公开(公告)号：US08956917B2

公开(公告)日：2015-02-17

申请号：US13353826

申请日：2012-01-19

申请人： Tetsuya Kurosawa ,  Shinya Takyu ,  Akira Tomono

发明人： Tetsuya Kurosawa ,  Shinya Takyu ,  Akira Tomono

IPC分类号： H01L21/78 ,  H01L29/30 ,  H01L21/683

CPC分类号： H01L21/78 ,  H01L21/6836

摘要： According to one embodiment, a manufacturing method of a semiconductor device is disclosed. The method includes: (a) forming cutting grooves in an element formation surface of a semiconductor wafer on which semiconductor elements are formed; (b) applying a protection tape on the element formation surface of the semiconductor wafer; (c) grinding a rear surface of the semiconductor wafer to thin the semiconductor wafer and to divide the semiconductor wafer into a plurality of semiconductor chips on which the semiconductor elements are formed; (d) forming an adhesive layer on the rear surface of the semiconductor wafer; (e) separating and cutting the adhesive layer for each of the semiconductor chips; and (f) removing the protection tape. The (e) is performed by spraying a high-pressure air to the adhesive layer formed on the rear surface of the semiconductor wafer while melting or softening the adhesive layer by heating.

摘要翻译： 根据一个实施例，公开了一种半导体器件的制造方法。 该方法包括：（a）在形成有半导体元件的半导体晶片的元件形成表面中形成切割槽; （b）在半导体晶片的元件形成表面上施加保护带; （c）研磨半导体晶片的后表面以使半导体晶片变薄，并将半导体晶片分成多个形成有半导体元件的半导体芯片; （d）在半导体晶片的后表面上形成粘合剂层; （e）分离和切割每个半导体芯片的粘合剂层; 和（f）去除保护胶带。 （e）通过在通过加热熔化或软化粘合剂层的同时向形成在半导体晶片的后表面上的粘合剂层喷射高压空气来进行。

公开(公告)号：US20110163459A1

公开(公告)日：2011-07-07

申请号：US13051179

申请日：2011-03-18

申请人： Junya Sagara ,  Shinya Takyu ,  Tetsuya Kurosawa

发明人： Junya Sagara ,  Shinya Takyu ,  Tetsuya Kurosawa

IPC分类号： H01L23/52

CPC分类号： H01L25/0657 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/82 ,  H01L2221/6834 ,  H01L2224/24051 ,  H01L2224/24145 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82001 ,  H01L2224/82007 ,  H01L2224/82102 ,  H01L2225/06524 ,  H01L2225/06562 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/00

摘要： A method for manufacturing a stacked semiconductor package where a plurality of semiconductor chips are stacked on a substrate, including: forming insulating layers at portions of a wafer corresponding to sides of the plurality of semiconductor chips when the plurality of semiconductor chips are in the wafer; processing the wafer so as to obtain the plurality of semiconductor chips; subsequently stacking the plurality of semiconductor chips on the substrate such that the insulating layers formed at the sides of the plurality of semiconductor chips are respectively positioned at the same side as one another; and forming a wiring over the insulating layers formed at the sides of the plurality of semiconductor chips so that the plurality of semiconductor chips are electrically connected with one another and one or more of the plurality of semiconductor chips are electrically connected with the substrate.

摘要翻译： 一种叠层半导体封装的制造方法，其中多个半导体芯片堆叠在基板上，包括：当所述多个半导体芯片在所述晶片中时，在与所述多个半导体芯片的侧面对应的晶片的部分处形成绝缘层; 处理晶片以获得多个半导体芯片; 随后将多个半导体芯片堆叠在基板上，使得形成在多个半导体芯片的侧面的绝缘层分别位于彼此相同的一侧; 以及在形成在所述多个半导体芯片的侧面的绝缘层上形成布线，使得所述多个半导体芯片彼此电连接，并且所述多个半导体芯片中的一个或多个与所述基板电连接。

公开(公告)号：US07608911B2

公开(公告)日：2009-10-27

申请号：US12213766

申请日：2008-06-24

申请人： Takashi Imoto ,  Chiaki Takubo ,  Ryuji Hosokawa ,  Yoshihisa Imori ,  Takao Sato ,  Tetsuya Kurosawa ,  Mika Kiritani

发明人： Takashi Imoto ,  Chiaki Takubo ,  Ryuji Hosokawa ,  Yoshihisa Imori ,  Takao Sato ,  Tetsuya Kurosawa ,  Mika Kiritani

IPC分类号： H01L29/06

CPC分类号： H01L23/3142 ,  H01L23/3121 ,  H01L23/3178 ,  H01L23/5222 ,  H01L23/5329 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed from the surface of the semiconductor substrate so that the semiconductor substrate is exposed at the portion, a mounting substrate on which the semiconductor element is mounted, and a resin layer which seals at least a surface side of the semiconductor element with resin.

摘要翻译： 公开了一种半导体器件，其包括半导体元件，其中在半导体衬底的表面上形成由包括绝缘膜的多个层组成的层叠膜，并且将层压膜的一部分从 半导体衬底，使得半导体衬底在该部分处露出，其上安装有半导体元件的安装衬底和用树脂密封半导体元件的至少表面侧的树脂层。

公开(公告)号：US07300818B2

公开(公告)日：2007-11-27

申请号：US11232873

申请日：2005-09-23

申请人： Tetsuya Kurosawa ,  Shinya Takyu

发明人： Tetsuya Kurosawa ,  Shinya Takyu

IPC分类号： H01L21/50

CPC分类号： H01L21/6835 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/6839 ,  Y10T29/41 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/1944

摘要： An adhesive tape peeling mechanism has an adhering section and a porous member. The adhering section adheres to a segmented semiconductor wafer bonded to adhesive tape. The porous member is provided on the surface adhering to the semiconductor wafer of the adhering section. The porous member is divided into at least two adhering areas in the direction in which the adhesive tape is peeled. The porous member adheres to the semiconductor wafer by suction and fixes the wafer in place.

公开(公告)号：US07172673B2

公开(公告)日：2007-02-06

申请号：US11038479

申请日：2005-01-21

申请人： Tetsuya Kurosawa ,  Masahisa Otsuka

发明人： Tetsuya Kurosawa ,  Masahisa Otsuka

IPC分类号： B32B38/10

CPC分类号： H01L21/67132 ,  H01L21/67144 ,  Y10S156/941 ,  Y10S438/976 ,  Y10T156/1137 ,  Y10T156/1179 ,  Y10T156/19

摘要： A peeling device 11 includes an adsorber 15 having an adsorbing face 20A that adsorbs and retains a wafer W, and a peeling element 17 that holds a protective sheet H stuck to the wafer W, and peels off the protective sheet H from the wafer W through moving relatively to the adsorber 15. The adsorber 15 and the peeling element 17 are arranged so as to peel off the protective sheet H from the wafer W intermittently through moving relatively to each other while a peeling operation and a counter-peeling operation are performed alternately.

摘要翻译： 剥离装置11包括具有吸附并保持晶片W的吸附面20A的吸附器15和将保护片H保持在晶片W上的剥离元件17，并从保护片H剥离晶片W 通过相对于吸附器15移动。 吸附器15和剥离元件17被布置成在交替执行剥离操作和反剥离操作的同时间歇地通过相对移动而将保护片H从晶片W剥离。

公开(公告)号：US07140951B2

公开(公告)日：2006-11-28

申请号：US10385505

申请日：2003-03-12

申请人： Tetsuya Kurosawa

发明人： Tetsuya Kurosawa

IPC分类号： H01L21/46

CPC分类号： H01L21/6835 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68354

摘要： An apparatus for manufacturing a semiconductor device includes a first affixing mechanism, cutting mechanism, a second affixing mechanism and peeling mechanism. The first affixing mechanism affixes a first holding member to a rear surface of a semiconductor wafer which is opposite to an element forming surface thereof. The cutting mechanism cuts and discretely divides the semiconductor wafer. The second affixing mechanism affixes a second holding member to the element forming surface side of the semiconductor wafer while the first holding member is expanded to widen gaps of semiconductor elements of the discretely divided semiconductor wafer. The peeling mechanism peels the first holding member.

摘要翻译： 一种半导体器件的制造装置，包括第一固定机构，切断机构，第二固定机构和剥离机构。 第一固定机构将第一保持构件固定到与其元件形成表面相对的半导体晶片的后表面。 切割机构切割并离散地划分半导体晶片。 第二固定机构将第二保持构件固定到半导体晶片的元件形成表面侧，同时第一保持构件被扩展以加宽离散分割的半导体晶片的半导体元件的间隙。 剥离机构剥离第一保持构件。

公开(公告)号：US07060593B2

公开(公告)日：2006-06-13

申请号：US10254982

申请日：2002-09-26

申请人： Tetsuya Kurosawa ,  Shinya Takyu

发明人： Tetsuya Kurosawa ,  Shinya Takyu

IPC分类号： H01L21/46 ,  H01L21/50

CPC分类号： H01L21/6835 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/6839 ,  Y10T29/41 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/1944

摘要： An adhesive tape peeling mechanism has an adhering section and a porous member. The adhering section adheres to a segmented semiconductor wafer bonded to adhesive tape. The porous member is provided on the surface adhering to the semiconductor wafer of the adhering section. The porous member is divided into at least two adhering areas in the direction in which the adhesive tape is peeled. The porous member adheres to the semiconductor wafer by suction and fixes the wafer in place.

公开(公告)号：US06933606B2

公开(公告)日：2005-08-23

申请号：US10685412

申请日：2003-10-16

申请人： Tetsuya Kurosawa

发明人： Tetsuya Kurosawa

IPC分类号： B24B19/02 ,  H01L21/02 ,  H01L21/301 ,  H01L21/304 ,  H01L21/44 ,  H01L21/68 ,  H01L21/78 ,  H01L23/00 ,  H01L23/04 ,  H01L29/04 ,  H01L29/06

CPC分类号： H01L21/6835 ,  H01L21/304 ,  H01L21/78 ,  H01L23/562 ,  H01L29/0657 ,  H01L2221/6834 ,  H01L2924/0002 ,  H01L2924/3511 ,  H01L2924/00

摘要： A semiconductor element is formed in the major surface of a semiconductor chip. Curved surfaces having a radius of curvature of 0.5 to 50 μm are formed at at least some of edges where the side surfaces and backside surface of the semiconductor chip cross.

公开(公告)号：US20050016678A1

公开(公告)日：2005-01-27

申请号：US10665206

申请日：2003-09-22

申请人： Tetsuya Kurosawa

发明人： Tetsuya Kurosawa

IPC分类号： H01L21/52 ,  H01L21/00 ,  H01L21/301 ,  H01L21/58 ,  H01L21/68 ,  B32B31/00 ,  B32B1/00

CPC分类号： H01L21/6835 ,  H01L21/67132 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/274 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/743 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  Y10T156/1075 ,  Y10T156/1179 ,  Y10T156/1978 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512

摘要： A manufacturing apparatus of a semiconductor device is provided with a pickup section for picking up a sectioned semiconductor element from a semiconductor wafer, a film sticking section for sticking an element adhesive film sectioned according to a shape of the element to the back surface of the semiconductor element, and an element adhesion section for adhering the semiconductor element to a semiconductor device forming base material. Chippings, which are caused when a thinned semiconductor wafer is diced, are suppressed so to reduce a failure incidence rate of the semiconductor device.

摘要翻译： 半导体装置的制造装置具备：从半导体晶片拾取切断的半导体元件的拾取部，将根据该元件的形状分割的元件用粘合膜粘贴到半导体的背面的膜贴附部 元件和用于将半导体元件粘合到形成基材的半导体器件的元件粘附部分。 当减薄半导体晶片被切割时引起的断屑被抑制，从而降低半导体器件的故障发生率。

公开(公告)号：US06756562B1

公开(公告)日：2004-06-29

申请号：US10390900

申请日：2003-03-19

申请人： Tetsuya Kurosawa ,  Shinya Takyu ,  Ninao Sato

发明人： Tetsuya Kurosawa ,  Shinya Takyu ,  Ninao Sato

IPC分类号： B23K2638

CPC分类号： H01L21/6835 ,  B23K26/40 ,  B23K26/703 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  H01L21/67092 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834

摘要： A semiconductor device manufacturing apparatus includes a damage forming equipment, dividing equipment and removing equipment. The damage forming equipment forms damage layers used as starting points to divide a semiconductor wafer into discrete semiconductor chips on a rear surface side of the semiconductor wafer which is opposite to an element forming surface. The dividing equipment divides the semiconductor wafer into discrete semiconductor chips with the damage layers used as the starting points. The removing equipment removes a rear surface portion of the semiconductor wafer to at least a depth where the damage layers are no more present.

摘要翻译： 半导体器件制造装置包括损伤形成设备，分割设备和去除设备。 损伤形成设备形成用作起点的损伤层，以将半导体晶片分成与元件形成表面相对的半导体晶片的背面侧上的分立半导体芯片。 分割设备将半导体晶片分为分立半导体芯片，其中损伤层用作起点。 去除设备将半导体晶片的后表面部分移至至少不存在损伤层的深度。