SAFETY FENCE, TRANSFER DEVICE INCLUDING A SAFETY FENCE AND APPARATUS FOR PROCESSING A SUBSTRATE INCLUDING A SAFETY FENCE

    公开(公告)号:US20230203759A1

    公开(公告)日:2023-06-29

    申请号:US18146588

    申请日:2022-12-27

    CPC classification number: E01B26/005 B61B5/02

    Abstract: A transfer device may include a transfer part including transfer rails installed on a ceiling of a manufacturing line for an integrated circuit device and a transfer vehicle running along the transfer rails, and a safety fence disposed adjacent to the transfer part. The safety fence may include a plurality of first horizontal supporting portions disposed in parallel to the transfer rails, a plurality of second horizontal supporting portions connecting the plurality of first horizontal supporting portions to the transfer rails, a plurality of vertical supporting portions extended from the plurality of horizontal supporting portions, respectively, and a plate portion connected to the plurality of vertical supporting portions. The safety fence may be partially foldable and partially unfoldable.

    APPARATUS AND METHOD FOR DIAGNOSING SEMICONDUCTOR EQUIPMENT

    公开(公告)号:US20230196078A1

    公开(公告)日:2023-06-22

    申请号:US17971544

    申请日:2022-10-21

    Inventor: Dong Hyun JUN

    CPC classification number: G06N3/0464 G06N5/045 H01L22/12

    Abstract: The present invention provides an apparatus and method for diagnosing semiconductor equipment for analyzing a determination result and a cause of a defect for a substrate using a deep learning algorithm and explainable AI. The semiconductor equipment diagnosis method comprises acquiring time series data for a parameter related to a substrate treating process of a substrate treating apparatus, generating table information based on the time series data, converting the table information into image information based on data included in the table information, extracting and classifying a feature from the image information, determining whether a substrate treated by the substrate treating apparatus is good or defective based on the feature, and analyzing a cause of a defect of the substrate in response to determining that the substrate is defective.

    SUBSTRATE TREATING APPARATUS AND METHOD THEREOF

    公开(公告)号:US20230191780A1

    公开(公告)日:2023-06-22

    申请号:US18081647

    申请日:2022-12-14

    Abstract: The present disclosure provides substrate processing apparatus and a substrate processing method for composing nozzles having different drop sizes into one or more pack units and performing pixel printing by using nozzles belonging to the thus composed packs. The substrate processing method includes extracting nozzles that have different drop sizes as different sized dropping nozzles, composing extracted nozzles into one or more packs, and performing pixel printing on the substrate with nozzles included in the pack by discharging a substrate treatment solution to a common target location on the substrate.

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