公开(公告)号：US12082022B2

公开(公告)日：2024-09-03

申请号：US17252223

申请日：2019-09-20

Applicant: Intel Corporation

Inventor： Yushu Zhang ,  Guotong Wang ,  Alexei Davydov ,  Gang Xiong ,  Bishwarup Mondal ,  Hong He

IPC: H04W24/10 ,  H04L5/00 ,  H04W72/044 ,  H04W72/1268 ,  H04B7/06

CPC classification number: H04W24/10 ,  H04L5/0048 ,  H04W72/044 ,  H04W72/1268 ,  H04B7/0695

Abstract: Provided herein are apparatus and method for user equipment (UE) panel selection. The disclosure provides an apparatus for a UE, comprising: a radio frequency (RF) interface to receive one or more reference signal resources from a next generation NodeB (gNB); and processor circuitry coupled with the RF interface, the processor circuitry to: determine a beam quality for each of the one or more reference signal resources received at each panel of the UE; and report beam information to the gNB, the beam information to indicate the beam quality of each of the one or more reference signal resources and corresponding panel for receiving each of the one or more reference signal resources. Other embodiments may also be disclosed and claimed.

公开(公告)号：US12081952B2

公开(公告)日：2024-09-03

申请号：US17111130

申请日：2020-12-03

Applicant: Intel Corporation

Inventor： Shantanu D. Kulkarni ,  Jeff Ku ,  Sumod Cherukkate ,  Tongyan Zhai ,  Srikanth Potluri ,  Jordan E. Maslov

IPC: H04R3/04 ,  G10K11/175 ,  H04R1/22 ,  H05K7/20

CPC classification number: H04R3/04 ,  G10K11/175 ,  G10K11/1752 ,  H04R1/222 ,  H05K7/20

Abstract: Systems, apparatus, articles of manufacture, methods are disclosed to reshape fan noise of a fan of an electronic device. An example system includes a microphone to detect a first acoustic signal including fan noise. The example system also includes a processor to: identify a tone in the first acoustic signal; and determine a gain to add to the first acoustic signal to mask the tone. In addition, the example system includes a sound transducer to present a second acoustic signal including the gain.

公开(公告)号：US12081649B2

公开(公告)日：2024-09-03

申请号：US17010577

申请日：2020-09-02

Applicant: Intel Corporation

Inventor： Vinodh Gopal ,  Kirk Yap

IPC: G06F21/64 ,  G06F11/07 ,  G06F11/10 ,  H04L9/06 ,  H04L9/32

CPC classification number: H04L9/0643 ,  G06F11/0772 ,  G06F11/1004 ,  G06F11/1044 ,  H04L9/0637 ,  H04L9/3242

Abstract: An apparatus of an aspect includes an encryption unit to receive unencrypted data. The encryption unit is to encrypt the unencrypted data to generate encrypted data. The apparatus also includes circuitry coupled with the encryption unit. The circuitry is to generate a first checksum for a copy of the unencrypted data, generate a second checksum for a copy of the encrypted data, and combine the first and second checksums to generate a first value.

公开(公告)号：US12081538B2

公开(公告)日：2024-09-03

申请号：US17855648

申请日：2022-06-30

Applicant: Intel Corporation

Inventor： Omer Ben-Shalom ,  Oren Galler ,  Alex Nayshtut

IPC: H04L9/40

CPC classification number: H04L63/083 ,  H04L63/0428 ,  H04L63/18 ,  H04L2463/082

Abstract: The disclosure generally relates to method, system and apparatus for multifactor authentication exchange using out of band communication to authenticate a user while defending against the man in the middle attack. In an exemplary method, the disclosed principles provide a multifactor authentication (MFA) exchange, which includes: receiving an authentication request through in-band communication from a first device associated with a user to authenticate the user, the authentication request including a first authentication factor to identify the user; generating a second authentication factor, the second authentication factor further comprising an authorization token; generating an encryption key to encrypt the authorization token and a redirect Uniform Resource Locator (URL) address; and communicating the second authentication factor, the encryption key and the redirect URL address to a second device associated with the user.

公开(公告)号：US12081293B2

公开(公告)日：2024-09-03

申请号：US17363336

申请日：2021-06-30

Applicant: Intel Corporation

Inventor： Cheng Chen ,  Carlos Cordeiro ,  Claudio Da Silva ,  Solomon Trainin ,  Alexander Maltsev ,  Artyom Lomayev

IPC: H04B7/0452 ,  G06F3/04815 ,  G06T17/10 ,  G06T19/20 ,  H04B7/06 ,  H04B7/08

CPC classification number: H04B7/0452 ,  G06F3/04815 ,  G06T17/10 ,  G06T19/20 ,  H04B7/0695 ,  H04B7/088 ,  G06T2200/04 ,  G06T2219/2004 ,  G06T2219/2021

Abstract: This disclosure describes methods, apparatus, and systems related to media access control (MAC) range extension. A device may cause to append a training field to each of one or more beacon frames. The device may cause to send the one or more beacon frames directionally using a sector sweep to one or more responder devices during a first interval. The device may determine an extended schedule element to be sent to the one or more responder devices, the extended schedule element including one or more directional antenna sectors to be used by the device during a second interval. The device may identify a first frame from a first responder device, during the second interval, wherein the first frame is received on a directional antenna sector of the one or more directional antenna sectors corresponding to an operating sector of the first responder device.

公开(公告)号：US12081276B2

公开(公告)日：2024-09-03

申请号：US17133360

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Meer Nazmus Sakib ,  Peicheng Liao ,  Ranjeet Kumar ,  Duanni Huang ,  Haisheng Rong ,  Harel Frish ,  John Heck ,  Chaoxuan Ma ,  Hao Li ,  Ganesh Balamurugan

IPC: H04B10/61

CPC classification number: H04B10/6165 ,  H04B10/612 ,  H04B10/6164

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to coherent optical receivers, including coherent receivers with integrated all-silicon waveguide photodetectors and tunable local oscillators implemented within CMOS technology. Embodiments are also directed to tunable silicon hybrid lasers with integrated temperature sensors to control wavelength. Embodiments are also directed to post-process phase correction of optical hybrid and nested I/Q modulators. Embodiments are also directed to demultiplexing photodetectors based on multiple microrings. In embodiments, all components may be implements on a silicon substrate. Other embodiments may be described and/or claimed.

公开(公告)号：US12080655B2

公开(公告)日：2024-09-03

申请号：US16368032

申请日：2019-03-28

Applicant: Intel Corporation

Inventor： Gianni Signorini ,  Georg Seidemann ,  Bernd Waidhas

IPC: H01L23/552 ,  H01L21/48 ,  H01L21/78 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838

Abstract: Embodiments disclosed herein include electronic packages with conformal shields and methods of forming such packages. In an embodiment, the electronic package comprises a die having a first surface, a second surface opposite the first surface, and sidewall surfaces. A redistribution layer is over the first surface of the die, and the redistribution layer comprises a first conductive layer. In an embodiment, an under ball metallization (UBM) layer is over the redistribution layer, and a conductive shield is over the sidewall surfaces of the die and the second surface of the die. In an embodiment, the conductive shield is electrically coupled to the UBM layer.

公开(公告)号：US12080648B2

公开(公告)日：2024-09-03

申请号：US17517472

申请日：2021-11-02

Applicant: Intel Corporation

Inventor： Yang Cao ,  Akm Shaestagir Chowdhury ,  Jeff Grunes

IPC: H01L23/532 ,  H01L21/288 ,  H01L21/768

CPC classification number: H01L23/53261 ,  H01L21/288 ,  H01L21/76843 ,  H01L21/76849 ,  H01L21/76877 ,  H01L23/53209 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Conducting alloys comprising cobalt, tungsten, and boron and conducting alloys comprising nickel, tungsten, and boron are described. These alloys can, for example, be used to form metal interconnects, can be used as liner layers for traditional copper or copper alloy interconnects, and can act as capping layers. The cobalt-tungsten and nickel-tungsten alloys can be deposited using electroless processes.

公开(公告)号：US12079628B2

公开(公告)日：2024-09-03

申请号：US17493667

申请日：2021-10-04

Applicant: Intel Corporation

Inventor： William M. Brown ,  Roland Schulz ,  Karthik Raman

IPC: G06F9/30 ,  G06F9/38

CPC classification number: G06F9/30032 ,  G06F9/30018 ,  G06F9/30036 ,  G06F9/30098 ,  G06F9/30145 ,  G06F9/3887

Abstract: An apparatus and method for loop flattening and reduction in a SIMD pipeline including broadcast, move, and reduction instructions. For example, one embodiment of a processor comprises: a decoder to decode a broadcast instruction to generate a decoded broadcast instruction identifying a plurality of operations, the broadcast instruction including an opcode, first and second source operands, and at least one destination operand, the broadcast instruction having a split value associated therewith; a first source register associated with the first source operand to store a first plurality of packed data elements; a second source register associated with the second source operand to store a second plurality of packed data elements; execution circuitry to execute the operations of the decoded broadcast instruction, the execution circuitry to copy a first number of contiguous data elements from the first source register to a first set of contiguous data element locations in a destination register specified by the destination operand, the execution circuitry to further copy a second number of contiguous data elements from the second source register to a second set of contiguous data element locations in the destination register, wherein the execution circuitry is to determine the first number and the second number in accordance with the split value associated with the broadcast instruction.

公开(公告)号：US12079343B2

公开(公告)日：2024-09-03

申请号：US18196842

申请日：2023-05-12

Applicant: Intel Corporation

Inventor： Ernesto Martinez

IPC: G06F21/57 ,  B64C39/02 ,  B64U30/20 ,  G08G5/00

CPC classification number: G06F21/572 ,  B64C39/024 ,  G08G5/003 ,  G08G5/0034 ,  G08G5/0039 ,  G08G5/006 ,  G08G5/0069 ,  B64U30/20 ,  B64U2201/10

Abstract: Various systems and methods for operating a drone are described herein. A system for operating a drone includes a trusted execution environment (TEE) circuit to: store a firmware of the drone; and determine whether the firmware is valid; and a processor subsystem to: access a flight plan authorization when the firmware is determined to be valid; and navigate the drone according to the flight path authorization.