公开(公告)号：US11752516B2

公开(公告)日：2023-09-12

申请号：US17453506

申请日：2021-11-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongkeun Lee ,  Jongho Park

IPC: B05C5/02 ,  G03F7/16

CPC classification number: B05C5/0225 ,  G03F7/162

Abstract: The inventive concept provides an apparatus for processing a substrate. The apparatus includes a mount; a processing liquid supply nozzle configured to provide a processing liquid to the substrate and a discharge container including: a base plate including a liquid outlet and an exhaust port; an inner wall standing on an inner circumference of the base plate; an outer wall standing on an outer circumference of the base plate; and a barrier standing on the base plate to separate a first space connected to the liquid outlet from a second space connected to the exhaust port. The apparatus further includes an inner cover configured to guide the flow of a processing liquid from the substrate supported by the mount to the first space of the discharge container; and a flow guide mounted in the first space of the discharge container.

公开(公告)号：US11742294B2

公开(公告)日：2023-08-29

申请号：US17306290

申请日：2021-05-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongho Park ,  Seunghwan Kim ,  Junyoung Oh ,  Yonghyun Kim ,  Yongkwan Lee ,  Junga Lee

IPC: H01L23/13 ,  H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10 ,  H01L23/31

CPC classification number: H01L23/5385 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5386 ,  H01L24/16 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058

Abstract: A semiconductor package includes a first package substrate; a first semiconductor chip on the first package substrate; a first conductive connector on the first package substrate; and an interposer including a central portion on the first semiconductor chip and an outer portion having the first conductive connector attached thereto. The central portion of the interposer includes a bottom surface defining a recess from a bottom surface of the outer portion of the interposer in a vertical direction that is perpendicular to a top surface of the first package substrate. A thickness in the vertical direction of the outer portion of the interposer is greater than a thickness in the vertical direction of the central portion of the interposer.

公开(公告)号：US11599262B2

公开(公告)日：2023-03-07

申请号：US17231253

申请日：2021-04-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yunjang Jin ,  Jongho Park ,  Jungwoo Choe

IPC: G06V40/12 ,  G06F3/0488 ,  G06F3/041 ,  G06F3/02 ,  G06V40/13 ,  G06V10/30 ,  G06V10/26 ,  G06V40/60 ,  G06V10/28

Abstract: An electronic device is provided. The electronic device includes a display, a fingerprint recognition sensor disposed under a first area of the display, at least one input detection sensor, and at least one processor electrically connected with the display, the fingerprint recognition sensor, and the at least one input detection sensor, wherein the at least one processor is configured to detect a designated event through the at least one input detection sensor, acquire background information through the fingerprint recognition sensor according to detection of the designated event, acquire fingerprint information of an object through the fingerprint recognition sensor in response to detecting the object on the first area of the display, and subtract the background information from the fingerprint information.

公开(公告)号：US20230046782A1

公开(公告)日：2023-02-16

申请号：US17700879

申请日：2022-03-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongho Park ,  Un-Byoung Kang ,  Sechul Park ,  Hyojin Yun ,  Ju-Il Choi ,  Atsushi Fujisaki

IPC: H01L25/065 ,  H01L21/02 ,  H01L21/56 ,  H01L25/00

Abstract: Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises a substrate that includes a plurality of vias, a first chip stack on the substrate and including a plurality of first semiconductor chips that are sequentially stacked on the substrate, and a plurality of first non-conductive layers between the substrate and the first chip stack and between neighboring first semiconductor chips. Each of the first non-conductive layers includes first extensions that protrude outwardly from first lateral surfaces of the first semiconductor chips. The more remote the first non-conductive layers are from the substrate, the first extensions protrude a shorter length from the first lateral surfaces of the first semiconductor chips.

公开(公告)号：US11538801B2

公开(公告)日：2022-12-27

申请号：US17220468

申请日：2021-04-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongho Park ,  Seung Hwan Kim ,  Jun Young Oh ,  Jungjoo Kim ,  Yongkwan Lee ,  Dong-Ju Jang

IPC: H01L25/18 ,  H01L23/538 ,  H01L25/00 ,  H01L23/00

Abstract: A semiconductor package includes a first substrate that includes a first trench on a recessed portion of a bottom surface of the first substrate and a first through hole extending through the first substrate to the first trench, a first semiconductor chip on the first substrate, a first capacitor chip in the first trench and on the first substrate, and a first molding layer on the first substrate and covering the first semiconductor chip. The first molding layer includes a first part that extends parallel to a top surface of the first substrate, a second part connected to the first part and extending vertically in the first through hole, and a third part connected to the second part and surrounding the first capacitor chip. A bottom surface of the third part is coplanar with the bottom surface of the first substrate.

公开(公告)号：US11508713B2

公开(公告)日：2022-11-22

申请号：US17168706

申请日：2021-02-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junyoung Oh ,  Kyonghwan Koh ,  Sangsoo Kim ,  Seunghwan Kim ,  Jongho Park ,  Yongkwan Lee

IPC: H01L21/56 ,  H01L25/00 ,  H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L21/48 ,  H01L21/78 ,  H01L25/065

Abstract: A method of manufacturing a semiconductor package includes forming a laser reactive polymer layer on a substrate; mounting a semiconductor device on the substrate; irradiating at least a portion of the laser reactive polymer layer below the semiconductor device with a laser having a wavelength capable of penetrating through the semiconductor device on the substrate to modify the laser reactive polymer layer to have a hydrophilic functional group; and forming a first encapsulation material layer between the semiconductor device and the substrate.

公开(公告)号：US11335701B2

公开(公告)日：2022-05-17

申请号：US16780006

申请日：2020-02-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byounghoon Lee ,  Jongho Park ,  Musarrat Hasan ,  Wandon Kim ,  Seungkeun Cha

IPC: H01L27/1159 ,  H01L29/78 ,  H01L27/11585 ,  H01L29/51

Abstract: A semiconductor device includes a substrate, a channel on or in the substrate, a source/drain pair respectively on opposite ends of the channel, and a gate structure on the channel between the source/drain pair, wherein the gate structure includes an interfacial layer, a ferroelectric layer, a stabilization layer, an oxygen diffusion barrier layer, and a threshold voltage control layer that are sequentially stacked on the channel.

公开(公告)号：US20210028291A1

公开(公告)日：2021-01-28

申请号：US16886881

申请日：2020-05-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongho Park ,  Byounghoon Lee ,  Seungkeun Cha ,  Wandon Kim

IPC: H01L29/49 ,  H01L29/45 ,  H01L29/10 ,  H01L29/423 ,  H01L29/06

Abstract: Semiconductor devices are provided. A semiconductor device includes a first active pattern on a first region of a substrate, a pair of first source/drain patterns on the first active pattern, a first channel pattern between the pair of first source/drain patterns, and a gate electrode that extends across the first channel pattern. The gate electrode is on an uppermost surface and at least one sidewall of the first channel pattern. The gate electrode includes a first metal pattern including a p-type work function metal, a second metal pattern on the first metal pattern and including an n-type work function metal, a first barrier pattern on the second metal pattern and including an amorphous metal layer that includes tungsten (W), carbon (C), and nitrogen (N), and a second barrier pattern on the first barrier pattern. The second barrier pattern includes the p-type work function metal.

公开(公告)号：US20180212449A1

公开(公告)日：2018-07-26

申请号：US15881446

申请日：2018-01-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongho Park ,  Info Yun ,  Doo-Suk Kang ,  Jeong-Min Park

IPC: H02J7/00 ,  A61B5/0408 ,  A61B5/0245

CPC classification number: H02J7/0052 ,  A61B5/0205 ,  A61B5/0245 ,  A61B5/04085 ,  A61B5/681 ,  A61B5/6898 ,  A61B2560/0209 ,  A61B2560/0214 ,  A61B2560/029 ,  A61B2562/0209 ,  G16H50/00 ,  H02J7/0042

Abstract: An electronic device that can be worn on a user's body and an operating method thereof is disclosed. An electrode for charging and measuring is included in a front side of the electronic device. The electronic device includes a battery, a charging circuit for charging the battery, a bio-sensor, and a processor. The processor is configured to determine whether the battery is being charged through the charging circuit. If the battery is not being charged, the processor is configured to acquire biometric information by using a first method through the bio-sensor, and if the battery is being charged, the processor is configured to acquire the biometric information by using a second method through the bio-sensor.