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    LED WAFER WITH LAMINATED PHOSPHOR LAYER
    41.
    发明申请
    LED WAFER WITH LAMINATED PHOSPHOR LAYER 有权
    带有层压磷光体层的LED波片

    公开(公告)号：US20110266569A1

    公开(公告)日：2011-11-03

    申请号：US12771809

    申请日：2010-04-30

    申请人： Grigoriy Basin ,  Paul S. Martin

    发明人： Grigoriy Basin ,  Paul S. Martin

    IPC分类号： H01L33/44 ,  H01L33/00 ,  H01L21/78 ,  H01L33/48

    CPC分类号： H01L33/0079 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/22 ,  H01L33/50 ,  H01L2224/14 ,  H01L2224/81 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012

    摘要： An LED wafer with a growth substrate is attached to a carrier substrate by, for example, a heat-releasable adhesive so that the LED layers are sandwiched between the two substrates. The growth substrate is then removed, such as by laser lift-off. The exposed surface of the LED layers is then etched to improve light extraction. A preformed phosphor sheet, matched to the LEDs, is then affixed to the exposed LED layer. The phosphor sheet, LED layers, and, optionally, the carrier substrate are then diced to separate the LEDs. The LED dice are released from the carrier substrate by heat or other means, and the individual LED dice are mounted on a submount wafer using a pick-and-place machine. The submount wafer is then diced to produce individual LEDs. The active layer may generate blue light, and the blue light and phosphor light may generate white light having a predefined white point.

    摘要翻译： 具有生长衬底的LED晶片通过例如可热剥离的粘合剂附接到载体衬底，使得LED层夹在两个衬底之间。 然后去除生长衬底，例如通过激光剥离。 然后蚀刻LED层的暴露表面以改善光提取。 然后将与LED相匹配的预成型荧光体片固定到暴露的LED层。 然后对磷光体片，LED层和任选的载体衬底进行切割以分离LED。 LED芯片通过加热或其他方式从载体基板释放，并且使用拾放机将各个LED芯片安装在底座晶片上。 然后将底座晶片切割以产生单独的LED。 有源层可以产生蓝光，并且蓝光和荧光光可以产生具有预定白点的白光。

    Substrate removal during LED formation
    43.
    发明授权
    Substrate removal during LED formation 有权
    LED形成过程中的基板去除

    公开(公告)号：US07867793B2

    公开(公告)日：2011-01-11

    申请号：US11775059

    申请日：2007-07-09

    申请人： Grigoriy Basin ,  Robert S. West ,  Paul S. Martin

    发明人： Grigoriy Basin ,  Robert S. West ,  Paul S. Martin

    IPC分类号： H01L21/00

    CPC分类号： H01L33/0079 ,  H01L24/97 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/81001 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/05599

    摘要： A light emitting diode (LED) is fabricated using an underfill layer that is deposited on either the LED or the submount prior to mounting the LED to a submount. The deposition of the underfill layer prior to mounting the LED to the submount provides for a more uniform and void free support, and increases underfill material options to permit improved thermal characteristics. The underfill layer may be used as support for the thin and brittle LED layers during the removal of the growth substrate prior to mounting the LED to the submount. Additionally, the underfill layer may be patterned to and/or polished back so that only the contact areas of the LED and/or submount are exposed. The patterns in the underfill may also be used as a guide to assist in the singulating of the devices.

    摘要翻译： 在将LED安装到底座之前，使用底层填充层制造发光二极管（LED），其沉积在LED或者底座上。 在将LED安装到底座之前，底部填充层的沉积提供了更均匀和无空隙的支撑，并且增加了底部填充材料选项以允许改进的热特性。 在将LED安装到底座之前，底层填充层可以用作移除生长衬底期间的薄且脆性LED层的支撑。 此外，底部填充层可以被图案化和/或抛光，使得只有LED和/或副安装座的接触区域被暴露。 底部填充物中的图案也可以用作辅助单元的设备的指导。

    UNDERFILL PROCESS FOR FLIP-CHIP LEDS
    45.
    发明申请
    UNDERFILL PROCESS FOR FLIP-CHIP LEDS 审中-公开
    FLIP-CHIP LED的底层工艺

    公开(公告)号：US20090230409A1

    公开(公告)日：2009-09-17

    申请号：US12050082

    申请日：2008-03-17

    申请人： Grigoriy Basin ,  Frederic Diana ,  Paul S. Martin ,  Dima Simonian

    发明人： Grigoriy Basin ,  Frederic Diana ,  Paul S. Martin ,  Dima Simonian

    IPC分类号： H01L33/00

    CPC分类号： H01L33/54 ,  H01L24/97 ,  H01L33/0079 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

    摘要： An underfill technique for LEDs uses compression molding to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer. The molding process causes liquid underfill material (or a softened underfill material) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top and sides of the LED dies is removed using microbead blasting. The exposed growth substrate is then removed from all the LED dies by laser lift-off, and the underfill supports the brittle epitaxial layers of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable.

    摘要翻译： 用于LED的底部填充技术使用压缩成型来同时封装安装在底座晶片上的倒装芯片LED管芯阵列。 成型工艺使液体底部填充材料（或软化的底部填充材料）填充LED管芯和底座晶片之间的间隙。 然后将底部填充材料硬化，例如通过固化。 使用微珠喷砂除去在LED管芯的顶部和侧面上固化的底部填充材料。 然后通过激光剥离从所有LED管芯去除暴露的生长衬底，并且底部填充物在剥离过程中支持每个LED管芯的脆性外延层。 然后将底座晶片分离。 许多LED的晶片级处理同时大大减少了制造时间，并且可以使用各种各样的材料用于底部填充，因为宽范围的粘度是可以容忍的。

    Substrate Removal During LED Formation
    46.
    发明申请
    Substrate Removal During LED Formation 有权
    LED形成过程中的基板去除

    公开(公告)号：US20090017566A1

    公开(公告)日：2009-01-15

    申请号：US11775059

    申请日：2007-07-09

    申请人： Grigoriy Basin ,  Robert S. West ,  Paul S. Martin

    发明人： Grigoriy Basin ,  Robert S. West ,  Paul S. Martin

    IPC分类号： H01L33/00

    CPC分类号： H01L33/0079 ,  H01L24/97 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/81001 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/05599

    摘要： A light emitting diode (LED) is fabricated using an underfill layer that is deposited on either the LED or the submount prior to mounting the LED to a submount. The deposition of the underfill layer prior to mounting the LED to the submount provides for a more uniform and void free support, and increases underfill material options to permit improved thermal characteristics. The underfill layer may be used as support for the thin and brittle LED layers during the removal of the growth substrate prior to mounting the LED to the submount. Additionally, the underfill layer may be patterned to and/or polished back so that only the contact areas of the LED and/or submount are exposed. The patterns in the underfill may also be used as a guide to assist in the singulating of the devices.

    摘要翻译： 在将LED安装到底座之前，使用底层填充层制造发光二极管（LED），其沉积在LED或者底座上。 在将LED安装到底座之前，底部填充层的沉积提供了更均匀和无空隙的支撑，并且增加了底部填充材料选项以允许改进的热特性。 在将LED安装到底座之前，底层填充层可以用作移除生长衬底期间的薄且脆性LED层的支撑。 此外，底部填充层可以被图案化和/或抛光，使得只有LED和/或副安装座的接触区域被暴露。 底部填充物中的图案也可以用作辅助单元的设备的指导。

    Molded lens over LED die
    47.
    发明授权
    Molded lens over LED die 有权
    LED模具上的模制镜头

    公开(公告)号：US07452737B2

    公开(公告)日：2008-11-18

    申请号：US10990208

    申请日：2004-11-15

    申请人： Grigoriy Basin ,  Robert Scott West ,  Paul S. Martin

    发明人： Grigoriy Basin ,  Robert Scott West ,  Paul S. Martin

    IPC分类号： H01L21/00

    CPC分类号： H01L33/52 ,  B29C33/0022 ,  B29C39/006 ,  B29C39/025 ,  B29C43/021 ,  B29C43/18 ,  B29L2011/0016 ,  G02B19/0028 ,  G02B19/0061 ,  G02B19/0071 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01049 ,  H01L2924/12041 ,  H01L2924/00014

    摘要： One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations are filled with a liquid optically transparent material, such as silicone, which when cured forms a lens material. The shape of the indentations will be the shape of the lens. The mold and the LED dice/support structure are brought together so that each LED die resides within the liquid silicone in an associated indentation. The mold is then heated to cure (harden) the silicone. The mold and the support structure are then separated, leaving a complete silicone lens over each LED die. This over molding process may be repeated with different molds to create concentric shells of lenses. Each concentric lens may have a different property, such as containing a phosphor.

    摘要翻译： 一个或多个LED骰子安装在支撑结构上。 支撑结构可以是具有LED芯片的基座，其已经电连接到底座上的引线。 模具中的凹槽对应于支撑结构上的LED骰子的位置。 凹痕中填充有液体光学透明材料，例如硅树脂，其在固化时形成透镜材料。 压痕的形状将是镜片的形状。 模具和LED骰子/支撑结构被聚集在一起，使得每个LED管芯位于相关压痕内的液体硅胶内。 然后将模具加热以固化（硬化）硅树脂。 然后将模具和支撑结构分离，在每个LED管芯上留下完整的硅胶透镜。 可以用不同的模具重复该过模制过程以产生透镜的同心壳。 每个同心透镜可以具有不同的性质，例如含有荧光体。

    Coordination of robot and conveyor
    49.
    发明授权
    Coordination of robot and conveyor 失效
    机器人和输送机的协调

    公开(公告)号：US3958682A

    公开(公告)日：1976-05-25

    申请号：US585107

    申请日：1975-06-09

    申请人： Paul S. Martin

    发明人： Paul S. Martin

    IPC分类号： B25J9/00 ,  G05B19/418 ,  B23Q7/03

    CPC分类号： B25J9/0093 ,  G05B19/4182 ,  G05B2219/45213 ,  Y02P90/083 ,  Y10T408/365 ,  Y10T83/4682

    摘要： An endless chain is caused to become locked to and driven by a work-carrier forming part of a conveyor. The chain drives a signal generator whose output represents the advance of the work-carrier past a robot and the generated signal is combined with program control signals of the robot to modify the operation of the robot so that the robot can operate on a moving work-piece whereas the robot's program alone would cause robot operations on a work-piece that remains at-rest.

    摘要翻译： 导致环形链条被形成传送带部分的工作载体锁定并驱动。 该链驱动信号发生器，其输出表示通过机器人的工作载体的前进，并且生成的信号与机器人的程序控制信号组合以修改机器人的操作，使得机器人可以在移动的工作 - 而机器人的程序本身将导致机器人操作在保持休息的工件上。