公开(公告)号：US07511347B2

公开(公告)日：2009-03-31

申请号：US11281743

申请日：2005-11-18

申请人： Kazuhiko Kajigaya ,  Kanji Otsuka

发明人： Kazuhiko Kajigaya ,  Kanji Otsuka

IPC分类号： H01L27/092

CPC分类号： G11C7/1051 ,  G11C7/1057 ,  H01L27/092

摘要： A semiconductor integrated circuit comprising: a pair of MOS transistors which are formed in a same well on a semiconductor substrate and arranged adjacent to each other with a distance such that charge exchange between capacitances of respective drain diffusion layers is possible; and a wiring structure which is formed to apply differential signals to respective gates of the pair of MOS transistors and to apply a common potential to respective sources of the pair of MOS transistors.

摘要翻译： 一种半导体集成电路，包括：一对MOS晶体管，其形成在半导体衬底上的相同阱中并且彼此相邻布置，使得可以使各个漏极扩散层的电容之间的电荷交换成为可能; 以及布线结构，其被形成为将差分信号施加到所述一对MOS晶体管的各个栅极，并向所述一对MOS晶体管的各个源施加公共电位。

公开(公告)号：US07190188B2

公开(公告)日：2007-03-13

申请号：US10898874

申请日：2004-07-26

申请人： Kanji Otsuka ,  Tamotsu Usami

发明人： Kanji Otsuka ,  Tamotsu Usami

IPC分类号： H03K17/16 ,  H03K19/003

CPC分类号： H04L25/08 ,  H03K17/04106

摘要： To transmit a high-speed digital signal of several tens GHz via a differential line by connecting a differential line referring to the ground to differential lines not referring to the ground, there is provided a signal transmission system which transmits a digital signal between circuit blocks via a signal transmission line, each of the circuit blocks basically including a functional circuit, a reception/transmission circuit formed separately from the functional circuit and an impedance-matched transmission line (115) formed between reception and transmission ends of the reception/transmission circuit; a differential line (105) referring to the ground (110), led out from a differential output driver, being formed from differential signal lines disposed symmetrically with respect to the ground (110) in the circuit block, only differential pair lines (111, 112) not referring to the ground being extended directly from the differential signal lines disposed symmetrically with respect to the ground in the signal transmission line (115).

摘要翻译： 通过将差分线连接到不涉及地面的差分线，通过差分线路传输数十GHz的高速数字信号，提供了一种信号传输系统，其通过电路块之间的数字信号经由 信号传输线，每个电路块基本上包括功能电路，与功能电路分开形成的接收/发送电路和形成在接收/发送电路的接收和发送端之间的阻抗匹配传输线路（115）; 从差分输出驱动器引出的对地（110）的差分线（105）由相对于电路块中的接地（110）对称设置的差分信号线形成，仅差分对线（111， 112），而不是直接从在信号传输线路（115）中相对于地面对称设置的差动信号线延伸的地面。

公开(公告)号：US20060108640A1

公开(公告)日：2006-05-25

申请号：US11281743

申请日：2005-11-18

申请人： Kazuhiko Kajigaya ,  Kanji Otsuka

发明人： Kazuhiko Kajigaya ,  Kanji Otsuka

IPC分类号： H01L29/94

CPC分类号： G11C7/1051 ,  G11C7/1057 ,  H01L27/092

摘要： A semiconductor integrated circuit comprising: a pair of MOS transistors which are formed in a same well on a semiconductor substrate and arranged adjacent to each other with a distance such that charge exchange between capacitances of respective drain diffusion layers is possible; and a wiring structure which is formed to apply differential signals to respective gates of the pair of MOS transistors and to apply a common potential to respective sources of the pair of MOS transistors.

摘要翻译： 一种半导体集成电路，包括：一对MOS晶体管，其形成在半导体衬底上的相同阱中并且彼此相邻布置，使得可以使各个漏极扩散层的电容之间的电荷交换成为可能; 以及布线结构，其被形成为将差分信号施加到所述一对MOS晶体管的各个栅极，并向所述一对MOS晶体管的各个源施加公共电位。

公开(公告)号：US06670830B2

公开(公告)日：2003-12-30

申请号：US09761583

申请日：2001-01-18

申请人： Kanji Otsuka ,  Tamotsu Usami

发明人： Kanji Otsuka ,  Tamotsu Usami

IPC分类号： H03K190175

CPC分类号： G06F13/4072 ,  Y02D10/14 ,  Y02D10/151

摘要： A signal transmission bus system has a transmission line pair on which binary data values are indicated by the presence and absence of a complementary signal. A driver circuit opens and closes a current path that supplies the complementary signal to the transmission line pair. When this path is opened, the driver circuit closes a bypass current path, so that the driver circuit behaves as a direct-current circuit and does not generate power-supply and ground noise. A receiver that senses the presence and absence of the complementary signal on the transmission line pair includes a differential amplifier and a termination transistor coupled across the input terminals of the differential amplifier, to discharge the input capacitance of the differential amplifier so that high-speed signals can be sensed rapidly.

摘要翻译： 信号传输总线系统具有传输线对，二进制数据值由互补信号的存在和不存在指示。 驱动器电路打开和闭合将补充信号提供给传输线对的电流路径。 当该路径被打开时，驱动器电路关闭旁路电流路径，使得驱动电路作为直流电路，并且不产生电源和接地噪声。 感测传输线对上的互补信号的存在和不存在的接收机包括耦合在差分放大器的输入端上的差分放大器和终端晶体管，以对差分放大器的输入电容进行放电，使得高速信号 可以快速感测。

公开(公告)号：US5358032A

公开(公告)日：1994-10-25

申请号：US13423

申请日：1993-02-04

申请人： Masatsugu Arai ,  Akiomi Kohno ,  Toshio Hatada ,  Yoshihiro Kondo ,  Toshihiro Komatsu ,  Kanji Otsuka ,  Yuji Shirai ,  Susumu Iwai

发明人： Masatsugu Arai ,  Akiomi Kohno ,  Toshio Hatada ,  Yoshihiro Kondo ,  Toshihiro Komatsu ,  Kanji Otsuka ,  Yuji Shirai ,  Susumu Iwai

IPC分类号： H01L23/36 ,  F28F3/02 ,  H01L23/367 ,  H01L23/467 ,  F28F7/00

CPC分类号： F28F3/022 ,  H01L23/3677 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/49 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/16195

摘要： Disclosed is an LSI package cooling heat sink having a heat diffusion plate and thin wire fins joined to the heat diffusion plate. The heat sink is mounted on an LSI package and the LSI package is cooled by the flowing of fluid through the thin wire fins. The wire fins are made of a net formed of longitudinal thin wires intersecting with horizontal thin wires. The net is formed to continuous rectangular shapes or a swirl shape and joined to the heat diffusion plate. The net is constituted so that the number of the thin wires vertical to the heat diffusion plate is larger than the number of the thin wires parallel thereto and the net is joined to the heat diffusion plate by brazing, diffusion joint, pressure welding or the like. Since the heat sink is formed of the net composed of the longitudinal thin wires intersecting with the horizontal thin wires, the irregular portions of the adjacent thin wires are formed at a dislocated position and fluid striking against the thin wires produces many turbulent flows so that a high heat transfer performance can be obtained. Further, since the net formed of the thin wires is used, the size of cooling fins can be reduced and noise can be also lowered. Further, it is possible to produce an LSI package cooling heat sink in a short time which heat sink is excellent in mass-production.

摘要翻译： 公开了具有热扩散板的LSI封装冷却散热器和与散热板接合的细线散热片。 散热器安装在LSI封装上，并且LSI封装通过流体流过细金属丝散热片来冷却。 金属丝散热片由与水平细线相交的纵向细线形成的网构成。 网形成为连续的矩形形状或漩涡形状并且连接到热扩散板。 网构成为与散热板垂直的细线的数量大于与其平行的细线的数量，并且网通过钎焊，扩散接头，压焊等连接到热扩散板 。 由于散热器由与横向细线相交的纵向细线组成的网形成，所以相邻细线的不规则部分形成在脱位位置，并且撞击细线的流体产生许多湍流，使得 可以获得高的传热性能。 此外，由于使用由细线形成的网，所以能够降低散热片的尺寸，降低噪音。 此外，可以在短时间内制造LSI封装冷却散热器，散热器的批量生产性优异。

公开(公告)号：US5188280A

公开(公告)日：1993-02-23

申请号：US812024

申请日：1991-12-23

申请人： Takashi Nakao ,  Yoshiaki Emoto ,  Koichiro Sekiguchi ,  Masayuki Iketani ,  Kunizo Sahara ,  Ikuo Yoshida ,  Akiomi Kohno ,  Masaya Horino ,  Hideaki Kamohara ,  Shouichi Irie ,  Hiroshi Akasaki ,  Kanji Otsuka

发明人： Takashi Nakao ,  Yoshiaki Emoto ,  Koichiro Sekiguchi ,  Masayuki Iketani ,  Kunizo Sahara ,  Ikuo Yoshida ,  Akiomi Kohno ,  Masaya Horino ,  Hideaki Kamohara ,  Shouichi Irie ,  Hiroshi Akasaki ,  Kanji Otsuka

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/055 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L24/81 ,  H01L21/4853 ,  H01L23/055 ,  H01L23/49816 ,  H05K3/3478 ,  H01L2224/11003 ,  H01L2224/13111 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/166 ,  H05K2203/0113 ,  H05K2203/016 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K3/3489

摘要： A technique for producing a chip mount type package or a TAB package with high reliability, without use of a flux which would cause environmental pollution or would hinder an enhancement of reliability, more particularly pertains to a method of irradiating bonding surfaces, for which a solder is used, and solder bump electrodes of a package with an atomic or ion energy beam, and bonding the bonding surfaces to each other under normal pressure (about 1 atm) in a continuous apparatus.

摘要翻译： 具有高可靠性的芯片安装型封装或TAB封装的生产技术，不使用会导致环境污染或阻碍可靠性提高的焊剂，更具体地涉及一种照射焊接面的方法，焊接面 以及具有原子或离子能量束的封装的焊料凸块电极，并且在连续设备中在常压（约1atm）下将结合表面彼此粘合。

公开(公告)号：US5090609A

公开(公告)日：1992-02-25

申请号：US514943

申请日：1990-04-26

申请人： Takashi Nakao ,  Yoshiaki Emoto ,  Koichiro Sekiguchi ,  Masayuki Iketani ,  Kunizo Sahara ,  Ikuo Yoshida ,  Akiomi Kohno ,  Masaya Horino ,  Hideaki Kamohara ,  Shouichi Irie ,  Hiroshi Akasaki ,  Kanji Otsuka

发明人： Takashi Nakao ,  Yoshiaki Emoto ,  Koichiro Sekiguchi ,  Masayuki Iketani ,  Kunizo Sahara ,  Ikuo Yoshida ,  Akiomi Kohno ,  Masaya Horino ,  Hideaki Kamohara ,  Shouichi Irie ,  Hiroshi Akasaki ,  Kanji Otsuka

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/055 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L24/81 ,  H01L21/4853 ,  H01L23/055 ,  H01L23/49816 ,  H05K3/3478 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13111 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/166 ,  H05K2203/0113 ,  H05K2203/016 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K3/3489

摘要： An invention relating to a technique for producing a chip mount type package or a TAB package with high reliability, without use of a flux which would cause environmental pollution or would hinder an enhancement of reliability, and more particularly pertaining to a method of irradiating bonding surfaces, for which a solder is used, and solder bump electrodes of a package with an atomic or ion energy beam and bonding the bonding surfaces to each other under normal pressure (about 1 atm) in a continuous apparatus.

摘要翻译： 本发明涉及一种具有高可靠性的芯片安装型封装或TAB封装的生产技术，而不使用会引起环境污染或阻碍可靠性提高的焊剂，更具体地涉及一种照射焊接表面的方法 ，以及具有原子或离子能量束的封装的焊料凸块电极，并且在连续设备中在常压（约1atm）下将结合表面彼此粘合。

公开(公告)号：US4943843A

公开(公告)日：1990-07-24

申请号：US445942

申请日：1989-12-08

申请人： Takayuki Okinaga ,  Hiroshi Tachi ,  Hiroshi Ozaki ,  Kanji Otsuka ,  Michiaki Furukawa ,  Yasuyuki Yamasaki

发明人： Takayuki Okinaga ,  Hiroshi Tachi ,  Hiroshi Ozaki ,  Kanji Otsuka ,  Michiaki Furukawa ,  Yasuyuki Yamasaki

IPC分类号： H01L21/52 ,  H01L21/58 ,  H01L23/28 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50

CPC分类号： H01L24/32 ,  H01L23/4951 ,  H01L23/49558 ,  H01L23/49586 ,  H01L23/49861 ,  H01L2224/05554 ,  H01L2224/27013 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/14 ,  H01L2924/181 ,  Y10S257/906

摘要： According to the present invention, as improvement in the adhesion of inner leads with a packaging resin in a resin-sealed semiconductor device is attained by spreading leads on or near the circuit-forming face of a pellet, or on or near the main non-circuit-forming face of the pellet to extend the lengths of the inner leads on or under the pellet.

摘要翻译： 根据本发明，通过在芯片的电路形成面上或靠近主非易失性存储器的电路形成面上或其附近扩散引线，可以实现在树脂密封半导体器件中内封装树脂与内包层树脂的密合性的提高， 颗粒的电路形成面，以延伸颗粒上或下方的内引线的长度。

公开(公告)号：US4729010A

公开(公告)日：1988-03-01

申请号：US890533

申请日：1986-07-30

申请人： Masatoshi Tsuchiya ,  Satoru Ogihara ,  Hiromi Kagohara ,  Kanji Otsuka ,  Tomoji Oishi

发明人： Masatoshi Tsuchiya ,  Satoru Ogihara ,  Hiromi Kagohara ,  Kanji Otsuka ,  Tomoji Oishi

IPC分类号： H01L23/057 ,  H01L23/10 ,  H01L23/15 ,  H01L23/495 ,  H01L25/065 ,  H01L23/14

CPC分类号： H01L23/057 ,  H01L23/10 ,  H01L23/15 ,  H01L23/49579 ,  H01L25/0655 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01025 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/16152 ,  Y10S428/901

摘要： An integrated circuit package in which semiconductor elements mounted on an insulating substrate, ends of lead pieces introduced from the outside and wires that electrically connect them, are accommodated in a cell that is air-tightly defined by the substrate, a cap and a sealing glass. The lead pieces are composed of an alloy having a coefficient of thermal expansion nearly equal to, or smaller than, the coefficient of thermal expansion of the substrate. The alloy is an iron alloy which contains nickel and cobalt, and having a martensite transformation temperture of lower than -55.degree. C.

摘要翻译： 一种集成电路封装，其中安装在绝缘基板上的半导体元件，从外部引入的引线片的端部和与其电连接的导线被容纳在由基板，盖和密封玻璃气密地限定的电池中 。 引线片由热膨胀系数几乎等于或小于衬底的热膨胀系数的合金构成。 该合金是含镍和钴的马氏体相变温度低于-55℃的铁合金。

公开(公告)号：US08496044B2

公开(公告)日：2013-07-30

申请号：US12934403

申请日：2009-03-25

申请人： Yoshihiro Seimiya ,  Kanji Otsuka ,  Ai Mizuno

发明人： Yoshihiro Seimiya ,  Kanji Otsuka ,  Ai Mizuno

IPC分类号： B22D27/00 ,  C22B21/00

CPC分类号： B21J5/00 ,  B21J5/004 ,  B22D17/007 ,  B22D18/02 ,  B22F1/02 ,  B22F3/17 ,  B22F3/225 ,  B22F2998/10 ,  B22F2999/00 ,  C22C1/056 ,  C22C1/1078 ,  C22C32/0068 ,  B22F1/0003 ,  C22C1/1036 ,  B22F2201/02

摘要： A method of manufacturing a massive mixture of aluminum nitride and aluminum includes a first heat treatment process of manufacturing the massive mixture of aluminum nitride and aluminum by heating aluminum powder (21) and aluminum pieces (20) inserted into a vessel (13) at a temperature of a melting point of aluminum or higher under a nitrogen atmosphere. An oxide film is formed over the surface of the aluminum powder (21). The oxide film is, for example, a natural oxide film. The weight ratio of the aluminum powder (21) to the aluminum pieces (20) is, for example, 0.1 or less.

摘要翻译： 一种制造氮化铝和铝的大块混合物的方法包括通过加热铝粉（21）和插入容器（13）中的铝片（20）来制造氮化铝和铝的块状混合物的第一热处理工艺， 在氮气氛下的铝的熔点以上的温度。 在铝粉末（21）的表面上形成氧化膜。 氧化膜例如是天然氧化膜。 铝粉末（21）与铝片（20）的重量比例如为0.1以下。