Semiconductor device and method for manufacturing the same
    43.
    发明授权
    Semiconductor device and method for manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US08975115B2

    公开(公告)日:2015-03-10

    申请号:US14148906

    申请日:2014-01-07

    Abstract: An insulating layer which releases a large amount of oxygen is used as an insulating layer in contact with a channel region of an oxide semiconductor layer, and an insulating layer which releases a small amount of oxygen is used as an insulating layer in contact with a source region and a drain region of the oxide semiconductor layer. By releasing oxygen from the insulating layer which releases a large amount of oxygen, oxygen deficiency in the channel region and an interface state density between the insulating layer and the channel region can be reduced, so that a highly reliable semiconductor device having small variation in electrical characteristics can be manufactured. The source region and the drain region are provided in contact with the insulating layer which releases a small amount of oxygen, thereby suppressing the increase of the resistance of the source region and the drain region.

    Abstract translation: 使用释放大量氧的绝缘层作为与氧化物半导体层的沟道区域接触的绝缘层,并且使用释放少量氧的绝缘层作为与源极接触的绝缘层 区域和氧化物半导体层的漏极区域。 通过从释放大量氧的绝缘层释放氧气,可以减少沟道区域中的氧缺乏以及绝缘层和沟道区域之间的界面态密度,从而可以降低电子变化小的高度可靠的半导体器件 特性可以制造。 源极区域和漏极区域设置成与释放少量氧气的绝缘层接触,从而抑制源极区域和漏极区域的电阻的增加。

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    45.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20140120660A1

    公开(公告)日:2014-05-01

    申请号:US14148906

    申请日:2014-01-07

    Abstract: An insulating layer which releases a large amount of oxygen is used as an insulating layer in contact with a channel region of an oxide semiconductor layer, and an insulating layer which releases a small amount of oxygen is used as an insulating layer in contact with a source region and a drain region of the oxide semiconductor layer. By releasing oxygen from the insulating layer which releases a large amount of oxygen, oxygen deficiency in the channel region and an interface state density between the insulating layer and the channel region can be reduced, so that a highly reliable semiconductor device having small variation in electrical characteristics can be manufactured. The source region and the drain region are provided in contact with the insulating layer which releases a small amount of oxygen, thereby suppressing the increase of the resistance of the source region and the drain region.

    Abstract translation: 使用释放大量氧的绝缘层作为与氧化物半导体层的沟道区域接触的绝缘层,并且使用释放少量氧的绝缘层作为与源极接触的绝缘层 区域和氧化物半导体层的漏极区域。 通过从释放大量氧的绝缘层释放氧气,可以减少沟道区域中的氧缺乏以及绝缘层和沟道区域之间的界面态密度,从而可以降低电子变化小的高度可靠的半导体器件 特性可以制造。 源极区域和漏极区域设置成与释放少量氧气的绝缘层接触,从而抑制源极区域和漏极区域的电阻的增加。

    SWITCHING CONVERTER
    46.
    发明申请
    SWITCHING CONVERTER 有权
    开关转换器

    公开(公告)号:US20130294120A1

    公开(公告)日:2013-11-07

    申请号:US13875415

    申请日:2013-05-02

    Abstract: A switching converter in which deterioration and breakage can be suppressed is provided. A switching converter whose area can be reduced is provided. The switching converter includes a switch connected to a power supply portion; a transformer connected to the power supply portion; a first rectifying and smoothing circuit and a second rectifying and smoothing circuit each connected to at least the transformer; and a switching control circuit which is connected to the first rectifying and smoothing circuit and the second rectifying and smoothing circuit and which controls operation of the switch. The switching control circuit includes a control circuit controlling on/off of the switch and operation of a starter circuit; and the starter circuit controlling startup of the control circuit. The starter circuit includes a transistor and a resistor each including a wide-gap semiconductor.

    Abstract translation: 提供了可以抑制劣化和断裂的开关转换器。 提供了可以减小面积的开关转换器。 开关转换器包括连接到电源部分的开关; 连接到电源部分的变压器; 第一整流和平滑电路和第二整流和平滑电路,每个至少连接到变压器; 以及切换控制电路,其连接到第一整流平滑电路和第二整流平滑电路,并控制开关的动作。 开关控制电路包括控制开关的开/关和控制起动电路的操作的控制电路; 以及启动电路,控制控制电路的启动。 起动电路包括晶体管和各自包括宽间隙半导体的电阻器。

    SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT
    47.
    发明申请
    SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT 有权
    半导体元件,半导体器件和半导体元件的制造方法

    公开(公告)号:US20130256665A1

    公开(公告)日:2013-10-03

    申请号:US13803022

    申请日:2013-03-14

    CPC classification number: H01L29/04 H01L29/4908 H01L29/78618

    Abstract: To provide a semiconductor element in which generation of oxygen vacancies in an oxide semiconductor thin film can be suppressed. The semiconductor element has a structure in which, in a gate insulating film, the nitrogen content of regions which do not overlap with a gate electrode is higher than the nitrogen content of a region which overlaps with the gate electrode. A nitride film has an excellent property of preventing impurity diffusion; thus, with the structure, release of oxygen in the oxide semiconductor film, in particular, in the channel formation region, to the outside of the semiconductor element can be effectively suppressed.

    Abstract translation: 提供能够抑制氧化物半导体薄膜中的氧空位的产生的半导体元件。 半导体元件具有这样的结构,其中在栅极绝缘膜中,与栅电极不重叠的区域的氮含量高于与栅电极重叠的区域的氮含量。 氮化物膜具有防止杂质扩散的优异性能; 因此,通过该结构,可以有效地抑制氧化物半导体膜中的氧,特别是沟道形成区域中的氧向半导体元件的外部的释放。

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    49.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20130187152A1

    公开(公告)日:2013-07-25

    申请号:US13742415

    申请日:2013-01-16

    Abstract: A metal element of a metal film is introduced into the oxide semiconductor film by performing heat treatment in the state where the oxide semiconductor film is in contact with the metal film, so that a low-resistance region having resistance lower than that of a channel formation region is formed. A region of the metal film, which is in contact with the oxide semiconductor film, becomes a metal oxide insulating film by the heat treatment. After that, an unnecessary metal film is removed. Thus, the metal oxide insulating film can be formed over the low-resistance region.

    Abstract translation: 通过在氧化物半导体膜与金属膜接触的状态下进行热处理,将金属膜的金属元素引入到氧化物半导体膜中,使得具有低于沟道形成的电阻的低电阻区域 形成区域。 与氧化物半导体膜接触的金属膜的区域通过热处理成为金属氧化物绝缘膜。 之后,去除不必要的金属膜。 因此,可以在低电阻区域上形成金属氧化物绝缘膜。

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