公开(公告)号：US5446317A

公开(公告)日：1995-08-29

申请号：US26809

申请日：1993-03-05

Applicant: Mitsutaka Sato ,  Masanori Yoshimoto

Inventor： Mitsutaka Sato ,  Masanori Yoshimoto

IPC: H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/10 ,  H05K1/18 ,  H05K3/30 ,  H01L23/48 ,  H05K7/00 ,  H01L29/44 ,  H01L29/52

CPC classification number: H01L23/3107 ,  H01L23/49555 ,  H01L25/105 ,  H05K3/301 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01079 ,  H05K1/181 ,  H05K2201/10454 ,  H05K2201/10606 ,  H05K2201/10696

Abstract: A semiconductor package of a single in-line type including a semiconductor chip, a package body for accommodating the semiconductor chip and a plurality of leads held by the package body to extend substantially perpendicularly to a bottom edge surface of the package body. The package body carries a cutout part at a predetermined position of a side edge that surrounds the package body such that the cutout part is adapted for engagement with a support leg for supporting the package body substantially upright on a substrate.

Abstract translation: 包括半导体芯片，用于容纳半导体芯片的封装主体和由封装主体保持的多个引线的单个在线型半导体封装，其基本上垂直于封装体的底部边缘表面延伸。 包装体在围绕包装主体的侧边缘的预定位置处携带切口部分，使得切口部分适于与用于将包装体基本上直立支撑在基板上的支撑腿接合。

公开(公告)号：US5367192A

公开(公告)日：1994-11-22

申请号：US165043

申请日：1993-12-06

Applicant: Angelo Massironi

Inventor： Angelo Massironi

IPC: H01L23/495 ,  H05K3/30 ,  H05K3/34 ,  H01L23/48 ,  H05K1/08

CPC classification number: H01L23/49548 ,  H05K3/308 ,  H01L2924/0002 ,  H05K2201/09709 ,  H05K2201/10696 ,  H05K2201/10757 ,  H05K2201/10871 ,  H05K3/3447

Abstract: This package for integrated devices, to be fixed on supporting plates, in particular on printed circuits, comprises contact pins to be inserted in holes of the supporting plates and to be soldered thereto. To prevent overturning of the package, which may lead to short circuits among the components, at least some of the contact pins are provided with protruding portions defining abutments cooperating with the supporting plate to limit the inclination of the package with respect to the plate.

Abstract translation: 用于固定在支撑板上，特别是印刷电路上的集成器件的封装包括插入支撑板的孔中并被焊接到其上的接触针。 为了防止包装翻倒，这可能导致部件之间的短路，至少一些接触销设置有突出部分，突出部分限定与支撑板配合的支座，以限制包装相对于板的倾斜度。

公开(公告)号：US3524108A

公开(公告)日：1970-08-11

申请号：US3524108D

申请日：1967-12-26

Applicant: CTS CORP

Inventor： ENGLISH JACK A

IPC: H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K7/06 ,  H05K7/12

CPC classification number: H05K3/306 ,  H05K3/308 ,  H05K3/32 ,  H05K3/3447 ,  H05K2201/09827 ,  H05K2201/10454 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10696 ,  H05K2201/10757 ,  H05K2201/10863 ,  H05K2201/10878 ,  H05K2201/2036

公开(公告)号：US20080266826A1

公开(公告)日：2008-10-30

申请号：US11937358

申请日：2007-11-08

Applicant: ZHEN HOU ,  CHING-LIANG WANG

Inventor： ZHEN HOU ,  CHING-LIANG WANG

IPC: H05K7/00 ,  H01R12/00

CPC classification number: H01R43/0256 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/09463 ,  H05K2201/09709 ,  H05K2201/10689 ,  H05K2201/10696

Abstract: An exemplary assemblable substrate for an SIP includes a substrate and a group of welding pads. The substrate defines a receiving portion therein for receiving a line of pins of the SIP. The group of welding pads is formed on the substrate for electrically coupling the line of pins to the substrate; the group of welding pads being distributed around the receiving portion, two welding pads corresponding to two adjacent pins in the same line being distributed on opposing sides of the receiving portion.

Abstract translation: 用于SIP的示例性可组装衬底包括衬底和一组焊垫。 衬底限定其中的接收部分，用于接收SIP的引脚线。 一组焊垫形成在基板上，用于将引脚线电耦合到基板; 所述一组焊垫分布在接收部分周围，对应于同一直线中的两个相邻销的两个焊垫分布在接收部分的相对侧上。

公开(公告)号：US20030196323A1

公开(公告)日：2003-10-23

申请号：US10427518

申请日：2003-05-01

Inventor： Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

IPC: H05K003/00 ,  H01R043/00

CPC classification number: H05K3/301 ,  H01L25/105 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K2201/10454 ,  H05K2201/10696 ,  Y10S83/942 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

Abstract: A vertically mountable semiconductor device including a plurality of stub contacts extending perpendicularly from a bottom edge thereof. The stub contacts may be formed by trimming the leads of an existing vertical surface mount package. A complementary alignment device includes a receptacle for receiving the vertically mountable semiconductor device. The alignment device is attachable to a carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, a contact element applies a downward force to the vertically mountable semiconductor device to establish and maintain an electrical connection between the vertically mountable semiconductor device and the carrier substrate.

Abstract translation: 一种可垂直安装的半导体器件，包括从其底部边缘垂直延伸的多个短截线触头。 短截线触点可以通过修整现有的垂直表面安装封装的引线来形成。 互补对准装置包括用于接收垂直安装的半导体器件的插座。 对准装置可附接到载体基板。 在将对准装置附接到载体基板并将可垂直安装的半导体装置插入到插座中时，接触元件向垂直安装的半导体器件施加向下的力，以建立并保持可垂直安装的半导体器件与 载体衬底。

公开(公告)号：US06634098B1

公开(公告)日：2003-10-21

申请号：US09358171

申请日：1999-07-20

Applicant: Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

Inventor： Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

IPC: H05K330

CPC classification number: H05K3/301 ,  H01L25/105 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K2201/10454 ,  H05K2201/10696 ,  Y10S83/942 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

Abstract: A vertically mountable semiconductor device including a plurality of stub contacts extending perpendicularly from a bottom edge thereof. A complementary alignment device includes a receptacle for receiving the vertically mountable semiconductor device. The alignment device is attachable to a carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, a contact element applies a downward force to the vertically mountable semiconductor device to establish and maintain an electrical connection between the vertically mountable semiconductor device and the carrier substrate.

Abstract translation: 一种可垂直安装的半导体器件，包括从其底部边缘垂直延伸的多个短截线触头。 互补对准装置包括用于接收垂直安装的半导体器件的插座。 对准装置可附接到载体基板。 在将对准装置附接到载体基板并将可垂直安装的半导体装置插入到插座中时，接触元件向垂直安装的半导体器件施加向下的力，以建立并保持可垂直安装的半导体器件与 载体衬底。

公开(公告)号：US06577503B2

公开(公告)日：2003-06-10

申请号：US10191701

申请日：2002-07-08

Applicant: Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

Inventor： Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

IPC: H05K720

CPC classification number: H05K3/303 ,  H01L23/3675 ,  H01L23/4334 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10659 ,  H05K2201/10696 ,  Y02P70/613 ,  H01L2924/00

Abstract: A high density vertical surface mount package and thermal carrier therefor including a heat sink.

Abstract translation: 一种高密度垂直表面贴装封装及其热载体，包括散热片。

公开(公告)号：US06531764B2

公开(公告)日：2003-03-11

申请号：US09939849

申请日：2001-08-27

Applicant: Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

Inventor： Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

IPC: H01L23495

CPC classification number: H05K3/301 ,  H01L25/105 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K2201/10454 ,  H05K2201/10696 ,  Y10S83/942 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

Abstract: A vertically mountable semiconductor device including a plurality of stub contacts extending perpendicular from a bottom edge thereof. A complementary alignment device includes a receptacle for receiving the vertically mountable semiconductor device. The alignment device is attachable to a carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, a contact element applies a downward force to the vertically mountable semiconductor device to establish and maintain an electrical connection between the vertically mountable semiconductor device and the carrier substrate.

Abstract translation: 一种可垂直安装的半导体器件，包括从其底部边缘垂直延伸的多个短截线触头。 互补对准装置包括用于接收垂直安装的半导体器件的插座。 对准装置可附接到载体基板。 在将对准装置附接到载体基板并将可垂直安装的半导体装置插入到插座中时，接触元件向垂直安装的半导体器件施加向下的力，以建立并保持可垂直安装的半导体器件与 载体衬底。

公开(公告)号：US06512290B2

公开(公告)日：2003-01-28

申请号：US09873869

申请日：2001-06-04

Applicant: Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

Inventor： Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

IPC: H01L2348

CPC classification number: H05K3/301 ,  H01L25/105 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K2201/10454 ,  H05K2201/10696 ,  Y10S83/942 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

Abstract: A vertically mountable semiconductor device including a plurality of stub contacts extending perpendicularly from a bottom edge thereof. A complementary alignment device includes a receptacle for receiving the vertically mountable semiconductor device. The alignment device is attachable to a carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, a contact element applies a downward force to the vertically mountable semiconductor device to establish and maintain an electrical connection between the vertically mountable semiconductor device and the carrier substrate.

公开(公告)号：US06418023B2

公开(公告)日：2002-07-09

申请号：US09944232

申请日：2001-08-30

Applicant: Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

Inventor： Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

IPC: H05K720

CPC classification number: H05K3/303 ,  H01L23/3675 ,  H01L23/4334 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10659 ,  H05K2201/10696 ,  Y02P70/613 ,  H01L2924/00

Abstract: A high density vertical surface mount package and thermal carrier therefor including a heat sink.

Abstract translation: 一种高密度垂直表面贴装封装及其热载体，包括散热片。