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公开(公告)号：US4278784A
公开(公告)日：1981-07-14
申请号：US119077
申请日：1980-02-06
Applicant: Ching-Ping Wong
Inventor： Ching-Ping Wong
IPC: C08G77/00 , C08G77/28 , C08G77/48 , C08G77/54 , C08L83/14 , H01L23/28 , H01L23/29 , H01L23/31 , C08G77/04
Abstract: An electronic device such as an integrated circuit is encapsulated with a silicone resin formulation comprising a polysiloxane having a cryptate ether as part of the backbone of the polymer chain for preventing migration of cations, e.g., sodium and potassium.
Abstract translation: 诸如集成电路的电子器件用包含聚硅氧烷的硅氧烷树脂配方包封，所述聚硅氧烷具有作为聚合物链的主链部分的聚醚的一部分，其用作防止阳离子例如钠和钾的迁移。
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公开(公告)号：US20100189925A1
公开(公告)日：2010-07-29
申请号：US12753146
申请日：2010-04-02
Applicant: JUN LI , Lianhua Fan , Ching-Ping Wong , Franklin Cook Lambert
Inventor： JUN LI , Lianhua Fan , Ching-Ping Wong , Franklin Cook Lambert
IPC: C23C16/511 , B05D5/12 , C23C16/44
CPC classification number: H01B3/306 , H01B3/441 , H01B3/445 , Y10T428/2927 , Y10T428/2933 , Y10T428/294 , Y10T428/2976 , Y10T428/2978
Abstract: Methods of applying Lotus Effect materials as a (superhydrophobicity) protective coating for external electrical insulation system applications, as well as the method of fabricating/preparing Lotus Effect coatings are discussed. Selected inorganic or polymeric materials are applied on the insulating material surface, and stable superhydrophobic coatings can be fabricated. Various UV stabilizers and UV absorbers can be incorporated into the coating system to enhance the coating's UV stability. Other aspects, features, and embodiments are also discussed and claimed.
Abstract translation: 应用Lotus Effect材料作为外部电气绝缘系统应用的（超疏水性）保护涂层的方法以及制备/制备Lotus Effect涂层的方法。 选择的无机或聚合物材料被施加在绝缘材料表面上，并且可以制造稳定的超疏水涂层。 可以将各种UV稳定剂和UV吸收剂掺入涂料体系中以增强涂料的UV稳定性。 还讨论和要求保护其他方面，特征和实施例。
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公开(公告)号：US20060081394A1
公开(公告)日：2006-04-20
申请号：US10966963
申请日：2004-10-15
Applicant: Jun Li , Lianhua Fan , Ching-Ping Wong , Franklin Lambert
Inventor： Jun Li , Lianhua Fan , Ching-Ping Wong , Franklin Lambert
IPC: H01B3/44
CPC classification number: H01B3/306 , H01B3/441 , H01B3/445 , Y10T428/2927 , Y10T428/2933 , Y10T428/294 , Y10T428/2976 , Y10T428/2978
Abstract: The present invention is a method of applying Lotus Effect materials as a (superhydrophobicity) protective coating for external electrical insulation system applications, as well as the method of fabricating/preparing Lotus Effect coatings. Selected inorganic or polymeric materials are applied on the insulating material surface, and stable superhydrophobic coatings can be fabricated. Various UV stabilizers and UV absorbers can be incorporated into the coating system to enhance the coating's UV stability.
Abstract translation: 本发明是将莲花效应材料应用于外部电绝缘系统应用的（超疏水性）保护涂层的方法以及制备/制备莲花效应涂层的方法。 选择的无机或聚合物材料被施加在绝缘材料表面上，并且可以制造稳定的超疏水涂层。 可以将各种UV稳定剂和UV吸收剂掺入涂料体系中以增强涂料的UV稳定性。
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公开(公告)号：US06864306B2
公开(公告)日：2005-03-08
申请号：US10135744
申请日：2002-04-30
Applicant: Yang Rao , Ching-Ping Wong , Jianwen Xu
Inventor： Yang Rao , Ching-Ping Wong , Jianwen Xu
IPC: C08K3/04 , C08K3/08 , C08K7/06 , H05K1/16 , C08J3/00 , C08K5/04 , C08K5/09 , C08L75/00 , C08L83/00
CPC classification number: C08K7/06 , C08K3/04 , C08K3/08 , H05K1/162 , H05K2201/0209 , H05K2201/0215 , H05K2201/0323 , H05K2201/09309
Abstract: Polymer composites and methods of making the polymer composites are presented. A representative polymer composite includes a polymer resin and a conductive material, wherein the polymer composite is characterized by a dielectric constant greater the 200. A representative method of making the polymer composite can be broadly summarized by the following steps: providing a polymer resin and a conductive material; mixing the polymer resin and the conductive material; and forming the polymer composite, wherein the polymer composite is characterized by a dielectric constant greater than 200.
Abstract translation: 提出了聚合物复合材料和制备聚合物复合材料的方法。 代表性的聚合物复合材料包括聚合物树脂和导电材料，其中聚合物复合材料的特征在于介电常数大于200.制备聚合物复合材料的代表性方法可以通过以下步骤大致概括：提供聚合物树脂和 导电材料; 混合聚合物树脂和导电材料; 以及形成所述聚合物复合材料，其中所述聚合物复合材料的特征在于介电常数大于200。
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45.发明授权公开(公告)号：US06746896B1
公开(公告)日：2004-06-08
申请号：US09648777
申请日：2000-08-28
Applicant: Song-Hua Shi , Ching-Ping Wong
Inventor： Song-Hua Shi , Ching-Ping Wong
IPC: H01L2144
CPC classification number: H01L21/563 , B23K35/3613 , H01L21/6835 , H01L24/27 , H01L24/29 , H01L24/81 , H01L2221/6834 , H01L2221/68354 , H01L2224/13111 , H01L2224/16225 , H01L2224/274 , H01L2224/29111 , H01L2224/2919 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2224/83191 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/04953 , H01L2924/1579 , H01L2924/0665 , H01L2224/0401
Abstract: The present invention provides a novel process and its required fluxable materials for building low-cost flip-chip interconnect structures. The novel process involves two fluxable materials, fluxable wafer-level compressive-flow underfill material (WLCFU) and fluxable tacky film, and applies these two materials on a wafer level. The two materials can provide sufficient fluxing capability during solder reflow and significant improvement of the fatigue life of the formed solder interconnects after fully cured.
Abstract translation: 本发明提供了一种用于构建低成本倒装芯片互连结构的新型工艺及其所需的助熔材料。 该新工艺涉及两种助焊剂材料，助焊剂晶圆级压缩底层填充材料（WLCFU）和助焊剂粘合膜，并将这两种材料应用于晶圆级。 这两种材料可以在焊料回流期间提供足够的助熔能力，并且在完全固化后显着提高形成的焊料互连的疲劳寿命。
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Patent Agency Ranking
公开(公告)号：US5849680A
公开(公告)日：1998-12-15
申请号：US741984
申请日：1996-10-31
Applicant: Ching-Ping Wong
Inventor： Ching-Ping Wong
CPC classification number: H05K3/26 , C11D11/0047 , C11D7/5022 , C11D7/24 , C11D7/262 , C11D7/266 , H05K2203/0783 , H05K2203/121
Abstract: The specification describes a cleaning process for electronic devices and assemblies such as printed wiring boards. In the cleaning process deterioration of a terpene based cleaning solution, as evidenced by yellowing, is prevented using a copper chelating additive.
Abstract translation: 该说明书描述了用于诸如印刷线路板的电子设备和组件的清洁过程。 在清洗过程中，使用铜螯合添加剂可防止由黄变所证明的萜烯类清洗溶液的劣化。
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公开(公告)号：US5568684A
公开(公告)日：1996-10-29
申请号：US181072
申请日：1994-01-14
Applicant: Ching-Ping Wong
Inventor： Ching-Ping Wong
IPC: H01L23/24 , H01L23/057 , H01L23/22 , B29C45/14 , B29C70/70
CPC classification number: H01L23/057 , H01L23/22 , H01L2224/16225 , H01L2924/19107 , Y10T29/49144 , Y10T29/49146
Abstract: An electronic device (12, 13) is substantially enclosed by a fluid encapsulant (17). The fluid encapsulant consists essentially of a silicone resin and a catalyst selected from the group consisting of platinum and tin. The silicone resin is selected from the group consisting of polydimethlysiloxane, polymethylphenylsiloxane, polydimethyldiphenylsiloxane, and mixtures thereof. Such silicone resins comprise molecules terminating in vinyl components and hydride components. The molar ratio of vinyl components to hydride components is maintained within the range of five to twenty. As will be explained more fully later, this ratio of vinyl components to hydride components assures that the resin will remain substantially a liquid even after cure, due to limited cross-linking or polymerization during the cure. The electronic device is contained within a container (16) having a sealed cover (18) for containing the liquid encapsulant during the operation of the electronic device.
Abstract translation: 电子设备（12,13）基本上由流体密封剂（17）封闭。 流体密封剂基本上由硅树脂和选自铂和锡的催化剂组成。 有机硅树脂选自聚二甲基硅氧烷，聚甲基苯基硅氧烷，聚二甲基二苯基硅氧烷及其混合物。 这种有机硅树脂包括终止于乙烯基组分和氢化物组分的分子。 乙烯基组分与氢化物组分的摩尔比保持在5至20的范围内。 如下文将更全面地说明的，乙烯基组分与氢化物组分的比率确保了即使在固化之后，由于固化期间交联或聚合的限制，树脂仍将基本上保持液体。 电子设备包含在具有用于在电子设备的操作期间容纳液体密封剂的密封盖（18）的容器（16）内。
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公开(公告)号：US5405566A
公开(公告)日：1995-04-11
申请号：US135645
申请日：1993-10-14
Applicant: Peter F. Lilienthal, III , Ivan Pawlenko , Ching-Ping Wong
Inventor： Peter F. Lilienthal, III , Ivan Pawlenko , Ching-Ping Wong
CPC classification number: B29C39/06 , B29C33/0016 , B29C33/0038 , B29C39/10 , B29K2105/0061 , Y10S425/044 , Y10S439/936
Abstract: A module, such as a terminal block (10), configured of a body (12) having an open end (20) and at least one window (24) spaced from the open end, is fixtured and sealed by way of a channel (28) comprised of a pair of parallel, spaced-apart, generally elastic walls (30,32) jointed by a bottom member (34). The walls (30,32) and the bottom member (34) run longitudinally a distance at least as long as the width of the terminal block (10) to allow the block to be received between, and to be held by, the walls. At least one protrusion extends out from a separate one of the walls (30,32) and the base member (34) for receipt in the window (24) in the terminal block to seal the same.
Abstract translation: 诸如端子块（10）的模块由具有开口端（20）的主体（12）和与开口端间隔开的至少一个窗口（24）构成，通过通道（...）固定和密封 28）包括由底部构件（34）连接的一对平行的，间隔开的，大致弹性的壁（30,32）。 壁（30,32）和底部构件（34）纵向延伸至少与端子块（10）的宽度一样长的距离，以允许块被容纳在壁之间并由壁保持。 至少一个突出部从单独的一个壁（30,32）和基部构件（34）中伸出，以便接收在端子块中的窗口（24）中，以密封它们。
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公开(公告)号：US5213864A
公开(公告)日：1993-05-25
申请号：US802579
申请日：1991-12-05
Applicant: Ching-Ping Wong
Inventor： Ching-Ping Wong
CPC classification number: H01B3/46 , C08G77/04 , H01L23/296 , H01L2224/48091 , H01L2224/48464 , Y10T428/23 , Y10T428/239 , Y10T428/31663
Abstract: An electronic device encapsulant comprises polydimethyldiphenylmethylphenylsiloxane in which the mole ratio of the sum of the methyl-phenyl and diphenyl groups to the dimethyl groups is in the range of ten to forty percent. The normal bi-functional hydride terminations are replaced with tri-functional or tetra-functional hydride terminations.
Abstract translation: 电子器件密封剂包括聚二甲基二苯基甲基苯基硅氧烷，其中甲基 - 苯基和二苯基与二甲基之和的摩尔比在十至百分之四十的范围内。 正常的双官能氢化物终端用三官能或四官能氢化物终止物代替。
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公开(公告)号：US4720431A
公开(公告)日：1988-01-19
申请号：US872294
申请日：1986-05-21
Applicant: Ching-Ping Wong
Inventor： Ching-Ping Wong
CPC classification number: H01L23/296 , C08L83/04 , C08G77/12 , C08G77/20 , H01L2924/0002 , Y10T428/31663
Abstract: The addition of a low viscosity (2 to 100 centipoise) polysiloxane such asolydimethylsiloxane to a two-part heat curable polysiloxane system substantially eliminates the formation of bubbles when such system is employed as a potting compound for encapsulating devices such as electronic devices.
Abstract translation: 当将这种系统用作用于封装诸如电子器件的装置的灌封化合物时，将低粘度（2至100厘泊）聚硅氧烷（例如聚二甲基硅氧烷）加入到两部分热固性聚硅氧烷体系中基本上消除了气泡的形成。
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