公开(公告)号：US07930092B2

公开(公告)日：2011-04-19

申请号：US12200683

申请日：2008-08-28

申请人： Kazuhito Tokugawa ,  Shinichi Ishikawa ,  Tomoo Shimokawa ,  Katsuaki Wachi ,  Satoshi Chida ,  Hiroyuki Utsumi ,  Takayuki Aoki

发明人： Kazuhito Tokugawa ,  Shinichi Ishikawa ,  Tomoo Shimokawa ,  Katsuaki Wachi ,  Satoshi Chida ,  Hiroyuki Utsumi ,  Takayuki Aoki

IPC分类号： B60T7/12

CPC分类号： F02P1/086 ,  F02D37/02 ,  F02D41/009 ,  F02D41/062 ,  F02D41/3082 ,  F02D2041/2013 ,  F02N3/04 ,  F02N11/0862 ,  F02N2250/02 ,  F02P7/067 ,  F02P15/00

摘要： A control apparatus for an internal combustion engine, includes: a fuel injection unit; an ignition unit; a crank angle detection unit; a fuel pump; a booster unit; an ignition discharge unit; and a control unit that controls the fuel injection unit, the ignition unit, and the fuel pump, that ascertains ignition timings based on crank signals output from the crank angle detection unit, and that performs a startup control sequence that is made up of fuel injection processing, voltage boosting processing, ignition processing, and fuel supply processing.

摘要翻译： 一种用于内燃机的控制装置，包括：燃料喷射单元; 点火单元; 曲柄角检测单元; 燃油泵 增压机组; 点火放电单元; 以及控制单元，其控制燃料喷射单元，点火单元和燃料泵，其基于从曲柄角检测单元输出的曲柄信号确定点火正时，并且执行由燃料喷射构成的启动控制序列 处理，升压处理，点火处理和燃料供应处理。

公开(公告)号：US07898094B2

公开(公告)日：2011-03-01

申请号：US11699370

申请日：2007-01-30

申请人： Shoichi Osada ,  Takayuki Aoki

发明人： Shoichi Osada ,  Takayuki Aoki

IPC分类号： H01L23/29 ,  C08L63/00 ,  B32B27/38

CPC分类号： C08G59/38 ,  C08G59/621 ,  C08L63/00 ,  H01L23/293 ,  H01L23/295 ,  H01L2924/0002 ,  H01L2924/00

摘要： An epoxy resin composition comprising: (A) an epoxy resin having at least three epoxy groups per molecule and an epoxy equivalent of 170 or lower; (B) an epoxy resin having a phenolic nucleus and two epoxy groups in such an amount that a weight ratio of the epoxy resin (B) to the epoxy resin (A) ranges from 35/65 to 65/35; (C) a phenolic curing agent in such an amount that a molar ratio of phenolic hydroxyl groups to the whole epoxy groups in the composition ranges from 0.5 to 1.5; and (D) an inorganic filler in an amount of from 86 to 92 wt %, based on a total weight of the composition. The composition provides encapsulated semiconductor devices much less warped than those encapsulated with a conventional composition.

摘要翻译： 一种环氧树脂组合物，其包含：（A）每分子具有至少三个环氧基并且环氧当量为170或更低的环氧树脂; （B）环氧树脂（B）与环氧树脂（A）的重量比为35/65〜65/35的环氧树脂，其具有酚核和两个环氧基， （C）酚醛固化剂的用量使酚羟基与组合物中整个环氧基的摩尔比为0.5-1.5; 和（D）基于组合物总重量的86至92重量％的无机填料。 该组合物提供的封装半导体器件比用常规组合物封装的封装半导体器件弯曲得少得多。

公开(公告)号：US20100104794A1

公开(公告)日：2010-04-29

申请号：US11997831

申请日：2006-07-28

申请人： Takayuki Aoki ,  Toshio Shiobara

发明人： Takayuki Aoki ,  Toshio Shiobara

IPC分类号： B32B1/06 ,  C08L63/10 ,  C08G69/00 ,  C08G59/20

CPC分类号： C08G59/42 ,  C08G59/3245 ,  C08L63/00 ,  H01L23/293 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12044 ,  Y10T428/239 ,  H01L2924/00014 ,  H01L2924/00

摘要： A thermosetting epoxy resin composition characterized by containing as a resin ingredient a product of pulverization of a solid matter obtained by reacting a triazine derivative/epoxy resin with an acid anhydride in such a proportion that the amount of the epoxy groups is 0.6-2.0 equivalents to the acid anhydride groups.

摘要翻译： 一种热固性环氧树脂组合物，其特征在于，作为树脂成分含有将三嗪衍生物/环氧树脂与酸酐反应得到的固体成分与环氧基的量为0.6〜2.0当量的比例相对于 酸酐基团。

公开(公告)号：US20090322046A1

公开(公告)日：2009-12-31

申请号：US12490670

申请日：2009-06-24

申请人： Tadafumi Hirose ,  Masanori Shin ,  Makoto Uchimi ,  Takayuki Aoki

发明人： Tadafumi Hirose ,  Masanori Shin ,  Makoto Uchimi ,  Takayuki Aoki

IPC分类号： B62B1/20

CPC分类号： F02B63/04 ,  F02B63/047

摘要： An engine generator movable on left and right wheels. The wheels are provided on a rear section of a bottom cover via an axle. A cylinder of an engine is disposed so as to incline upwards towards the direction of the axle. Inclining the cylinder lowers the center of gravity of the engine and disposes the axle positioned below the cylinder at a high position, thereby reducing the height of the engine generator. The orientation of the engine generator during travel is stabilized.

摘要翻译： 可在左右车轮上移动的发动机发电机。 车轮通过车轴设置在底盖的后部。 发动机的气缸被设置成朝向轴的方向向上倾斜。 气缸倾斜降低发动机的重心，将位于气缸下方的轴部置于高位置，从而降低发动机发电机的高度。 行驶过程中发动机发电机的方向稳定。

公开(公告)号：US20090149559A1

公开(公告)日：2009-06-11

申请号：US12089600

申请日：2006-11-16

申请人： Toshiaki Masuda ,  Ichiro Takahara ,  Kenichi Kitano ,  Katsushi Miki ,  Takeshi Inohara ,  Takeyoshi Fukuda ,  Takayuki Aoki ,  Satoshi Kawanami

发明人： Toshiaki Masuda ,  Ichiro Takahara ,  Kenichi Kitano ,  Katsushi Miki ,  Takeshi Inohara ,  Takeyoshi Fukuda ,  Takayuki Aoki ,  Satoshi Kawanami

IPC分类号： C08J9/228 ,  C08J9/00

CPC分类号： B01J13/14 ,  C08F220/14 ,  C08F220/44 ,  C08F220/48 ,  C08F222/1006 ,  Y10T428/2984

摘要： Heat-expandable microspheres include a shell of thermoplastic resin and a blowing agent encapsulated therein having a boiling point not higher than the softening point of the thermoplastic resin, have a maximum expanding ratio not lower than 50 times, and are thermally expanded into hollow particulates having a repeated-compression durability not lower than 75 percent. The method of producing the heat-expandable microspheres includes the steps of dispersing an oily mixture containing a polymerizable component and the blowing agent in an aqueous dispersing medium containing a specific water-soluble compound and polymerizing the polymerizable component contained in the oily mixture.

摘要翻译： 热膨胀性微球包括热塑性树脂的壳和其中包含沸点不高于热塑性树脂的软化点的发泡剂，其最大膨胀比不低于50倍，并且被热膨胀成具有 重复压缩耐久性不低于75％。 制造热膨胀性微球的方法包括以下步骤：将含有可聚合组分和发泡剂的油性混合物分散在含有特定水溶性化合物的水性分散介质中，并使包含在油性混合物中的可聚合组分聚合。

公开(公告)号：US20070179259A1

公开(公告)日：2007-08-02

申请号：US11699370

申请日：2007-01-30

申请人： Shoichi Osada ,  Takayuki Aoki

发明人： Shoichi Osada ,  Takayuki Aoki

IPC分类号： C08L63/02

CPC分类号： C08G59/38 ,  C08G59/621 ,  C08L63/00 ,  H01L23/293 ,  H01L23/295 ,  H01L2924/0002 ,  H01L2924/00

摘要： An epoxy resin composition comprising: (A) an epoxy resin having at least three epoxy groups per molecule and an epoxy equivalent of 170 or lower; (B) an epoxy resin having a phenolic nucleus and two epoxy groups in such an amount that a weight ratio of the epoxy resin (B) to the epoxy resin (A) ranges from 35/65 to 65/35; (C) a phenolic curing agent in such an amount that a molar ratio of phenolic hydroxyl groups to the whole epoxy groups in the composition ranges from 0.5 to 1.5; and (D) an inorganic filler in an amount of from 86 to 92 wt %, based on a total weight of the composition. The composition provides encapsulated semiconductor devices much less warped than those encapsulated with a conventional composition.

摘要翻译： 一种环氧树脂组合物，其包含：（A）每分子具有至少三个环氧基并且环氧当量为170或更低的环氧树脂; （B）环氧树脂（B）与环氧树脂（A）的重量比为35/65〜65/35的环氧树脂，其具有酚核和两个环氧基， （C）酚醛固化剂的用量使酚羟基与组合物中整个环氧基的摩尔比为0.5-1.5; 和（D）基于组合物总重量的86至92重量％的无机填料。 该组合物提供的封装半导体器件比用常规组合物封装的封装半导体器件弯曲得少得多。

公开(公告)号：US20060216519A1

公开(公告)日：2006-09-28

申请号：US11386667

申请日：2006-03-23

申请人： Yasuo Kimura ,  Eiichi Asano ,  Toshio Shiobara ,  Takayuki Aoki

发明人： Yasuo Kimura ,  Eiichi Asano ,  Toshio Shiobara ,  Takayuki Aoki

IPC分类号： B32B27/38 ,  H01L21/56 ,  C08L63/00 ,  C08G59/00

CPC分类号： H01L23/293 ,  C08G59/245 ,  C08G59/3218 ,  C08G59/621 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/31511 ,  C08L2666/16 ,  H01L2924/00

摘要： An epoxy resin composition comprising (A) at least one epoxy resin comprising (a) a naphthalene ring-containing epoxy resin having at least one substituted or unsubstituted naphthalene ring in a molecule and having an epoxy equivalent of 175 to 210, (B) a phenolic resin having at least one substituted or unsubstituted naphthalene ring in a molecule, and (C) an inorganic filler, the substituted or unsubstituted naphthalene ring of the epoxy resin (a) being contained in an amount of 45 to 60% by weight in the total amount of the epoxy resin (A) is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.

摘要翻译： 一种环氧树脂组合物，其包含（A）至少一种环氧树脂，其包含（a）在分子中具有至少一个取代或未取代的萘环并且具有175至210的环氧当量的含萘环的环氧树脂，（B） 在分子中具有至少一个取代或未取代的萘环的酚醛树脂和（C）无机填料，所述环氧树脂（a）中的取代或未取代的萘环的含量为45〜60重量％ 环氧树脂（A）的总量最适合于半导体封装，因为它具有良好的流动性，低的线性膨胀系数，高的Tg，最小的吸湿性和无铅焊接时的抗裂纹性。

公开(公告)号：US06630745B1

公开(公告)日：2003-10-07

申请号：US09558384

申请日：2000-04-26

申请人： Shoichi Osada ,  Eiichi Asano ,  Shigeki Ino ,  Takayuki Aoki ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

发明人： Shoichi Osada ,  Eiichi Asano ,  Shigeki Ino ,  Takayuki Aoki ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

IPC分类号： H01L2329

CPC分类号： H01L23/293 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/12528 ,  Y10T428/31511 ,  C08L83/00 ,  H01L2924/00

摘要： A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.

摘要翻译： 提供半导体封装环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）钼化合物，（Di）有机聚硅氧烷，（D-ii）有机聚硅氧烷固化产物或（ D-iii）通过环氧树脂或含烯基的环氧树脂与有机氢聚硅氧烷反应得到的嵌段共聚物和（E）无机填料。 尽管没有卤化环氧树脂和氧化锑，该组合物具有改进的成型性和耐焊料裂纹性，同时显示出高阻燃性。

公开(公告)号：US06342309B1

公开(公告)日：2002-01-29

申请号：US09640874

申请日：2000-08-18

申请人： Toshio Shiobara ,  Shigeki Ino ,  Yasuo Kimura ,  Takayuki Aoki ,  Kazuhiro Arai ,  Hidenori Mizushima

发明人： Toshio Shiobara ,  Shigeki Ino ,  Yasuo Kimura ,  Takayuki Aoki ,  Kazuhiro Arai ,  Hidenori Mizushima

IPC分类号： H01L2912

CPC分类号： C08G59/188 ,  H01L23/293 ,  H01L2924/0002 ,  Y10T428/12528 ,  Y10T428/31511 ,  H01L2924/00

摘要： An epoxy resin composition contains (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) catalyzed microcapsules containing an imidazole compound or organic phosphorus compound and having a mean particle size of 0.5-50 &mgr;m, the quantity of the catalyst leached out from the microcapsules in o-cresol at 30° C. for 15 minutes being at least 70% by weight of the entire catalyst quantity. The composition is suited for semiconductor package encapsulation since it has satisfactory catalyst latency, storage stability and cure.

摘要翻译： 环氧树脂组合物含有（A）环氧树脂，（B）固化剂，（C）无机填料和（D）含有咪唑化合物或有机磷化合物的催化微胶囊，其平均粒径为0.5〜 在30℃下从邻甲酚中的微胶囊中浸出15分钟的催化剂的量为整个催化剂量的至少70重量％。 该组合物适用于半导体封装封装，因为其具有令人满意的催化剂潜伏期，储存稳定性和固化性。

公开(公告)号：US5739187A

公开(公告)日：1998-04-14

申请号：US615145

申请日：1996-03-14

申请人： Eiichi Asano ,  Takayuki Aoki ,  Toshio Shiobara ,  Peter Flury ,  Wolfgang Scharf ,  Tadashi Okada

发明人： Eiichi Asano ,  Takayuki Aoki ,  Toshio Shiobara ,  Peter Flury ,  Wolfgang Scharf ,  Tadashi Okada

IPC分类号： C08G59/30 ,  C08G59/32 ,  C08K5/00 ,  C08K5/523 ,  C08L63/00 ,  H01L23/29 ,  C08G59/68 ,  C08G65/10

CPC分类号： H01L23/293 ,  C08G59/304 ,  C08G59/3254 ,  C08K5/0025 ,  C08K5/523 ,  C08L63/00 ,  H01L2924/0002

摘要： An epoxy resin composition comprising (A) 20-80 parts by weight of an epoxy resin, (B) 20-80 parts by weight of a curing agent, (C) 0.1-50 parts by weight of a phosphorus-containing flame retardant, and (D) 200-1,200 parts by weight of an inorganic filler cures into products having improved high-temperature exposure resistance, flame retardancy, and reflow cracking resistance. The composition eliminates blending of antimony trioxide and brominated compounds and is useful in encapsulating semiconductor devices for imparting high-temperature reliability.

摘要翻译： 一种环氧树脂组合物，其包含（A）20-80重量份的环氧树脂，（B）20-80重量份的固化剂，（C）0.1-50重量份的含磷阻燃剂， 和（D）200-1,200重量份的无机填料固化成具有改善的耐高温暴露性，阻燃性和回流开裂性的产品。 该组合物消除了三氧化锑和溴化化合物的混合，并且可用于封装半导体器件以赋予高温可靠性。