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    Inductive filters and methods of fabrication thereof
    42.
    发明授权
    Inductive filters and methods of fabrication thereof 有权
    电感式滤波器及其制造方法

    公开(公告)号：US07111271B2

    公开(公告)日：2006-09-19

    申请号：US10281752

    申请日：2002-10-28

    Applicant: Yuan-Liang Li ,  David G. Figueroa

    Inventor： Yuan-Liang Li ,  David G. Figueroa

    IPC: G06F17/50 ,  H03K17/693

    CPC classification number: H01F17/0033 ,  H01F41/041 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15312 ,  H05K1/115 ,  H05K1/165 ,  H05K3/06 ,  H05K3/42 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/1006 ,  H05K2203/0723 ,  H01L2224/0401

    Abstract: A series of plated through hole (PTH) vias are interconnected by traces that alternate between a top surface and a bottom surface of a dielectric board. The PTH vias in the series can be positioned to create a collinear inductive filter, a coil-type inductive filter, or a transformer. Multiple, electrically isolated series of interconnected PTH vias can be used as a multi-phase inductive filter in one embodiment. In another embodiment, multiple series of interconnected PTH vias are electrically connected by a linking portion of conductive material, resulting in a low-resistance inductive filter. Ferromagnetic material patterns can be embedded in the dielectric board to enhance the inductive characteristics of the interconnected via structures. In one embodiment, a closed-end pattern is provided with two series of interconnected vias coiling around the pattern, resulting in an embedded transformer structure. A method of producing an interconnected series of PTH vias includes providing a dielectric board having a series of holes. In some embodiments, the board includes an embedded ferromagnetic material pattern. The holes and the top and bottom surface of the dielectric board have a conductive material thereupon. Portions of the conductive material are selectively removed, resulting in the embedded inductive filter and/or transformer structure.

    Abstract translation: 一系列电镀通孔（PTH）通孔在电介质板的顶表面和底表面之间交替的迹线互连。 该系列中的PTH通孔可以定位成产生共线感应滤波器，线圈型感应滤波器或变压器。 在一个实施例中，多个电隔离的互连PTH通孔系列可用作多相感应滤波器。 在另一个实施例中，多个互连的PTH通孔系列通过导电材料的连接部分电连接，导致低电阻感应滤波器。 铁磁材料图案可以嵌入电介质板中以增强互连通孔结构的感应特性。 在一个实施例中，闭合端图案具有围绕图案卷绕的两系列互连的通孔，从而形成嵌入式变压器结构。 制造互连的PTH通孔系列的方法包括提供具有一系列孔的电介质板。 在一些实施例中，板包括嵌入的铁磁材料图案。 电介质板的孔和顶表面和底表面具有导电材料。 选择性地去除导电材料的部分，从而产生嵌入的感应滤波器和/或变压器结构。

    Microwave circuit
    43.
    发明授权
    Microwave circuit 失效
    微波电路

    公开(公告)号：US07064632B2

    公开(公告)日：2006-06-20

    申请号：US10988152

    申请日：2004-11-12

    Applicant: Christopher M. Buck ,  Keith R. Williams

    Inventor： Christopher M. Buck ,  Keith R. Williams

    IPC: H01P1/203

    CPC classification number: H05K1/141 ,  H01L23/66 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01P1/047 ,  H01P1/20363 ,  H01P5/107 ,  H05K1/024 ,  H05K1/0306 ,  H05K1/16 ,  H05K3/328 ,  H05K3/368 ,  H05K3/4688 ,  H05K2201/09972 ,  H05K2201/1006 ,  H05K2203/049 ,  H01L2924/00014

    Abstract: A microwave circuit comprises a printed circuit board (PCB) on which is fabricated a circuit including passive components such as filters (40) formed by printed conductive patterns. In order to enhance the performance of the circuit, selected components such as filters are made with a greater precision on substrate material (41), such as alumina, having a higher dielectric constant than that of the printed circuit board material. The finished component is mounted on the printed circuit board and the conductive pattern is connected by wire bonds (48, 50) to microstrip tracks (51) of the printed circuit board.

    Abstract translation: 微波电路包括印刷电路板（PCB），其上制造了包括诸如由印刷导电图案形成的滤光器（40）的无源部件的电路。 为了提高电路的性能，在诸如氧化铝的基板材料（41）具有比印刷电路板材料更高的介电常数的基板材料（41）上更精确地制造诸如滤光片的选定部件。 完成的部件安装在印刷电路板上，并且导电图案通过引线接合（48,50）连接到印刷电路板的微带轨道（51）。

    System and method for thermal management in a device
    44.
    发明申请
    System and method for thermal management in a device 审中-公开
    设备中热管理的系统和方法

    公开(公告)号：US20060118539A1

    公开(公告)日：2006-06-08

    申请号：US11002499

    申请日：2004-12-02

    Applicant: Gustavo Leizerovich

    Inventor： Gustavo Leizerovich

    IPC: H05B3/00 ,  H05B1/00 ,  H05B11/00

    CPC classification number: H04B1/036 ,  H05K1/0201 ,  H05K1/181 ,  H05K2201/10037 ,  H05K2201/1006 ,  H05K2201/10151 ,  H05K2203/165

    Abstract: A system and method for reducing the size of a communication device in which a temperature-sensitive, non-heat generating component (302) is placed in close proximity to a heat generating component (304). The temperature of the non-heat generating component (302) is sensed to provide a sensed temperature. The operation of the heat generating component (304) is altered to avoid an over temperature condition of the non-heat generating component (302) based upon the sensed temperature.

    Abstract translation: 一种用于减小通信设备的尺寸的系统和方法，其中将温度敏感的非发热组件（302）放置在靠近发热组件（304）处。 感测非发热组件（302）的温度以提供感测的温度。 改变发热组件（304）的操作以避免基于感测温度的非发热组件（302）的过热状态。

    Component carrier
    45.
    发明授权
    Component carrier 失效
    分量载体

    公开(公告)号：US06995983B1

    公开(公告)日：2006-02-07

    申请号：US09647648

    申请日：1999-04-06

    Applicant: Anthony A. Anthony ,  William M. Anthony

    Inventor： Anthony A. Anthony ,  William M. Anthony

    IPC: H05K7/10

    CPC classification number: H05K1/0243 ,  H01R12/724 ,  H01R13/658 ,  H01R13/7197 ,  H05K1/141 ,  H05K3/3442 ,  H05K3/3447 ,  H05K2201/0715 ,  H05K2201/09481 ,  H05K2201/0979 ,  H05K2201/1006

    Abstract: The present invention is a component carrier comprising a plate of insulating material having a plurality of apertures for accepting the leads of a thru-hole differential and common mode filter. Another embodiment comprises a surface mount component carrier comprised of a disk of insulating material having a plurality of apertures. The same concept for the above described carrier is also incorporated into several alternate embodiments, either independently or embedded within electronic connectors, or configured for use with electric motors. The overall configuration and electrical characteristics of the concepts underlying the present inventions are also described as an electrical circuit conditioning assembly which encompasses the combination of differential and common mode filters and component carriers optimized for such filters. The various embodiments of component carriers provide increased physical support and protection to differential and common mode filters and substantially improve the electrical characteristics of the filters due to the increased shielding provided by the carriers.

    Abstract translation: 本发明是一种组件载体，其包括具有多个孔的绝缘材料板，用于接受通孔差分和共模滤波器的引线。 另一个实施例包括由具有多个孔的绝缘材料盘组成的表面安装部件载体。 对于上述载体的相同概念也被并入几个替代实施例中，独立地或嵌入在电子连接器内，或被配置为与电动马达一起使用。 本发明基础概念的整体结构和电气特性也被描述为电路调理组件，其包含对这种滤波器优化的差模和共模滤波器和分量载波的组合。 分量载波的各种实施例为差分和共模滤波器提供了增加的物理支持和保护，并且由于载波提供的增加的屏蔽而实质上改善了滤波器的电特性。

    Microwave circuit
    48.
    发明授权
    Microwave circuit 失效
    微波电路

    公开(公告)号：US06833775B2

    公开(公告)日：2004-12-21

    申请号：US10114498

    申请日：2002-04-02

    Applicant: Christopher M. Buck ,  Keith R. Williams

    Inventor： Christopher M. Buck ,  Keith R. Williams

    IPC: H01P1203

    CPC classification number: H05K1/141 ,  H01L23/66 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01P1/047 ,  H01P1/20363 ,  H01P5/107 ,  H05K1/024 ,  H05K1/0306 ,  H05K1/16 ,  H05K3/328 ,  H05K3/368 ,  H05K3/4688 ,  H05K2201/09972 ,  H05K2201/1006 ,  H05K2203/049 ,  H01L2924/00014

    Abstract: A microwave circuit comprises a printed circuit board (PCB) on which is fabricated a circuit including passive components such as filters (40) formed by printed conductive patterns. In order to enhance the performance of the circuit, selected components such as filters are made with a greater precision on substrate material (41), such as alumina, having a higher dielectric constant than that of the printed circuit board material. The finished component is mounted on the printed circuit board and the conductive pattern is connected by wire bonds (48, 50) to microstrip tracks (51) of the printed circuit board.

    Abstract translation: 微波电路包括印刷电路板（PCB），其上制造了包括诸如由印刷导电图案形成的滤光器（40）的无源部件的电路。 为了提高电路的性能，在诸如氧化铝的基板材料（41）具有比印刷电路板材料更高的介电常数的基板材料（41）上更精确地制造诸如滤光片的选定部件。 完成的部件安装在印刷电路板上，并且导电图案通过引线接合（48,50）连接到印刷电路板的微带轨道（51）。

    Filter circuit apparatus and manufacturing method thereof
    49.
    发明申请
    Filter circuit apparatus and manufacturing method thereof 有权
    滤波电路装置及其制造方法

    公开(公告)号：US20040085164A1

    公开(公告)日：2004-05-06

    申请号：US10468874

    申请日：2003-08-22

    Inventor： Takayuki Hirabayashi

    IPC: H01P001/203

    CPC classification number: H01P1/20345 ,  H01L2224/16225 ,  H01L2924/15184 ,  H01L2924/16152 ,  H01P1/203 ,  H05K1/16 ,  H05K3/02 ,  H05K3/4644 ,  H05K2201/0352 ,  H05K2201/09236 ,  H05K2201/1006

    Abstract: This invention is a filter circuit having a filter element. A filter element (4) is a parallel resonator circuit including a pair of first resonator lines (19a) (19b) formed by a thick film forming technique and a pair of second resonator lines (20a) (20b). As the thickness of the pair of second resonator lines (20a) (20b) is significantly reduced, the impedance ratio between the pair of second resonator lines (20a) (20b) and the pair of first resonator lines (19a) (19b) is increased. Therefore, the length of these pairs of resonator lines (19a) (19b) (20a) (20b) is reduced and miniaturization of the filter element is realized.

    Abstract translation: 本发明是一种具有滤光元件的滤光电路。 滤波器元件（4）是包括通过厚膜形成技术形成的一对第一谐振器线（19b）和一对第二谐振器线（20a）（20b）的并联谐振器电路。 随着一对第二谐振器线路（20a）（20b）的厚度显着减小，一对第二谐振器线路（20a）（20b）和一对第一谐振器线路（19b）之间的阻抗比为 增加。 因此，这些谐振器线对（19a）（19b）（20a）（20b）的长度被减小并且实现了滤波器元件的小型化。

    Layout of wireless communication circuit on a printed circuit board
    50.
    发明申请
    Layout of wireless communication circuit on a printed circuit board 失效
    无线通信电路布局在印刷电路板上

    公开(公告)号：US20040018814A1

    公开(公告)日：2004-01-29

    申请号：US10064535

    申请日：2002-07-25

    Inventor： Tsung-Liang Lin ,  Tsung-Lu Tsai ,  Jan-Kwo Leeng

    IPC: H04B001/38

    CPC classification number: H04B1/38 ,  H05K1/0237 ,  H05K1/16 ,  H05K1/165 ,  H05K1/18 ,  H05K2201/1006

    Abstract: A layout of a wireless communication circuit on a printed circuit board (PCB), which is a rectangular board wherein a first side is a Y-axis and a second side is an X-axis. The layout has a first antenna located at a corner between the first side and the second side. An antenna switch and a first filter are located at middle y-coordinate and a X-coordinate. A RF integrated circuit (RFIC) is located after the first filter. A first regulator is located near the second side and higher than the RFIC. A media access control (MAC) is located at about a middle y-coordinate and higher than the first regulator. An oscillator is located at a corner between the second side and the third side. A second regulator is located near the fourth side and above the first regulator. A power amplifier is located near the fourth side above the RFIC. A second filter and a transmitting/receiving (T/R) switch are located before the power amplifier. A second antenna is located at a corner between the first side and the fourth side.

    Abstract translation: 作为矩形板的印刷电路板（PCB）上的无线通信电路的布局，其中第一侧是Y轴，第二面是X轴。 该布局具有位于第一侧和第二侧之间的拐角处的第一天线。 天线开关和第一滤波器位于中间的y坐标和X坐标。 RF集成电路（RFIC）位于第一个滤波器之后。 第一个调节器位于第二侧附近，高于RFIC。 媒体访问控制（MAC）位于大约中间的y坐标并且高于第一调节器。 振荡器位于第二侧和第三侧之间的拐角处。 第二个调节器位于第四侧和第一调节器之上。 功率放大器靠近RFIC上方的第四侧。 第二滤波器和发射/接收（T / R）开关位于功率放大器之前。 第二天线位于第一侧和第四侧之间的角部。

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