Semiconductor laser
    51.
    发明授权

    公开(公告)号:US12027823B2

    公开(公告)日:2024-07-02

    申请号:US17449560

    申请日:2021-09-30

    摘要: A semiconductor laser includes: a multi-quantum well layer in a mesa structure; a buried layer comprising a semi-insulating semiconductor, the buried layer being in contact with each of both sides of the mesa structure; a first cladding layer with a first conductivity type, the first cladding layer having a lower refractive index than the multi-quantum well layer; a high refractive index layer configured to not absorb light oscillating in the multi-quantum well layer, the high refractive index layer having a higher refractive index than the first cladding layer; a diffraction grating layer at least partially constituting a diffraction grating capable of diffracting the light oscillating in the multi-quantum well layer, the diffraction grating layer not contacting the high refractive index layer; a substrate with the first conductivity type; and a second cladding layer with a second conductivity type above the multi-quantum well layer.

    Optical semiconductor device
    52.
    发明授权

    公开(公告)号:US12027822B2

    公开(公告)日:2024-07-02

    申请号:US17304526

    申请日:2021-06-22

    摘要: To provide an optical semiconductor device having excellent long-term reliability, the optical semiconductor device includes: a substrate; a mesa structure provided on the substrate; a semiconductor burial layer provided in contact with two sides of the mesa structure; and an electrode containing Au, which is provided above the semiconductor burial layer. The mesa structure includes a first conductivity type semiconductor layer, a multiple-quantum well layer, and a second conductivity type semiconductor layer, which are stacked in the stated order from a substrate side. The semiconductor burial layer includes a first semi-insulating InP layer provided in contact with side portions of the mesa structure, a first anti-diffusion layer provided in contact with the first semi-insulating InP layer, and a second semi-insulating InP layer provided on the first anti-diffusion layer. The first anti-diffusion layer has an Au diffusion constant that is smaller than that of the first semi-insulating InP layer.

    SEMICONDUCTOR OPTICAL DEVICE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20240072513A1

    公开(公告)日:2024-02-29

    申请号:US18501199

    申请日:2023-11-03

    IPC分类号: H01S5/042 H01S5/028 H01S5/22

    摘要: A semiconductor optical device may include a semiconductor substrate; a compound semiconductor layer on the semiconductor substrate; an additional insulating film on the pedestal portion of the compound semiconductor layer, the additional insulating film having an upper surface and a side surface at an inner obtuse angle between them; a passivation film covering the compound semiconductor layer and the additional insulating film except at least part of the mesa portion, the passivation film having a protrusion raised by overlapping with the additional insulating film; a mesa electrode on the at least part of the mesa portion; a pad electrode on the passivation film within the protrusion; and an extraction electrode on the passivation film, the extraction electrode being continuous within and outside the protrusion, the extraction electrode connecting the pad electrode and the mesa electrode, the extraction electrode being narrower in width than the pad electrode.

    SEMICONDUCTOR LIGHT-RECEIVING ELEMENT

    公开(公告)号:US20230072390A1

    公开(公告)日:2023-03-09

    申请号:US18047064

    申请日:2022-10-17

    IPC分类号: H01L31/11 H01L31/103

    摘要: A semiconductor light-receiving element, includes: a semiconductor substrate; a high-concentration layer of a first conductivity type formed on the semiconductor substrate; a low-concentration layer of the first conductivity type formed on the high-concentration layer of the first conductivity type and in contact with the high-concentration layer of the first conductivity type; a low-concentration layer of a second conductivity type configured to form a PN junction interface together with the low-concentration layer of the first conductivity type; and a high-concentration layer of the second conductivity type formed on the low-concentration layer of the second conductivity type and in contact with the low-concentration layer of the second conductivity type. The low-concentration layers have a carrier concentration of less than 1×1016/cm3. The high-concentration layers have a carrier concentration of 1×1017/cm3 or more. At least one of the low-concentration layers includes an absorption layer with a band gap that absorbs incident light.

    Heater-integrated ridge type optical semiconductor optical device

    公开(公告)号:US11563302B2

    公开(公告)日:2023-01-24

    申请号:US17110195

    申请日:2020-12-02

    IPC分类号: H01S5/024 H01S5/22 H01S5/042

    摘要: A ridge type semiconductor optical device includes a first conductivity type semiconductor layer including at least a first stripe section; an active layer including at least an active stripe section on the first stripe section; a second conductivity type semiconductor layer including at least a second stripe section on the active stripe section; a ridge electrode on the second stripe section; an insulation film on an end face of each of the first stripe section, the active stripe section, and the second stripe section; and a film heater on the insulation film, the film heater overlapping with the end face of at least the first stripe section.

    Semiconductor optical amplifier integrated laser

    公开(公告)号:US11552448B2

    公开(公告)日:2023-01-10

    申请号:US16901872

    申请日:2020-06-15

    摘要: A semiconductor optical amplifier integrated laser includes a semiconductor laser oscillator portion that oscillates laser light having a wavelength included in a gain band and a semiconductor optical amplifier portion that amplifies laser light output from the semiconductor laser oscillator portion. The semiconductor laser oscillator portion and the semiconductor optical amplifier portion have one common p-i-n structure, the common p-i-n structure includes an active layer, a cladding layer provided apart from the active layer, and a common functional layer formed in the cladding layer, and the common functional layer includes a first portion that reflects light having a wavelength within the gain band in the semiconductor laser oscillator portion and a second portion that transmits light having a wavelength within the gain band in the semiconductor optical amplifier portion.

    SEMICONDUCTOR LIGHT-RECEIVING ELEMENT

    公开(公告)号:US20220238745A1

    公开(公告)日:2022-07-28

    申请号:US17362316

    申请日:2021-06-29

    IPC分类号: H01L31/11 H01L31/103

    摘要: A semiconductor light-receiving element, includes: a semiconductor substrate; a high-concentration layer of a first conductivity type formed on the semiconductor substrate; a low-concentration layer of the first conductivity type formed on the high-concentration layer of the first conductivity type and in contact with the high-concentration layer of the first conductivity type; a low-concentration layer of a second conductivity type configured to form a PN junction interface together with the low-concentration layer of the first conductivity type; and a high-concentration layer of the second conductivity type formed on the low-concentration layer of the second conductivity type and in contact with the low-concentration layer of the second conductivity type. The low-concentration layers have a carrier concentration of less than 1×1016/cm3. The high-concentration layers have a carrier concentration of 1×1017/cm3 or more. At least one of the low-concentration layers includes an absorption layer with a band gap that absorbs incident light.

    Optical subassembly and optical module

    公开(公告)号:US11360279B2

    公开(公告)日:2022-06-14

    申请号:US16713623

    申请日:2019-12-13

    IPC分类号: G02B6/42

    摘要: An optical subassembly includes an eyelet including a first through-hole penetrating from a first surface through a second surface; a first lead terminal, which is to be inserted into the first through-hole, and is configured to transmit an electric signal; a dielectric material, which is filled in a space between the first through-hole and the first lead terminal; a device mounting substrate, on which an optical device is to be mounted, and which includes a first conductor pattern configured to transmit the electric signal to the optical device; a metal block having mounted thereon the device mounting substrate; a temperature regulator placed between the metal block and the eyelet; a relay substrate including a second conductor pattern, which is configured to transmit the electric signal to the optical device; a seat, which protrudes from the first surface in a direction extended from the first through-hole, and has a third surface mounting the relay substrate; and a spacer interposed between the third surface and the relay substrate to establish conduction between a rear surface of the relay substrate and the seat.