K1/0298 , H05K1/034 , H05K1/09 , H05K1/183 , H05K3/12 , H05K3/30 , H05K3/301 , H05K3/46 , H05K5/0208 , H05K7/023 , H05K2201/015 , H05K2201/05 , H05K2201/055 , H05K2201/056
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl≦200 μm, as well as a line-to-line spacing width Ws≦200 μm. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.
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