Multi-level pulsing of DC and RF signals

    公开(公告)号:US10580618B2

    公开(公告)日:2020-03-03

    申请号:US16400733

    申请日:2019-05-01

    Abstract: Systems and methods for multi-level pulsing of a parameter and multi-level pulsing of a frequency of a radio frequency (RF) signal are described. The RF signal is applied to a substrate support via a match. The parameter is pulsed from a low level to a high level while the frequency is pulsed from a low level to a high level. In addition, a direct current (DC) parameter is applied to the substrate support or another RF signal is applied to an upper electrode. The parameter and the frequency of the RF signal applied to the substrate support are simultaneously pulsed with the DC parameter or the RF signal applied to the upper electrode to increase a rate of processing a wafer, to increase mask selectivity, and to reduce angular spread of ions within a plasma chamber.

    MONOENERGETIC ION GENERATION FOR CONTROLLED ETCH

    公开(公告)号:US20200020510A1

    公开(公告)日:2020-01-16

    申请号:US16035423

    申请日:2018-07-13

    Abstract: Systems and methods for generating monoenergetic ions are described. A duty cycle of a high parameter level of a multistate parameter signal is maintained and a difference between the high parameter level and a low parameter level of the multistate parameter signal is maintained to generate monoenergetic ions. The monoenergetic ions are used to etch a top material layer of a substrate at a rate that is self-limiting without substantially etching a bottom material layer of the substrate.

    Powered grid for plasma chamber
    43.
    发明授权

    公开(公告)号:US10431434B2

    公开(公告)日:2019-10-01

    申请号:US15947629

    申请日:2018-04-06

    Abstract: A plasma processing chamber and methods for operating the chamber are provided. An exemplary chamber includes an electrostatic chuck for receiving a substrate and a dielectric window connected to a top portion of the chamber. An inner side of dielectric window faces a plasma processing region that is above the electrostatic chuck and an outer side of the dielectric window is exterior to the plasma processing region. Inner and outer coils are disposed above the outer side of the dielectric window, and the inner and outer coils are connected to a first RF power source. A powered grid is disposed between the outer side of dielectric window and the inner and outer coils. The powered grid is connected to a second RF power source that is independent from the first RF power source.

    MULTI-LEVEL PULSING OF DC AND RF SIGNALS
    44.
    发明申请

    公开(公告)号:US20190295821A1

    公开(公告)日:2019-09-26

    申请号:US16400733

    申请日:2019-05-01

    Abstract: Systems and methods for multi-level pulsing of a parameter and multi-level pulsing of a frequency of a radio frequency (RF) signal are described. The RF signal is applied to a substrate support via a match. The parameter is pulsed from a low level to a high level while the frequency is pulsed from a low level to a high level. In addition, a direct current (DC) parameter is applied to the substrate support or another RF signal is applied to an upper electrode. The parameter and the frequency of the RF signal applied to the substrate support are simultaneously pulsed with the DC parameter or the RF signal applied to the upper electrode to increase a rate of processing a wafer, to increase mask selectivity, and to reduce angular spread of ions within a plasma chamber.

    SYSTEMS AND METHODS FOR REVERSE PULSING
    48.
    发明申请
    SYSTEMS AND METHODS FOR REVERSE PULSING 审中-公开
    反向脉冲的系统和方法

    公开(公告)号:US20170040176A1

    公开(公告)日:2017-02-09

    申请号:US15139045

    申请日:2016-04-26

    Abstract: Systems and methods for reverse pulsing are described. One of the methods includes receiving a digital signal having a first state and a second state. The method further includes generating a transformer coupled plasma (TCP) radio frequency (RF) pulsed signal having a high state when the digital signal is in the first state and having a low state when the digital signal is in the second state. The method includes providing the TCP RF pulsed signal to one or more coils of a plasma chamber, generating a bias RF pulsed signal having a low state when the digital signal is in the first state and having a high state when the digital signal is in the second state, and providing the bias RF pulsed signal to a chuck of the plasma chamber.

    Abstract translation: 描述了用于反向脉冲的系统和方法。 方法之一包括接收具有第一状态和第二状态的数字信号。 该方法还包括当数字信号处于第一状态时产生具有高状态的变压器耦合等离子体(TCP)射频(RF)脉冲信号,并且当数字信号处于第二状态时具有低状态。 该方法包括将TCP RF脉冲信号提供给等离子体室的一个或多个线圈,当数字信号处于第一状态时产生具有低状态的偏置RF脉冲信号,并且当数字信号处于 并且将偏压RF脉冲信号提供给等离子体室的卡盘。

    Faraday Shield Having Plasma Density Decoupling Structure Between TCP Coil Zones

    公开(公告)号:US20160163569A1

    公开(公告)日:2016-06-09

    申请号:US15041947

    申请日:2016-02-11

    CPC classification number: H01L21/67069 H01J37/32651 H05K9/00

    Abstract: A Faraday shield and a plasma processing chamber incorporating the Faraday shield is are provided. The plasma chamber includes an electrostatic chuck for receiving a substrate, a dielectric window connected to a top portion of the chamber, the dielectric window disposed over the electrostatic chuck, and a Faraday shield. The Faraday shield is disposed inside of the chamber and defined between the electrostatic chuck and the dielectric window. The Faraday shield includes an inner zone having an inner radius range that includes a first and second plurality of slots and an outer zone having an outer radius range that includes a third plurality of slots. The inner zone is adjacent to the outer zone. The Faraday shield also includes a band ring separating the inner zone and the outer zone, such that the first and second plurality of slots do not connect with the third plurality of slots.

    Systems for reverse pulsing
    50.
    发明授权

    公开(公告)号:US11798785B2

    公开(公告)日:2023-10-24

    申请号:US15701176

    申请日:2017-09-11

    Abstract: Systems and methods for reverse pulsing are described. One of the systems includes a controller, first and second source radio frequency (RF) generators, and first and second bias RF generators. The controller controls the first source RF generator to generate a first source pulsed signal, and controls the second source RF generator to generate a second source pulsed signal. The system includes a first match circuit that receives the first and second source pulsed signals and combines the first and second source pulsed signals. The controller controls the first bias RF generator to generate a first bias pulsed signal, and controls the second bias RF generator to generate a second bias pulsed signal. The system includes a second match circuit that receives the first and second bias pulsed signals and combines the first and second bias pulsed signals into a combined bias signal.

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